1. Hoʻohana ʻia ka pae ʻana o ka ea wela ma ka ʻili o ka PCB molten tin lead solder a me ke kaʻina hana hoʻoheheʻe ʻia o ka ea i hoʻopaʻa ʻia. ʻO ka hana ʻana i kahi uhi pale oxidation hiki ke hāʻawi i ka weldability maikaʻi. Hoʻokumu ka ʻea wela a me ke keleawe i ka hui keleawe-sikkim ma ka hui, me ka mānoanoa o kahi 1 a 2mil.
2. ʻO Organic Solderability Preservative (OSP) ma o ka hoʻoulu ʻana i ke kemika i kahi uhi mea ola ma ke keleawe ʻole maʻemaʻe. Hiki i kēia PCB multilayer kiʻi ke kū'ē i ka oxidation, ka wela wela, a me ka makū e pale aku i ka ʻili keleawe mai ka ʻōpala (oxidation a sulfurization, etc.) ma lalo o nā kūlana maʻamau. I ka manawa like, i ka wela welding ma hope, ua maʻalahi ka wehe ʻana o ka welding flux.

3. Ni-au kemika i uhi keleawe ili me ka manoanoa, maikai ni-au alloy uila waiwai e pale PCB multilayer papa. No ka manawa lōʻihi, ʻaʻole like me ka OSP, i hoʻohana wale ʻia ma ke ʻano he rustproof layer, hiki ke hoʻohana ʻia no ka hoʻohana lōʻihi o ka PCB a loaʻa ka mana maikaʻi. Eia kekahi, loaʻa iā ia ke ahonui kaiapuni i loaʻa ʻole i nā kaʻina hana lapaʻau ʻē aʻe.

4. Electroless kala deposition ma waena o OSP a electroless nickel / gula plating, PCB multilayer kaʻina hana maʻalahi a me ka wikiwiki.

ʻO ka ʻike ʻana i nā wahi wela, ʻūlū a haumia hoʻi e hāʻawi i ka hana uila maikaʻi a me ka weldability maikaʻi, akā ʻeleʻele. No ka mea, ʻaʻohe nickel ma lalo o ka papa kālā, ʻaʻole i loaʻa i ke kālā precipitated ka ikaika kino maikaʻi a pau o ka electroless nickel plating / gula immersion.

5. ʻO ka conductor ma ka ʻili o ka PCB multilayer board ua uhi ʻia me ke gula nickel, mua me kahi papa nickel a laila me kahi papa gula. ʻO ke kumu nui o ka nickel plating ʻo ia ka pale ʻana i ka diffusion ma waena o ke gula a me ke keleawe. ʻElua ʻano gula i hoʻopaʻa ʻia i ka nickel: gula palupalu (gula maʻemaʻe, ʻo ia hoʻi, ʻaʻole ia he ʻōlinolino) a me ke gula paʻakikī (maʻemaʻe, paʻakikī, paʻa ʻole, cobalt a me nā mea ʻē aʻe i ʻoi aku ka mālamalama). Hoʻohana nui ʻia ke gula palupalu no ka laina gula pale chip; Hoʻohana nui ʻia ke gula paʻa no ka hoʻopili uila non-welded.

6. PCB huikau ili lapaʻau 'enehana koho elua a oi ano no ka ili lapaau, maʻamau ala: nickel gula anti-oxidation, nickel plating gula precipitation nickel gula, nickel plating gula wela ea leveling, kaumaha nickel a me ke gula wela ea leveling. ʻOiai ʻaʻole koʻikoʻi ka hoʻololi ʻana o ka PCB multilayer surface treatment process a me he mea lā he mamao loa, pono e hoʻomaopopo ʻia ʻo ka lōʻihi o ka loli lohi e alakaʻi i ka loli nui. Me ka piʻi nui ʻana o ka noi no ka mālama ʻana i ke kaiapuni, ʻo ka ʻenehana lapaʻau o ka PCB e loli nui i ka wā e hiki mai ana.