ʻO ke kumu o ka plating, hōʻike ia ʻaʻole ikaika ka paʻa ʻana o ke kiʻi maloʻo a me ke keleawe foil plate, no laila ʻo ka hohonu o ka plating solution, ka hopena i ka ʻāpana "negative phase" o ka mānoanoa o ka uhi, ʻo ka hapa nui o nā mea hana PCB ke kumu o kēia mau kumu. :

1. Kiʻekiʻe a haʻahaʻa paha ka ikehu ikehu

Ma lalo o ke kukui ultraviolet, ʻo ka photoinitiator, ka mea e hoʻomoʻi i ka ikehu māmā, e wāwahi i nā radical manuahi e hoʻomaka i ka photopolymerization o nā monomers, e hana ana i nā molekala kino i hiki ʻole ke hoʻoheheʻe ʻia i ka hopena alkali.
Ma lalo o ka hoʻolaha ʻana, ma muli o ka polymerization incomplete, i ka wā o ka hoʻomohala ʻana, pehu a palupalu ke kiʻiʻoniʻoni, e hopena i nā laina ʻike ʻole a hiki i ka papa kiʻiʻoniʻoni, e hopena i ka hui maikaʻi ʻole o ke kiʻiʻoniʻoni a me ke keleawe;
Inā ʻoi aku ka nui o ka hoʻolaha ʻana, e hoʻopilikia ia i ka hoʻomohala ʻana, akā i ke kaʻina hana electroplating e hoʻopuka i ka peel warped, ka hoʻokumu ʻana o ka plating.
No laila, he mea nui e ho'omalu i ka ikehu ho'olaha.

2. Kiʻekiʻe a haʻahaʻa paha kiʻiʻoniʻoni

Ke haʻahaʻa loa ka paʻi kiʻiʻoniʻoni, ʻaʻole i kūlike ka ʻili o ke kiʻiʻoniʻoni a i ʻole ke ākea ma waena o ka kiʻiʻoniʻoni maloʻo a me ka pā keleawe i nā koi o ka ikaika paʻa;
Inā kiʻekiʻe loa ka paʻi kiʻiʻoniʻoni, ʻoi aku ka maikaʻi o ka solvent a me nā ʻāpana o ka corrosion resistance layer, ka hopena i ke kiʻi maloʻo e lilo i brittle, electroplating shock e lilo i ka peeling.

3. Kiʻekiʻe a haʻahaʻa kiʻi wela wela

Inā haʻahaʻa loa ke kiʻi ʻoniʻoni, no ka mea, ʻaʻole hiki ke hoʻomaʻamaʻa piha ʻia ke kiʻi kūʻē corrosion a me ke kahe kūpono, ʻo ia ka hopena o ke kiʻiʻoniʻoni maloʻo a me ka adhesion laminate ʻaʻahu keleawe he ʻilihune;
Inā kiʻekiʻe loa ka mahana ma muli o ka evaporation wikiwiki o ka mea hoʻoheheʻe a me nā mea ʻē aʻe i loko o ka huʻi kūʻē corrosion, a lilo ke kiʻi maloʻo i brittle, i ka electroplating haʻalulu hoʻokumu o warping peel, ka hopena i ka percolation.