ʻO nā mea pāʻani nui i ka mākeke papa paʻi paʻi ʻia ʻo TTM Technologies, Nippon Mektron Ltd, Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, a me Sumitomo Electric Industries .
ʻO ka honuapapa kaapuni paiManaʻo ka mākeke e ulu mai $ 54.30 biliona ma 2021 a i $ 58.87 biliona ma 2022 ma kahi helu ulu ulu makahiki (CAGR) o 8.4%. ʻO ka ulu nui ma muli o ka hoʻomau ʻana o nā ʻoihana i kā lākou hana a me ka hoʻololi ʻana i ka maʻamau hou i ka wā e hoʻihoʻi ana mai ka hopena COVID-19, kahi i alakaʻi mua ai i nā hana hoʻopaʻa paʻa e pili ana i ka hele ʻana o ka nohona, ka hana mamao, a me ka pani ʻana o nā hana ʻoihana i hopena ai. pilikia hana. Manaʻo ka mākeke e hōʻea i $ 71.58 biliona ma 2026 ma kahi CAGR o 5%.
Aia ka mākeke papa kaapuni paʻi i nā kūʻai ʻana o nā papa kaapuni i paʻi ʻia e nā hui (nā hui, nā mea kālepa hoʻokahi, a me nā hui ʻana) i hoʻohana ʻia no ka hoʻopili ʻana i nā mea uila a me ka uila me ka ʻole o ka hoʻohana ʻana i nā uea. ʻO nā papa kaapuni i paʻi ʻia he mau papa uila, e kōkua ana i ka hoʻopaʻa ʻana i nā ʻāpana i hoʻopaʻa ʻia i luna a i hoʻopaʻa ʻia i loko o ka hale mīkini i ka hapa nui o nā uila.
ʻO kā lākou hana nui ke kākoʻo kino a hoʻopili uila i nā mea uila ma o ka paʻi ʻana i nā ala conductive, nā alahele, a i ʻole nā ʻāpana hōʻailona ma nā ʻāpana keleawe i hoʻopili ʻia i kahi substrate non-conductive.
ʻO nā ʻano nui o nā papa kaapuni paʻiʻaoʻao hoʻokahi, ʻaoʻao ʻelua,papa-nui, High-density interconnect (HDI) a me nā mea ʻē aʻe. Hana ʻia nā PCB ʻaoʻao hoʻokahi mai loko mai o kahi papa hoʻokahi o nā mea kumu kahi i kau ʻia ai ke keleawe conductive a me nā ʻāpana ma kekahi ʻaoʻao o ka papa a hoʻopili ʻia ka uwila conductive ma kekahi ʻaoʻao.
ʻO nā substrates like ʻole he paʻakikī, hiki ke hoʻololi, rigid-flex a me nā ʻano laminate like ʻole e like me ka pepa, FR-4, polyimide, nā mea ʻē aʻe. Hoʻohana ʻia nā papa kaapuni i paʻi ʻia e nā ʻoihana hoʻohana hope e like me ka uila uila, mālama ola kino, aerospace a me ka pale, automotive, IT a me telecom, consumer electronics, a me nā mea ʻē aʻe.
ʻO Asia Pacific ka ʻāina nui loa i ka mākeke papa kaapuni paʻi ma 2021. Manaʻo ʻia ʻo Asia Pacific ʻo ia ka wikiwiki e ulu nei i ka wā wānana.
ʻO nā ʻāpana i uhi ʻia i kēia hōʻike ʻo ʻAsia-Pacific, Western Europe, ʻEulopa Hikina, ʻAmelika ʻAmelika, ʻAmelika Hema, Middle East, a me ʻApelika.
Ke manaʻo nei ka hoʻonui ʻana i ke kūʻai ʻana i nā kaʻa uila e hoʻoulu i ka ulu ʻana o ka mākeke papa paʻi paʻi i ka wā wānana. ʻO nā kaʻa uila (EVs) nā kaʻa i hoʻohana piha ʻia a ʻāpana paha e ka uila.
Hoʻohana ʻia nā papa kaapuni paʻi (PCB) e hoʻohui i nā ʻāpana uila i nā kaʻa uila, e like me nā ʻōnaehana leo maʻalahi a me nā ʻōnaehana hōʻike. Hoʻohana pū ʻia nā PCB i ka hana ʻana i nā keʻena hoʻoili, kahi e hiki ai i nā mea hoʻohana kaʻa uila ke hoʻopaʻa i kā lākou kaʻa.a
No ka laʻana, e like me ka Bloomberg New Energy Finance (BNEF), kahi hui UK e hāʻawi ana i ka nānā ʻana, nā helu, a me nā nūhou e pili ana i ka neʻe ʻana o ka ʻoihana ikehu, ua wānana ʻia nā EV e helu no 10% o ke kūʻai ʻana i nā kaʻa kaʻa kaʻa honua e 2025, e ulu ana i 28% i 2030 a me 58% i 2040
ʻO ka hoʻohana ʻana i nā mea biodegradable i nā papa kaapuni paʻi (PCBs) ke hoʻohālikelike nei i ka mākeke papa kaapuni paʻi. Ke hoʻomau nei nā mea hana i ka hoʻemi ʻana i ka ʻōpala uila ma o ka hoʻololi ʻana i nā substrates maʻamau me nā mea ʻē aʻe e pili ana i ka ékologically, hiki ke kōkua i ka hōʻemi ʻana i ka hopena o ke kaiapuni holoʻokoʻa o ka ʻenehana uila a ʻoiai hiki ke hoʻohaʻahaʻa i nā kumukūʻai hui a me nā hana hana.