I ka makahiki 2023, ua hāʻule ka waiwai o ka ʻoihana PCB honua i nā kālā US e 15.0% makahiki-ma-makahiki.
I ka manawa waena a me ka lōʻihi, e mālama ka ʻoihana i ka ulu paʻa. ʻO ka manaʻo nui o ka ulu ʻana o ka makahiki o ka PCB honua mai 2023 a 2028 he 5.4%. Mai kahi hiʻohiʻona kūloko, ua hōʻike ka ʻoihana #PCB ma nā wahi āpau o ka honua i ka ulu mau ʻana. Mai ka hiʻohiʻona o ka hoʻolālā huahana, ʻo ka substrate pack, ka papa multi-layer kiʻekiʻe me 18 mau papa a ma luna, a me ka papa HDI e mālama i kahi kiʻekiʻe kiʻekiʻe o ka ulu ʻana, a ʻo ka ulu ʻana o ka hui i nā makahiki ʻelima e hiki mai ana he 8,8%, 7,8%. , a me 6.2%, pakahi.
No nā huahana substrate packaging, ma ka ʻaoʻao hoʻokahi, ka naʻauao akamai, ka helu kapuaʻi, ka hoʻokele akamai, ka pūnaewele o nā mea āpau a me nā huahana ʻē aʻe ka hoʻonui ʻana i ka ʻenehana a me ka hoʻonui ʻana i ka hiʻohiʻona noiʻi, e hoʻokele ana i ka ʻoihana uila i nā chips kiʻekiʻe a me ka ulu ʻana o ka hoʻonui ʻana i ka ulu ʻana, no laila ke alakaʻi nei. ka ʻoihana substrate packaging honua e mālama i ka ulu lōʻihi. ʻO ka mea kūikawā, ua hoʻolaha ʻo ia i nā huahana substrate packaging kiʻekiʻe i hoʻohana ʻia i ka mana computing kiʻekiʻe, hoʻohui a me nā hiʻohiʻona ʻē aʻe e hōʻike i kahi ulu ulu kiʻekiʻe. Ma ka ʻaoʻao ʻē aʻe, ʻo ka piʻi ʻana o ka home i ke kākoʻo no ka hoʻomohala ʻana i ka ʻoihana semiconductor, a me ka hoʻonui ʻana i ka hoʻopukapuka pili e hoʻonui i ka hoʻomohala ʻana o ka ʻoihana substrate packaging home. I ka wā pōkole, ʻoiai e hoʻi mālie ana nā mea hana semiconductor hope i nā pae maʻamau, ke manaʻo nei ka World Semiconductor Trade Statistics Organization (ma hope i kapa ʻia ʻo "WSTS") e ulu ka mākeke semiconductor honua e 13.1% i 2024.
No nā huahana PCB, nā mākeke e like me ke kikowaena a me ka mālama ʻana i ka ʻikepili, kamaʻilio, ka ikehu hou a me ka hoʻokele akamai, a me nā mea uila uila e hoʻomau i nā mea hoʻokele ulu lōʻihi no ka ʻoihana. Mai ka hiʻohiʻona o ke ao, me ka wikiwiki o ka hoʻomohala ʻana o ka naʻauao artificial, ke koi nui nei ka ʻoihana ICT no ka mana computing kiʻekiʻe a me nā ʻoihana kiʻekiʻe kiʻekiʻe, e alakaʻi ana i ka ulu wikiwiki o ka noi no ka nui-nui, kiʻekiʻe kiʻekiʻe, kiʻekiʻe-frequency a kiʻekiʻe-wikiwiki, kiʻekiʻe-pae HDI, a me ka wela kiʻekiʻe PCB huahana. Mai ka hiʻohiʻona o ka manaʻo, me AI i nā kelepona paʻalima, PCS, ʻaʻahu akamai, IOT a me nā hana ʻē aʻe
Me ka hoʻomau mau ʻana o ka noi ʻana o nā huahana, ʻo ke koi no ka hiki ke hoʻopili ʻia a me ka wikiwiki o ka hoʻololi ʻana i ka ʻikepili a me ka hoʻouna ʻana i nā noi terminal i hoʻomaka i ka ulu pahū. Ke alakaʻi ʻia nei e ke ʻano o luna, ke koi nei no ke alapine kiʻekiʻe, ka wikiwiki kiʻekiʻe, ka hoʻohui ʻana, ka miniaturization, ka lahilahi a me ka māmā, ka wela wela kiʻekiʻe a me nā huahana PCB e pili ana i nā lako uila terminal e hoʻomau nei e ulu.