1. Thaum ci loj-loj PCBs, siv cov kab rov tav stacking. Nws raug pom zoo tias qhov siab tshaj plaws ntawm ib pawg yuav tsum tsis pub tshaj 30 daim. Lub qhov cub yuav tsum tau qhib tsis pub dhau 10 feeb tom qab ci kom tshem tawm cov PCB thiab muab tso rau nws kom txias. Tom qab ci, nws yuav tsum tau nias. Anti-khoov fixtures. Loj-loj PCBs tsis pom zoo rau ntsug ci, vim lawv yooj yim khoov.

2. Thaum ci PCBs me me thiab nruab nrab, koj tuaj yeem siv lub tiaj tiaj. Qhov siab tshaj plaws ntawm ib pawg yog pom zoo kom tsis pub tshaj 40 daim, los yog nws tuaj yeem ua ncaj, thiab tus lej tsis txwv. Koj yuav tsum qhib lub qhov cub thiab tshem tawm PCB li ntawm 10 feeb tom qab ci. Cia nws txias, thiab nias lub bending jig tom qab ci.

Kev ceev faj thaum PCB ci

1. Qhov kub ntawm qhov ci yuav tsum tsis txhob siab tshaj qhov Tg point ntawm PCB, thiab qhov kev xav tau dav dav yuav tsum tsis pub tshaj 125 ° C. Thaum ntxov, Tg taw tes ntawm qee cov PCBs uas muaj hlau lead yog qhov qis, thiab tam sim no Tg ntawm PCBs tsis muaj txhuas feem ntau yog siab dua 150 ° C.

2. Lub ci PCB yuav tsum tau siv kom sai li sai tau. Yog tias nws tsis siv, nws yuav tsum tau ntim cov tshuab nqus tsev sai li sai tau. Yog tias raug rau lub rooj cob qhia ntev dhau lawm, nws yuav tsum tau ci dua.

3. Nco ntsoov nruab qhov cua tshuab ziab khaub ncaws hauv qhov cub, txwv tsis pub cov chav yuav nyob hauv qhov cub thiab nce nws cov txheeb ze av noo, uas tsis zoo rau PCB dehumidification.

4. Los ntawm qhov pom ntawm qhov zoo, qhov tshiab PCB solder yog siv, qhov zoo dua yuav zoo dua. Txawm hais tias lub PCB tas sij hawm siv tom qab ci, tseem muaj qee qhov kev pheej hmoo zoo.

Cov lus pom zoo rau PCB ci
1. Nws raug nquahu kom siv qhov kub ntawm 105 ± 5 ℃ los ci PCB. Vim tias qhov kub ntawm cov dej kub yog 100 ℃, tsuav nws tshaj nws qhov kub kub, cov dej yuav dhau los ua chav. Vim tias PCB tsis muaj cov dej molecules ntau dhau, nws tsis tas yuav tsum muaj qhov kub thiab txias kom nce tus nqi ntawm nws cov vaporization.

Yog tias qhov kub thiab txias siab dhau los yog qhov ntsuas gasification ceev dhau, nws yuav yooj yim ua rau cov dej vapor nthuav dav sai, uas yog qhov tsis zoo rau qhov zoo. Tshwj xeeb tshaj yog rau multilayer boards thiab PCBs nrog faus qhov, 105 ° C yog siab tshaj qhov boiling point ntawm dej, thiab qhov kub yuav tsis siab dhau. , tuaj yeem dehumidify thiab txo qhov kev pheej hmoo ntawm oxidation. Ntxiv mus, lub peev xwm ntawm qhov cub tam sim no los tswj qhov kub thiab txias tau zoo dua qub dua.

2. Txawm hais tias PCB yuav tsum tau ci yog nyob ntawm seb nws lub ntim puas ntub, uas yog, txhawm rau saib seb HIC (Humidity Indicator Card) hauv lub tshuab nqus tsev puas tau pom cov dej noo. Yog tias lub ntim khoom zoo, HIC tsis qhia tias cov dej noo yog tiag tiag Koj tuaj yeem mus online yam tsis muaj ci.

3. Nws raug nquahu kom siv "upright" thiab spaced ci thaum PCB ci, vim tias qhov no tuaj yeem ua tiav qhov siab tshaj plaws ntawm cov cua kub convection, thiab noo noo yog yooj yim dua rau ci tawm ntawm PCB. Txawm li cas los xij, rau PCBs loj, nws yuav tsum tau txiav txim siab seb hom ntsug yuav ua rau khoov thiab deformation ntawm lub rooj tsavxwm.

4. Tom qab PCB tau ci, nws raug nquahu kom muab tso rau hauv qhov chaw qhuav thiab cia nws txias sai. Nws yog qhov zoo dua los nias qhov "tiv thaiv kev khoov" nyob rau sab saum toj ntawm lub rooj tsavxwm, vim tias cov khoom siv dav dav yog yooj yim nqus dej vapor los ntawm lub xeev kub kub mus rau cov txheej txheem txias. Txawm li cas los xij, kev ua kom txias sai sai yuav ua rau lub phaj dabtsi yog khoov, uas yuav tsum muaj qhov sib npaug.

Qhov tsis zoo ntawm PCB ci thiab tej yam yuav tsum xav txog
1. Kev ci yuav ua kom cov oxidation ntawm PCB txheej txheej, thiab qhov kub thiab txias, qhov ci ntev dua, qhov tsis zoo.

2. Nws tsis pom zoo kom ci OSP nto-kho boards ntawm qhov kub thiab txias, vim tias OSP zaj duab xis yuav degrade los yog poob vim qhov kub thiab txias. Yog tias koj yuav tsum ci, nws raug nquahu kom ci ntawm qhov kub ntawm 105 ± 5 ° C, tsis pub ntau tshaj 2 teev, thiab nws raug nquahu kom siv nws li 24 teev tom qab ci.

3. Kev ci tuaj yeem muaj kev cuam tshuam rau kev tsim ntawm IMC, tshwj xeeb tshaj yog rau HASL (tin spray), ImSn (tshuaj tin, immersion tin plating) nto kho cov boards, vim tias IMC txheej (tooj liab tin compound) yog ua tau thaum ntxov ntawm PCB. theem Generation, uas yog, nws tau raug generated ua ntej PCB soldering, tab sis ci yuav ua rau kom lub thickness ntawm no txheej ntawm IMC uas twb generated, ua rau muaj teeb meem kev ntseeg tau.