Ma ka PCB, hoʻohana ʻia ka nickel ma ke ʻano he pani pani no nā metala makamae a kumu. Hoʻopili pinepine ʻia nā waihona nickel haʻahaʻa haʻahaʻa PCB me nā hoʻonā Watt nickel plating i hoʻololi ʻia a me kekahi mau mea hoʻonā sulfamate nickel plating me nā mea hoʻohui e hōʻemi i ke kaumaha. E ʻae i nā mea hana loea e loiloi no ʻoe i nā pilikia e hālāwai pinepine ai ka PCB nickel plating solution i ka wā e hoʻohana ai?
1. Kaʻina hana nikela. Me ka mahana like ʻole, ʻokoʻa ka mahana ʻauʻau i hoʻohana ʻia. I loko o ka nickel plating solution me ke kiʻekiʻe o ka mahana, ʻo ka nickel plating layer i loaʻa he haʻahaʻa koʻikoʻi kūloko a me ka ductility maikaʻi. Mālama ʻia ka mahana hana maʻamau ma 55-60 degere. Inā kiʻekiʻe loa ka mahana, e hana ʻia ka nickel saline hydrolysis, ka hopena i nā pinholes i loko o ka uhi a ma ka manawa like e hōʻemi i ka polarization cathode.
2. PH waiwai. He hopena nui ka PH waiwai o ka nickel-plated electrolyte i ka hana uhi a me ka hana electrolyte. ʻO ka maʻamau, mālama ʻia ka pH waiwai o ka nickel plating electrolyte o PCB ma waena o 3 a me 4. ʻO ka hopena nickel plating me ka waiwai PH kiʻekiʻe aʻe ka ikaika dispersion a me ka cathode i kēia manawa kūpono. Akā, kiʻekiʻe loa ka PH, no ka mea, hoʻomau mau ka cathode i ka hydrogen i ka wā o ke kaʻina hana electroplating, inā ʻoi aku ka nui ma mua o 6, e hana ia i nā pinholes i ka papa plating. ʻOi aku ka maikaʻi o ka hoʻoheheʻe anode a hiki ke hoʻonui i ka ʻike o ka paʻakai nickel i ka electrolyte. Eia nō naʻe, inā haʻahaʻa loa ka pH, e hōʻemi ʻia ka pae wela no ka loaʻa ʻana o kahi papa ʻālohilohi. ʻO ka hoʻohui ʻana i ka nickel carbonate a i ʻole ka nickel carbonate kumu e hoʻonui ai i ka waiwai PH; ʻO ka hoʻohui ʻana i ka waikawa sulfamic a i ʻole ka sulfuric acid e hoʻemi i ka waiwai pH, a nānā a hoʻoponopono i ka waiwai PH i kēlā me kēia ʻehā hola i ka wā o ka hana.
3. Anode. ʻO ka nickel plating o nā PCB hiki ke ʻike ʻia i kēia manawa ke hoʻohana nei nā anodes soluble, a he mea maʻamau ka hoʻohana ʻana i nā hīnaʻi titanium ma ke ʻano he anodes no ke kihi nickel kūloko. Pono e hoʻokomo ʻia ka hīnaʻi titanium i loko o kahi ʻeke anode i ulana ʻia me ka polypropylene i mea e pale ai i ka hāʻule ʻana o ka lepo anode i loko o ka hopena plating, a pono e hoʻomaʻemaʻe mau ʻia a nānā ʻia inā maʻalahi ka eyelet.
4. Hoomaemae. Ke loaʻa nā mea ʻino i loko o ka solution plating, pono e mālama ʻia me ka carbon activated. Akā ʻo kēia ʻano hana maʻamau e wehe i kahi ʻāpana o ka mea hoʻomaha hoʻomaha (additive), pono e hoʻohui ʻia.
5. Ka Ikepili. Pono ka hoʻonā plating e hoʻohana i nā kumu nui o nā lula kaʻina i kuhikuhi ʻia i ka mana kaʻina. E nānā i kēlā me kēia manawa i ka hoʻohui ʻana o ka hopena plating a me ka hoʻāʻo ʻana o ke kelepona Hull, a alakaʻi i ka ʻoihana hana e hoʻoponopono i nā ʻāpana o ka hopena plating e like me nā ʻāpana i loaʻa.
6. Hoʻoulu. ʻO ke kaʻina hana nickel plating e like me nā kaʻina hana electroplating. ʻO ke kumu o ka hoʻoulu ʻana, ʻo ia ka hoʻolalelale ʻana i ke kaʻina hana hoʻoneʻe nui e hōʻemi i ka hoʻololi ʻana a hoʻonui i ka palena kiʻekiʻe o ka nui o kēia manawa. Aia kekahi hopena koʻikoʻi o ka hoʻoulu ʻana i ka solution plating, ʻo ia ka hōʻemi a pale ʻana paha i nā pinholes ma ka papa nickel plating. Hoʻohana maʻamau ʻia ka ea kaomi, ka neʻe ʻana o ka cathode a me ke kaʻa kaʻa ʻana (hui pū ʻia me ke kumu kalapona a me ka kānana kumu pulupulu).
7. Cathode i kēia manawa. He hopena ko Cathode current density i ka cathode current efficiency, deposition rate and coating quality. Ke hoʻohana nei i kahi electrolyte me kahi PH haʻahaʻa no ka nickel plating, ma kahi haʻahaʻa haʻahaʻa o kēia manawa, hoʻonui ka cathode i kēia manawa me ka hoʻonui ʻana i ka nui o kēia manawa; ma kahi kiʻekiʻe o kēia manawa, kūʻokoʻa ka pono o ka cathode i kēia manawa; ʻoiai ke hoʻohana ʻana i kahi PH kiʻekiʻe I ka hoʻopili ʻana i ka nickel wai, ʻaʻole koʻikoʻi ka pilina ma waena o ka cathode i kēia manawa a me ka nui o kēia manawa. E like me nā ʻano ʻano plating ʻē aʻe, ʻo ke ʻano o ka nui o ka cathode i koho ʻia no ka nickel plating e hilinaʻi pū ʻia i ka haku mele ʻana, ka mahana a me nā kūlana hoʻoulu o ka hopena plating.