Ma waena o nā huahana like ʻole o nā papa kaapuni honua ma 2020, manaʻo ʻia ka waiwai o nā substrates i ka ulu makahiki o 18.5%, ʻo ia ka mea kiʻekiʻe loa ma waena o nā huahana āpau. Ua hiki i ka 16% o nā huahana a pau ka waiwai o nā substrates, ʻelua wale nō i ka papa multilayer a me ka papa palupalu. Hiki ke hōʻuluʻulu ʻia ke kumu i hōʻike ʻia ai e ka papa lawe kaʻa i ka ulu kiʻekiʻe ma 2020 e like me nā kumu nui: 1. Ke hoʻomau nei ka ulu ʻana o nā moku IC honua. Wahi a ka ʻikepili WSTS, ʻo ka nui o ka ulu ʻana o ka waiwai hana IC honua ma 2020 ma kahi o 6%. ʻOiai ʻoi aku ka liʻiliʻi o ka ulu ʻana ma mua o ka ulu ʻana o ka waiwai hoʻopuka, ua manaʻo ʻia ma kahi o 4%; 2. ʻO ke kumu kūʻai kiʻekiʻe o ka papa lawe lawe ABF i koi ikaika. Ma muli o ka ulu kiʻekiʻe o ka noi no nā kahua kahua 5G a me nā kamepiula hana kiʻekiʻe, pono nā pahu pahu e hoʻohana i nā papa lawe ABF ʻO ka hopena o ka piʻi ʻana o ke kumukūʻai a me ka leo ua hoʻonui pū i ka ulu ʻana o ka hoʻopuka ʻana o ka papa lawe; 3. Ke koi hou no nā papa lawe lawe mai nā kelepona paʻa lima 5G. ʻOiai ʻo ka hoʻouna ʻana o nā kelepona paʻalima 5G i 2020 he haʻahaʻa ma mua o ka mea i manaʻo ʻia ma kahi o 200 miliona wale nō, ʻo ka millimeter wave 5G ʻO ka hoʻonui ʻana i ka helu o nā modules AiP i nā kelepona kelepona a i ʻole ka helu o nā modules PA i ka RF front-end ke kumu. ka piʻi ʻana o ka noi no nā papa lawe lawe. ʻO nā mea āpau, inā paha he hoʻomohala ʻenehana a i ʻole ke koi ʻana o ka mākeke, ʻo ka papa lawe lawe 2020 ʻaʻole i kanalua ka huahana ʻoi loa i ka maka ma waena o nā huahana papa kaapuni āpau.

ʻO ke ʻano i manaʻo ʻia o ka nui o nā pūʻolo IC ma ka honua. Hoʻokaʻawale ʻia nā ʻano pūʻolo i nā ʻano pahu alakaʻi kiʻekiʻe QFN, MLF, SON…, nā ʻano kumu alakaʻi kuʻuna SO, TSOP, QFP…, a me nā pine liʻiliʻi DIP, ʻo nā ʻano ʻekolu ma luna aʻe wale nō e pono ai ke kumu alakaʻi e lawe ai i ka IC. Ke nānā nei i nā hoʻololi lōʻihi o nā ʻāpana o nā ʻano ʻano o nā pūʻolo, ʻo ka piʻi ʻana o ka ulu ʻana o ka wafer-level a me ka pahu pahu pahu ka mea kiʻekiʻe loa. ʻO ka nui o ka ulu ʻana o ka makahiki mai 2019 a 2024 he kiʻekiʻe e like me 10.2%, a ʻo ka hapa o ka helu pūʻulu holoʻokoʻa he 17.8% hoʻi i 2019. , Ke piʻi nei i 20.5% i 2024. ʻO ke kumu nui ʻo ia nā polokalamu kelepona pilikino me nā wati akamai. , nā pepeiao pepeiao, nā mea hiki ke hoʻohana ʻia…e hoʻomau ʻia ka ulu ʻana i ka wā e hiki mai ana, a ʻaʻole pono kēia ʻano huahana i nā chips computationally complex complex, no laila e hōʻike ana i ka māmā a me ka noʻonoʻo ʻana i ke kumukūʻai. E pili ana i nā ʻano pūʻolo kiʻekiʻe e hoʻohana ana i nā papa lawe, me nā pūʻulu BGA maʻamau a me FCBGA, ʻo ka nui o ka ulu ʻana o ka makahiki mai 2019 a 2024 ma kahi o 5%.

ʻO ka māhele māhele mākeke o nā mea hana i ka mākeke papa lawe honua e hoʻomau ʻia e Taiwan, Iapana a me South Korea e pili ana i ka ʻāina o ka mea hana. Ma waena o lākou, kokoke i ka 40% ka māhele mākeke o Taiwan, ʻo ia ka mea ʻoi aku ka nui o ka mea lawe lawe papa hana i kēia manawa, South Korea ʻO ka māhele mākeke o nā mea hana Iapana a me nā mea hana Kepani i waena o nā mea kiʻekiʻe loa. I waena o lākou, ua ulu wikiwiki nā mea hana Korea. ʻO ka mea nui, ua ulu nui nā substrates o SEMCO e ka ulu ʻana o nā hoʻouna kelepona paʻa lima o Samsung.

No nā manawa ʻoihana e hiki mai ana, ʻo ka hana 5G i hoʻomaka i ka hapa lua o 2018 ua hoʻokumu i ka noi no nā substrates ABF. Ma hope o ka hoʻonui ʻana o nā mea hana i kā lākou hiki ke hana i ka makahiki 2019, ua pōkole ka mākeke. Ua hoʻolilo ʻo Taiwanese i nā mea hana ma mua o NT $ 10 biliona e kūkulu i ka mana hana hou, akā e hoʻokomo i nā waihona i ka wā e hiki mai ana. ʻO Taiwan, nā lako kamaʻilio, nā kamepiula hana kiʻekiʻe ... e loaʻa nā koi no nā papa lawe ABF. Ua manaʻo ʻia ʻo 2021 ka makahiki i paʻakikī ai ke koi ʻana i nā papa lawe lawe ABF. Eia kekahi, mai ka hoʻokumu ʻana o Qualcomm i ka module AiP i ka hapaha ʻekolu o 2018, ua hoʻohana nā kelepona akamai 5G iā AiP e hoʻomaikaʻi i ka hiki ke hoʻokipa hōʻailona o ke kelepona paʻa. Ke hoʻohālikelike ʻia me nā kelepona akamai 4G i hala me ka hoʻohana ʻana i nā papa palupalu e like me nā antenna, he antenna pōkole ka module AiP. , RF chip… etc. i hoʻopaʻa ʻia i loko o hoʻokahi module, no laila e loaʻa ke koi no ka papa lawe lawe AiP. Eia kekahi, pono paha nā lako kamaʻilio 5G terminal 10 a 15 AiPs. Hoʻolālā ʻia kēlā me kēia ʻāpana antenna AiP me 4 × 4 a i ʻole 8 × 4, e koi ana i ka nui o nā papa lawe. (TPCA)