Kumu: Hoʻokumu ʻia kahi kiʻiʻoniʻoni kūlohelohe ma ka ʻili keleawe o ka papa kaapuni, kahi e pale pono ai i ka ʻili o ke keleawe hou, a hiki ke pale aku i ka oxidation a me ka pollution i nā wela kiʻekiʻe. Hoʻomalu ʻia ka mānoanoa kiʻiʻoniʻoni OSP ma 0.2-0.5 microns.

1. Ke kahe kaʻina hana: degreasing → holoi wai → micro-erosion → holoi wai → holoi wai → holoi wai maʻemaʻe → OSP → holoi wai maʻemaʻe → maloʻo.

2. Nā ʻano o nā mea OSP: Rosin, Active Resin a me Azole. ʻO nā mea OSP i hoʻohana ʻia e Shenzhen United Circuits i kēia manawa i hoʻohana nui ʻia nā OSP azole.

He aha ka OSP ili lapaʻau kaʻina hana o ka PCB papa?

3. Nā hiʻohiʻona: palahalaha maikaʻi, ʻaʻohe IMC i hoʻokumu ʻia ma waena o ke kiʻi ʻoniʻoni OSP a me ke keleawe o ka papa kaapuni, e ʻae ana i ke kūʻai pololei ʻana o ka solder a me ke keleawe kaʻapuni i ka wā e kūʻai aku ai (maikaʻi wettability), haʻahaʻa haʻahaʻa hana ʻenehana, haʻahaʻa kumu kūʻai. ) No ka HASL), hoʻohana ʻia ka ikehu liʻiliʻi i ka wā o ka hana ʻana, a me nā mea ʻē aʻe. Hoʻopuka ʻo PCB Proofing Yoko board i nā hemahema: ① paʻakikī ka nānā ʻana i nā hiʻohiʻona, ʻaʻole kūpono no ka hoʻoheheʻe hou ʻana (e koi pinepine ʻia ʻekolu manawa); ② ʻO ka ʻili kiʻiʻoniʻoni OSP he maʻalahi ke ʻohi; ③ ʻoi aku ka kiʻekiʻe o nā pono o ka mālama ʻana; ④ pōkole ka manawa mālama.

4. Keʻano o ka mālamaʻana a me ka manawa: 6 mau mahina i loko o ka pahu pahu (ka mahana 15-35 ℃, humidity RH≤60%).

5. Pono ka pae SMT: ① Pono e mālama ʻia ka papa kaapuni OSP ma ka haʻahaʻa haʻahaʻa a me ka haʻahaʻa haʻahaʻa (ka mahana 15-35 ° C, humidity RH ≤60%) a pale i ka ʻike ʻana i ke kaiapuni piha me ke kinoea waikawa, a hoʻomaka ka hui i loko o 48 mau hola ma hope o ka wehe ʻana i ka pūʻolo OSP; ② Manaʻo ʻia e hoʻohana iā ia i loko o 48 mau hola ma hope o ka pau ʻana o ka ʻāpana ʻaoʻao hoʻokahi, a ua ʻōlelo ʻia e mālama iā ia i loko o kahi keʻena haʻahaʻa haʻahaʻa ma kahi o ka pahu pahu;