Ke hoʻohālikelike ʻia me nā papa kaapuni maʻamau, loaʻa i nā papa kaapuni HDI nā ʻokoʻa a me nā pono:
1. Ka nui a me ke kaumaha
Papa HDI: Liʻiliʻi a māmā.Ma muli o ka hoʻohana ʻana i nā wili kiʻekiʻe kiʻekiʻe a me nā laina laina ākea ākea, hiki i nā papa HDI ke hoʻokō i kahi hoʻolālā paʻa.
Papa kaapuni maʻamau: ʻoi aku ka nui a me ke kaumaha, kūpono no nā pono uea haʻahaʻa a maʻalahi.
2.Material a me ka hale
Papa kaapuni HDI: E hoʻohana maʻamau i nā paneli ʻelua ma ke ʻano he papa kumu, a laila e hana i kahi hoʻolālā multi-layer ma o ka lamination hoʻomau, i kapa ʻia ʻo "BUM" ka hōʻiliʻili ʻana o nā papa he nui (circuit packaging technology).Loaʻa nā pilina uila ma waena o nā papa me ka hoʻohana ʻana i nā puka makapō liʻiliʻi a kanu ʻia.
ʻO ka papa kaapuni maʻamau: ʻO ka ʻōnaehana multi-layer maʻamau ka pilina ma waena o ka lua, a hiki ke hoʻohana ʻia ka lua kanu makapō no ka hoʻokō ʻana i ka pilina uila ma waena o nā papa, akā maʻalahi kona hoʻolālā a me kāna kaʻina hana, ʻo ka aperture. he nui, a he haʻahaʻa ka nui o ka uwea, he kūpono ia no nā pono noi haʻahaʻa haʻahaʻa.
3.Production kaʻina hana
Papa kaapuni HDI: ʻO ka hoʻohana ʻana i ka ʻenehana hoʻoheheʻe pololei ʻana i ka laser, hiki ke hoʻokō i ka puka liʻiliʻi o nā puka makapō a me nā lua i kanu ʻia, aperture ma lalo o 150um.I ka manawa like, ʻoi aku ka kiʻekiʻe o nā koi no ka hole position precision control, ke kumu kūʻai a me ka hana hana.
ʻO ka papa kaapuni maʻamau: ʻo ka hoʻohana nui ʻana i ka ʻenehana hoʻoheheʻe mechanical, ʻo ka aperture a me ka helu o nā papa he nui.
4.Wiring density
ʻO ka papa kaapuni HDI: ʻOi aku ka kiʻekiʻe o ka uwila, ʻoi aku ka laulā o ka laina a me ka mamao o ka laina ma mua o 76.2um, a ʻoi aku ka nui o ka helu hoʻopili kuʻi ma mua o 50 mau kenimika square.
Papa kaapuni maʻamau: haʻahaʻa uwea haʻahaʻa, laula laina ākea a me ka laina laina, haʻahaʻa haʻahaʻa haʻahaʻa hoʻopili pili.
5. ka mānoanoa papa dielectric
Nā papa HDI: ʻOi aku ka lahilahi o ka mānoanoa dielectric, ʻoi aku ka liʻiliʻi ma mua o 80um, a ʻoi aku ke kiʻekiʻe o ka mānoanoa like ʻole, ʻoi aku hoʻi ma nā papa kiʻekiʻe a me nā substrate i hoʻopaʻa ʻia me ka mana impedance.
Papa kaapuni maʻamau: ʻo ka mānoanoa o ka papa dielectric mānoanoa, a he haʻahaʻa nā koi no ka like ʻana o ka mānoanoa.
6.Electrical hana
ʻO ka papa kaapuni HDI: ʻoi aku ka maikaʻi o ka hana uila, hiki ke hoʻonui i ka ikaika hōʻailona a me ka hilinaʻi, a loaʻa ka hoʻomaikaʻi nui ʻana i ka RF interference, electromagnetic wave interference, electrostatic discharge, thermal conductivity a pēlā aku.
Papa kaapuni maʻamau: haʻahaʻa ka hana uila, kūpono no nā noi me nā koi haʻahaʻa haʻahaʻa
7. Hoʻolālā hoʻololi
Ma muli o kāna hoʻolālā uea haʻahaʻa kiʻekiʻe, hiki i nā papa kaapuni HDI ke ʻike i nā hoʻolālā kaapuni paʻakikī ma kahi ākea.Hāʻawi kēia i nā mea hoʻolālā i ka maʻalahi i ka hoʻolālā ʻana i nā huahana, a me ka hiki ke hoʻonui i ka hana a me ka hana me ka hoʻonui ʻole i ka nui.
ʻOiai ua loaʻa i nā papa kaapuni HDI nā pōmaikaʻi i ka hana a me ka hoʻolālā ʻana, paʻakikī ke kaʻina hana, a kiʻekiʻe nā koi no nā mea hana a me nā ʻenehana.Hoʻohana ka Pullin circuit i nā ʻenehana kiʻekiʻe e like me ka hoʻoheheʻe ʻana i ka laser, ka pololei alignment a me ka micro-blind hole filling, e hōʻoiaʻiʻo ana i ka kiʻekiʻe o ka papa HDI.
Ke hoʻohālikelike ʻia me nā papa kaapuni maʻamau, ʻoi aku ka nui o nā papa kaapuni HDI, ʻoi aku ka maikaʻi o ka hana uila a me ka liʻiliʻi liʻiliʻi, akā paʻakikī kā lākou hana hana a kiʻekiʻe ke kumukūʻai.ʻAʻole maikaʻi ka nui o nā uwila holoʻokoʻa a me ka hana uila o nā papa kaapuni multi-layer maʻamau e like me nā papa kaapuni HDI, kūpono ia no nā noi haʻahaʻa haʻahaʻa.