1. Kaʻina Hoʻohui

Hoʻohana ʻia ka papa keleawe kemika no ka ulu pono ʻana o nā laina conductor kūloko ma luna o ka ʻili substrate non-conductor me ke kōkua o kahi mea paʻa.

Hiki ke hoʻokaʻawale ʻia nā ʻano hana hoʻohui i ka papa kaapuni i ka hoʻohui piha, ka hapalua a me ka hoʻohui hapa a me nā ʻano like ʻole.

2. Backpanels, Backplanes

He papa kaapuni mānoanoa (e like me 0.093″,0.125″), i hoʻohana kūikawā ʻia e hoʻopili a hoʻohui i nā papa ʻē aʻe. Hana ʻia kēia ma ka hoʻokomo ʻana i kahi mea hoʻohui multi-pin i loko o ka lua paʻa, ʻaʻole naʻe ma ke kūʻai ʻana, a laila e hoʻopaʻa ʻia i kēlā me kēia ma ka uea e hele ai ka mea hoʻohui i ka papa. Hiki ke hoʻokomo kaʻawale ʻia ka mea hoʻohui i loko o ka papa kaapuni maʻamau. Ma muli o keia mea he kūikawā papa, kona 'ma o ka puka hiki ole solder, akā, e hole pā a alakai uea pololei kāleka paʻa hoʻohana, no laila, i kona maikaʻi a me ka aperture koi i oi loa koʻikoʻi, kona kauoha nui 'aʻole he nui o ka, laulā kaapuni papa hale hana. ʻAʻole makemake a ʻaʻole maʻalahi e ʻae i kēia ʻano kauoha, akā ua aneane lilo ia i papa kiʻekiʻe o ka ʻoihana kūikawā ma ʻAmelika Hui Pū ʻIa.

3. Kaʻina hana kūkulu

He kahua hou kēia o ka hana ʻana no ka multilayer lahilahi, loaʻa ka hoʻomaʻamaʻa mua ʻana mai ka kaʻina IBM SLC, i kāna hana hoʻokolohua Japanese Yasu mea kanu hoʻomaka i ka makahiki 1989, ua hoʻokumu ʻia ke ala ma ka papa pālua kuʻuna, no ka mea, ʻo ka ʻelua o waho panel mua piha pono. e like me Probmer52 ma mua o ka uhi ʻana i ka wai photosensitive, ma hope o ka hapalua o ka paʻakikī a me ka ʻoluʻolu e like me ka hana ʻana i nā mines me ka papa aʻe o ke ʻano pāpaʻu "sense of optical hole" (Photo - Via), a laila e hoʻonui i ka conductor o ke keleawe a me ke keleawe. papa, a ma hope o ka laina kiʻi a me ka etching, hiki ke kiʻi i ka uea hou a me ka underlying interconnection kanu lua a makapō puka. ʻO ka hoʻopaʻa hou ʻana e hāʻawi i ka helu i makemake ʻia o nā papa. ʻAʻole hiki i kēia ʻano ke pale wale i ke kumukūʻai kūʻai o ka mīkini wili ʻana, akā e hoʻemi hoʻi i ke anawaena o ka lua ma lalo o 10mil. I nā makahiki he 5 ~ 6 i hala iho nei, ua hoʻohana nā ʻano o ka haki ʻana i ka papa kuʻuna i kahi ʻenehana multilayer holomua, ma ka ʻoihana ʻEulopa ma lalo o ka pana, e hana i kēlā Kaʻina BuildUp, ua helu ʻia nā huahana i ʻoi aku ma mua o 10 mau ʻano. Koe na "photosensitive pores"; Ma hope o ka wehe ʻana i ka uhi keleawe me nā lua, ua hoʻohana ʻia nā ʻano hana like ʻole e like me ka alkaline chemical Etching, Laser Ablation, a me Plasma Etching no nā papa organik. Eia kekahi, hiki ke hoʻohana ʻia ka Resin Coated Copper Foil (Resin Coated Copper Foil) i hoʻopili ʻia me ka resin semi-hardened e hana i kahi pā liʻiliʻi, liʻiliʻi a lahilahi me ka Lamination Sequential. I ka wā e hiki mai ana, e lilo nā huahana uila pilikino like ʻole i kēia ʻano o ka honua papa honua ākea ākea a pōkole.

4. Cermet

Hoʻohui ʻia ka pauka seramika a me ka pauka metala, a hoʻohui ʻia ka mea hoʻopili e like me ke ʻano o ka uhi ʻana, hiki ke paʻi ʻia ma ka ʻili o ka papa kaapuni (a i ʻole ka ʻāpana o loko) e ke kiʻiʻoniʻoni mānoanoa a i ʻole ke kiʻi ʻoniʻoni, ma ke ʻano he "resistor", ma kahi o ka pale pale waho i ka wā e hui ai.

5. Kipu-hui

He hana ia o ka porcelain Hybrid circuit board. ʻO nā laina kaapuni o Thick Film Paste o nā metala makamae like ʻole i pai ʻia ma ka ʻili o kahi papa liʻiliʻi e puhi ʻia i ka wela kiʻekiʻe. Hoʻopau ʻia nā mea lawe ʻokoʻa i loko o ka paʻi kiʻiʻoniʻoni mānoanoa, e waiho ana i nā laina o ka mea hoʻokele metala makamae e hoʻohana ʻia e like me nā uea no ka pilina.

6. Kea

Ua kapa ʻia ke ala ʻekolu ʻāpana o nā uea ʻelua ma ka ʻili o ka papa a me ka hoʻopiha ʻana i ke kikowaena insulating ma waena o nā wahi hāʻule. ʻO ka mea maʻamau, ʻo kahi ʻili pena ʻōmaʻomaʻo hoʻokahi a me ka pahu kiʻi ʻoniʻoni kalapona, a i ʻole ke ʻano papa ma luna a ma lalo o ka uwea ʻo ia ka "Crossover".

7. Papa Wiring Discreate

ʻO kekahi huaʻōlelo no ka papa uwila lehulehu, ua hana ʻia me ka uwea enameled poepoe i hoʻopili ʻia i ka papa a hoʻoheheʻe ʻia me nā lua. ʻOi aku ka maikaʻi o ka hana ʻana o kēia ʻano papa multiplex ma ka laina hoʻouna alapine kiʻekiʻe ma mua o ka laina square square i kālai ʻia e PCB maʻamau.

8. DYCO strate

ʻO ia ʻo Switzerland ʻo Dyconex i hoʻomohala i ka Buildup of the Process ma Zurich. He ala patent ia e wehe ai i ka foil keleawe ma nā kūlana o nā puka ma ka ʻili o ka pā ma mua, a laila e waiho i loko o kahi ʻūhā paʻa, a laila e hoʻopiha iā ia me CF4, N2, O2 e ionize i ka volta kiʻekiʻe e hana i ka Plasma ikaika loa. , hiki ke hoʻohana ʻia e hoʻopau i ka mea kumu o nā kūlana perforated a hana i nā puka alakaʻi liʻiliʻi (ma lalo o 10mil). ʻO ke kaʻina hana kālepa i kapa ʻia ʻo DYCOstrate.

9. Electro-Deposited Photoresist

ʻO ka photoresistance uila, electrophoretic photoresistance he hana hou "photosensitive resistance", i hoʻohana mua ʻia no ke ʻano o nā mea metala paʻakikī "pena uila", i hoʻokomo hou ʻia i ka noi "photoresistance". Ma o ka electroplating, ua hoʻopaʻa like ʻia nā ʻāpana colloidal i hoʻopaʻa ʻia o ka resin photosensitive i hoʻopiʻi ʻia ma ka ʻili keleawe o ka papa kaapuni ma ke ʻano he mea pale e kūʻē i ka etching. I kēia manawa, ua hoʻohana ʻia i ka hana nui i ke kaʻina hana o ke keleawe pololei etching o loko laminate. Hiki ke hoʻokomo ʻia kēia ʻano photoresist ED i loko o ka anode a i ʻole cathode e like me nā ʻano hana like ʻole, i kapa ʻia ʻo "anode photoresist" a me "cathode photoresist". Ma muli o ke kumukānāwai photosensitive ʻokoʻa, aia nā "photosensitive polymerization" (Negative Working) a me "photosensitive decomposition" (Positive Working) a me nā ʻano ʻelua ʻē aʻe. I kēia manawa, ua kūʻai kūʻai ʻia ke ʻano maikaʻi ʻole o ka photoresistance ED, akā hiki ke hoʻohana wale ʻia ma ke ʻano he planar resistance agent. Ma muli o ka paʻakikī o ka photosensitive i loko o ka puka puka, ʻaʻole hiki ke hoʻohana ʻia no ka hoʻololi kiʻi o ka pā waho. No ka "ED maikaʻi", hiki ke hoʻohana ʻia ma ke ʻano he kiʻi kiʻi kiʻi no ka pā o waho (ma muli o ka membrane photosensitive, ʻaʻole pili ka hopena photosensitive ma ka paia o ka lua), ke piʻi nei ka ʻoihana Iapana i nā hana kālepa i ka hoʻohana ʻana i ka hana nui, i hiki ke maʻalahi i ka hana ʻana i nā laina lahilahi. Ua kapa ʻia ka huaʻōlelo Electrothoretic Photoresist.

10. Hoʻoheheʻe ʻia

He papa kaapuni kūikawā ia i palahalaha loa i ka helehelena a kaomi i nā laina alakaʻi a pau i loko o ka pā. ʻO ka hana o kāna papa hoʻokahi, ʻo ia ka hoʻohana ʻana i ke ʻano hoʻololi kiʻi e kālai ai i kahi ʻāpana o ka ʻāpana keleawe o ka ʻili o ka papa ma luna o ka papa kumu i hoʻopaʻa ʻia. High wela a me ke kiʻekiʻe puʻe ala e e ka papa laina i loko o ka semi-paʻakikī pā, i ka manawa like e hoʻopau i ka pā resin hardening hana, i loko o ka laina i loko o ka ili a me nā papa kaapuni palahalaha. ʻO ka mea maʻamau, ua kālai ʻia kahi ʻāpana keleawe lahilahi mai ka ʻili kaʻapuni hiki ke hoʻihoʻi ʻia i hiki ke hoʻopaʻa ʻia kahi papa nickel 0.3mil, kahi papa rhodium 20-inihi, a i ʻole he 10-iniha papa gula e hāʻawi i kahi kūpaʻa haʻahaʻa haʻahaʻa a maʻalahi hoʻi ka hoʻoheheʻe ʻana i ka wā o ka hoʻopili ʻana. . Eia naʻe, ʻaʻole pono e hoʻohana ʻia kēia ʻano hana no ka PTH, i mea e pale ai i ka poha ʻana o ka lua i ke kaomi ʻana. ʻAʻole maʻalahi ka loaʻa ʻana o kahi ʻili maʻalahi loa o ka papa, ʻaʻole pono e hoʻohana ʻia i ka wela kiʻekiʻe, inā e hoʻonui ka resin a laila hoʻokuke i ka laina mai ka ʻili. ʻIke pū ʻia ʻo Etchand-Push, ua kapa ʻia ka Papa i hoʻopau ʻia ʻo Flush-Bonded Board a hiki ke hoʻohana ʻia no nā hana kūikawā e like me Rotary Switch a me Wiping Contacts.

11. Frit

I loko o ka Poly Thick Film (PTF) paʻi paʻi, ma waho aʻe o nā kemika metala makamae, pono e hoʻohui ʻia ka pauka aniani i mea e pāʻani ai i ka hopena o ka condensation a me ka hoʻopili ʻana i ka hoʻoheheʻe wela kiʻekiʻe, no laila ka paʻi paʻi ma luna. hiki ke hana i kahi ʻōnaehana kaapuni metala makamae paʻa.

12. Ke Kaʻina Hana Hoʻohui piha

Aia ia ma ka ʻaoʻao o ka insulation piha, me ka ʻole o ka electrodeposition o ke ʻano metala (ʻo ka hapa nui he keleawe kemika), ka ulu ʻana o ka hana kaapuni koho, ʻo kekahi ʻōlelo ʻaʻole pololei ʻo "Fully Electroless".

13. Kaapuni Hoʻohui ʻia Hybrid

He wahi liʻiliʻi porcelain lahilahi ia, ma ke ʻano paʻi e hoʻopili i ka laina ʻīnika conductive metala, a laila ma ke kiʻekiʻe kiʻekiʻe o ka inika mea ola kino i puhi ʻia, waiho ʻia kahi laina conductor ma luna o ka ʻili, a hiki ke hoʻokō i nā ʻāpana hoʻopaʻa ili o ka welding. He ʻano mea lawe kaapuni o ka ʻenehana kiʻiʻoniʻoni mānoanoa ma waena o ka papa kaapuni i paʻi ʻia a me ka mīkini kaapuni hoʻohui semiconductor. Ma mua i hoʻohana ʻia no ka pūʻali koa a i ʻole nā ​​noi kiʻekiʻe, ua ulu wikiwiki ka Hybrid i nā makahiki i hala iho nei ma muli o kona kumukūʻai kiʻekiʻe, ke emi ʻana o ka pūʻali koa, a me ka paʻakikī i ka hana automated, a me ka hoʻonui ʻana i ka miniaturization a me ka maʻalahi o nā papa kaapuni.

14. Mea hoopili

ʻO Interposer e pili ana i nā ʻāpana ʻelua o nā mea hoʻokele i lawe ʻia e kahi kino insulating e conductive ma o ka hoʻohui ʻana i kekahi mea hoʻopiha conductive ma kahi e conductive. No ka laʻana, i loko o ka puka ʻole o ka pā multilayer, nā mea e like me ka hoʻopiha ʻana i ka paʻi kālā a i ʻole ka paʻi keleawe e pani ai i ka pā o ka puka keleawe orthodox, a i ʻole nā ​​mea e like me ka vertical unidirectional conductive rubber layer, nā mea interposers o kēia ʻano.

15. Ke Kiʻi Kiʻi Laser (LDI)

ʻO ia ke kaomi ʻana i ka pā i hoʻopili ʻia i ke kiʻi maloʻo, ʻaʻole e hoʻohana hou i ka ʻike maikaʻi ʻole no ka hoʻoili kiʻi, akā ma kahi o ke kukuna laser kauoha kamepiula, pololei ma ke kiʻi maloʻo no ka nānā wikiwiki ʻana i ke kiʻi photosensitive. ʻO ka paia ʻaoʻao o ka kiʻiʻoniʻoni maloʻo ma hope o ke kiʻi ʻana ua ʻoi aku ke kū pololei no ka mea ua like ke kukui i hoʻokuʻu ʻia me kahi kukuna ikehu hoʻokahi. Eia naʻe, hiki ke hana wale ke ʻano ma kēlā me kēia papa pākahi, no laila ʻoi aku ka wikiwiki o ka hana nui ma mua o ka hoʻohana ʻana i ke kiʻiʻoniʻoni a me ka ʻike kuʻuna. Hiki iā LDI ke hana i nā papa 30 o ka nui liʻiliʻi i kēlā me kēia hola, no laila hiki ke ʻike ʻia i kekahi manawa ma ke ʻano o ka pale pepa a i ʻole ke kumu kūʻai kiʻekiʻe. Ma muli o ke kumukūʻai kiʻekiʻe o ka congenital, paʻakikī ke hoʻolaha i ka ʻoihana

16.Hoʻolima Laser

I loko o ka ʻoihana uila, nui nā hana kikoʻī, e like me ka ʻoki ʻana, ka wili ʻana, ka welding, a me nā mea ʻē aʻe, hiki ke hoʻohana ʻia no ka lawe ʻana i ka ikehu māmā laser, i kapa ʻia ke ʻano hana hana laser. Hōʻike ʻo LASER i nā pōkole "Light Amplification Stimulated Emission of Radiation", i unuhi ʻia ʻo "LASER" e ka ʻoihana ʻāina nui no kāna unuhi manuahi, ʻoi aku ka nui. Ua hana ʻia ʻo Laser i ka makahiki 1959 e ka American physicist th moser, nāna i hoʻohana i hoʻokahi kukui kukui e hana i nā kukui Laser ma luna o nā rubi. Ua hana nā makahiki noiʻi i kahi ʻano hana hou. Ma waho aʻe o ka ʻoihana uila, hiki ke hoʻohana ʻia i nā kahua lapaʻau a me nā pūʻali koa

17. Papa Uea Micro

ʻO ka papa kaapuni kūikawā me ka PTH interlayer interconnection ka mea maʻamau i kapa ʻia ʻo MultiwireBoard. Ke kiʻekiʻe loa ka nui o ka uea (160 ~ 250in/in2), akā liʻiliʻi loa ke anawaena uea (emi ma mua o 25mil), ʻike ʻia ʻo ia ka micro-sealed circuit board.

18. Kaapuni Molded

Ke hoʻohana nei ia i ʻekolu-dimensional mold, hana Injection molding a i ʻole ke ʻano hoʻololi e hoʻopau i ke kaʻina hana o ka papa kaapuni stereo, i kapa ʻia ʻo ka Molded circuit or Molded system connection circuit.

19 . Muliwiring Board ( Discrete Wiring Board)
Ke hoʻohana nei ʻo ia i kahi uea enameled lahilahi, pololei ma ka ʻili me ka pā keleawe ʻole no ka wili keʻa ʻekolu-dimensional, a laila ma ka uhi ʻana i ka puka paʻa a me ka wili ʻana a me ka hoʻopaʻa ʻana i ka lua, ka multi-layer interconnect circuit board, i kapa ʻia ʻo "multi-wire board. ”. Hoʻokumu ʻia kēia e PCK, kahi hui ʻAmelika, a ke hana ʻia nei e Hitachi me kahi hui Iapana. Hiki i kēia MWB ke mālama i ka manawa i ka hoʻolālā ʻana a kūpono i kahi helu liʻiliʻi o nā mīkini me nā kaapuni paʻakikī.

20. Hoʻopili Metala Noble

He paʻi conductive no ka paʻi kaapuni kiʻiʻoniʻoni mānoanoa. Ke paʻi ʻia ma ka substrate seramika e ka paʻi ʻana i ka pale, a laila puhi ʻia ka mea lawe organik i ka wela kiʻekiʻe, ʻike ʻia ke kaapuni metala hanohano. ʻO ka pauka metala conductive i hoʻohui ʻia i ka paʻi he mea kila maikaʻi ia e pale ai i ka hoʻokumu ʻana o nā oxides i nā wela kiʻekiʻe. Loaʻa nā mea hoʻohana i ke gula, platinum, rhodium, palladium a i ʻole nā ​​metala makamae ʻē aʻe.

21. Papa Pads Wale

I nā lā mua o ka hoʻokani pila, ua haʻalele wale kekahi mau papa multilayer hilinaʻi nui i ka puka puka a me ke apo weld ma waho o ka pā a hūnā i nā laina pili ma ka papa o loko o lalo e hōʻoia i ka hiki ke kūʻai aku a me ka palekana laina. ʻAʻole e paʻi ʻia kēia ʻano o nā papa ʻelua o ka papa e paʻi ʻia i ka pena ʻōmaʻomaʻo, i ke ʻano o ka nānā kūikawā, koʻikoʻi ka nānā ʻana i ka maikaʻi.

I kēia manawa ma muli o ka piʻi ʻana o ka wili uila, nui nā huahana uila uila (e like me ke kelepona paʻalima), ke alo o ka papa kaapuni e waiho wale ana i ka SMT soldering pad a i ʻole kekahi mau laina, a me ka hoʻopili ʻana o nā laina ʻeleʻele i ka papa o loko, paʻakikī hoʻi ka interlayer. ʻO ke kiʻekiʻe o ka mining ua haki ʻia ka puka makapō a i ʻole ka puka makapō "uhi" (Pads-On-Hole), e like me ka interconnect i mea e hōʻemi ai i ka hoʻopaʻa ʻana o ka lua holoʻokoʻa me ka pōʻino nui o ke keleawe nui, ʻo ka pā SMT he Pads Only Board.

22. Kiʻiʻoniʻoni Mānoanoa Polymer (PTF)

ʻO ia ka paʻi paʻi metala makamae i hoʻohana ʻia i ka hana ʻana i nā kaʻapuni, a i ʻole ka paʻi paʻi e hana ana i kahi kiʻi kūʻē i paʻi ʻia, ma luna o kahi substrate seramika, me ka paʻi pale a me ka hoʻonā wela kiʻekiʻe ma hope. Ke puhi ʻia ka mea lawe organik, hoʻokumu ʻia kahi ʻōnaehana o nā kaapuni i hoʻopaʻa paʻa ʻia. ʻO ia mau papa i kapa ʻia he hybrid circuits.

23. Kaʻina Semi-Additive

E kuhikuhi i ka mea kumu o ka insulation, e ulu i ke kaapuni e pono mua pololei me ke keleawe keleawe, hoʻololi hou electroplate keleawe 'o ia hoʻi e hoʻomau i ka mānoanoa aʻe, e kapa aku "Semi-Additive" kaʻina.

Inā hoʻohana ʻia ke ʻano keleawe kemika no ka mānoanoa laina āpau, ua kapa ʻia ke kaʻina hana "total hoʻohui". E hoʻomaopopo ʻo ka wehewehe ʻana ma luna mai ka * kikoʻī ipc-t-50e i paʻi ʻia ma Iulai 1992, ʻokoʻa ia mai ka ipc-t-50d kumu mua (Novema 1988). ʻO ka "D version" mua, e like me ka mea i ʻike maʻamau ʻia i ka ʻoihana, e pili ana i kahi substrate ʻeleʻele, non-conductive, a i ʻole ʻili keleawe lahilahi (e like me 1/4oz a i ʻole 1/8oz). Hoʻomākaukau ʻia ka hoʻololi kiʻi o ka mea kūʻē kūʻē maikaʻi ʻole a mānoanoa ke kaapuni i makemake ʻia e ke keleawe kemika a i ʻole ka pā keleawe. ʻAʻole ʻōlelo ka 50E hou i ka huaʻōlelo "thin copper". Nui ka ʻokoʻa ma waena o nā ʻōlelo ʻelua, a me he mea lā ua ulu ka manaʻo o ka poʻe heluhelu me The Times.

24. Kaʻina hana substractive

ʻO ia ka ʻili o ka hoʻoneʻe ʻana i ke keleawe keleawe ʻole o ka wahi, ʻo ke ala kaapuni i ʻike ʻia ʻo "ke ala hoʻēmi", ʻo ia ke kumu nui o ka papa kaapuni no nā makahiki he nui. He ʻokoʻa kēia me ke ʻano "hoʻohui" o ka hoʻohui ʻana i nā laina conductor keleawe pololei i kahi substrate keleawe ʻole.

25. Kaapuni Film Manoanoa

ʻO ka PTF (Polymer Thick Film Paste), nona nā metala makamae, ua paʻi ʻia ma ka substrate seramika (e like me ka alumini trioxide) a laila puhi ʻia i ka wela kiʻekiʻe e hana i ka ʻōnaehana kaapuni me ka mea hoʻokele metala, i kapa ʻia ʻo "kaapuni film mānoanoa". He ʻano kaapuni Hybrid liʻiliʻi. ʻO ka Silver Paste Jumper ma ka PCBS ʻaoʻao hoʻokahi he paʻi kiʻiʻoniʻoni mānoanoa akā ʻaʻole pono e puhi ʻia i nā wela kiʻekiʻe. ʻO nā laina i paʻi ʻia ma ka ʻili o nā substrate like ʻole ua kapa ʻia nā laina "kiʻiʻoniʻoni mānoanoa" wale nō ke ʻoi aku ka mānoanoa ma mua o 0.1mm [4mil], a ʻo ka ʻenehana hana o ia "circuit system" ua kapa ʻia ʻo "thick film technology".

26. ʻenehana kiʻiʻoniʻoni lahilahi
ʻO ia ke alakaʻi a me ke kaapuni pili i pili i ka substrate, kahi i emi ai ka mānoanoa ma mua o 0.1mm [4mil], i hana ʻia e Vacuum Evaporation, Pyrolytic Coating, Cathodic Sputtering, Chemical Vapor Deposition, electroplating, anodizing, etc., i kapa ʻia ʻo "thin. ʻenehana kiʻiʻoniʻoni”. Loaʻa i nā huahana Practical ka Thin Film Hybrid Circuit a me ka Thin Film Integrated Circuit, etc

27. Kaapuni Laminatied

He hou kaapuni papa hana hana, me ka hoʻohana 'ana i ka 93mil mānoanoa ua hana laumania kuhiliʻole kila pā, hana mua i ka ino maloʻo maloʻo kiʻi kiʻi hoʻoili, a laila, kiʻekiʻe-wikiwiki keleawe plating laina. Ma hope o ka wehe ʻana i ke kiʻiʻoniʻoni maloʻo, hiki ke paʻi ʻia ka uea kuʻina kila ma ka wela kiʻekiʻe i ke kiʻi semi-paʻakikī. A laila wehe i ka pā kila kila, hiki iā ʻoe ke kiʻi i ka ʻili o ka papa kaapuni paʻa i hoʻokomo ʻia. Hiki ke hahai ʻia e ka ʻeli ʻana a me nā lua plating e loaʻa ai ka interlayer interconnection.

CC - 4 coppercomplexer4; ʻO Edelectro-deposited photoresist kahi hana hoʻohui piha i hoʻomohala ʻia e ka hui PCK ʻAmelika ma luna o ka substrate copper-free substrate (e ʻike i ka ʻatikala kūikawā ma ka pukana 47th o ka makasina ʻike papa kaapuni no nā kikoʻī). MLC (Multilayer Ceramic) (local inter laminar through hole);PID PID (Photo imagible Dielectric) ceramic multilayer circuit boards; PTF (photosensitive media) Polymer mānoanoa kiʻiʻoniʻoni (me ka pepa paʻi kiʻiʻoniʻoni mānoanoa o ka papa kaapuni paʻi) SLC (Surface Laminar Circuits ); ʻO ka laina uhi ʻili he ʻenehana hou i paʻi ʻia e IBM Yasu Laboratory, Iapana i Iune 1993. ʻO ia kahi laina multi-layer interconnecting me ka Curtain Coating ka pena ʻōmaʻomaʻo a me ka electroplating keleawe ma waho o ka pā pālua ʻaoʻao, kahi e hoʻopau ai i ka pono. ka wili ʻana a me ka hoʻopaʻa ʻana i nā lua ma ka pā.