3 Nā koi wela a me ka wela kiʻekiʻe

Me ka liʻiliʻi, ka hana kiʻekiʻe, a me ka hana wela kiʻekiʻe o nā lako uila, hoʻomau ka hoʻokele ʻana o ka wela o nā lako uila, a ʻo kekahi o nā hopena i koho ʻia ʻo ka hoʻomohala ʻana i nā papa kaapuni paʻi thermally conductive.ʻO ke kūlana mua no nā PCB pale wela a me ka wela ka wela a me ka wela o ka substrate.I kēia manawa, ua hoʻomaikaʻi ka hoʻomaikaʻi ʻana i ka mea kumu a me ka hoʻohui ʻana i nā mea hoʻopihapiha i nā mea wela a me ka wela i kekahi ʻano, akā ʻo ka hoʻomaikaʻi ʻana i ka conductivity thermal i kaupalena ʻia.ʻO ka mea maʻamau, hoʻohana ʻia kahi substrate metala (IMS) a i ʻole ka papa kaapuni i paʻi ʻia e hoʻopau i ka wela o ka mea hoʻomehana, e hōʻemi ana i ka leo a me ke kumukūʻai i hoʻohālikelike ʻia me ka radiator kuʻuna a me ka hoʻoluʻu pā.

ʻO ka alumini he mea nani loa.He nui nā kumu waiwai, haʻahaʻa kumu kūʻai, maikaʻi thermal conductivity a me ka ikaika, a pili kaiapuni.I kēia manawa, ʻo ka hapa nui o nā substrate metala a i ʻole nā ​​​​core metala he alumini metala.ʻO nā mea maikaʻi o nā papa kaapuni i hoʻokumu ʻia i ka alumini he maʻalahi a me ka hoʻokele waiwai, nā pilina uila hilinaʻi, kiʻekiʻe thermal conductivity a me ka ikaika, solder-free a me ke alakaʻi ʻole ka mālama ʻana i ke kaiapuni, etc. a me ka lewa.ʻAʻohe kānalua e pili ana i ka conductivity thermal a me ke kūpaʻa wela o ka substrate metala.Aia ke kī i ka hana ʻana o ka mea hoʻopili insulating ma waena o ka pā metala a me ka papa kaapuni.

I kēia manawa, pili ka ikaika o ka hoʻokele wela i nā LED.Ma kahi kokoke i 80% o ka mana hoʻokomo o nā LED e hoʻololi ʻia i ka wela.No laila, ʻo ka pilikia o ka hoʻokele wela o nā LED he waiwai nui, a ʻo ka manaʻo e pili ana i ka hoʻopau ʻana o ka wela o ka substrate LED.ʻO ka hoʻohui ʻana o nā mea wela wela a me ka hoʻonaninani ʻana i ka wela wela e hoʻokumu i ke kumu no ke komo ʻana i ka mākeke kukui LED kiʻekiʻe.

4 ʻO nā lako uila maʻalahi a paʻi ʻia a me nā koi ʻē aʻe

4.1 Nā koi papa maʻalahi

ʻO ka liʻiliʻi a me ka lahilahi o nā mea uila e hoʻohana i ka nui o nā papa kaapuni paʻi hiki ke maʻalahi (FPCB) a me nā papa kaapuni paʻi paʻa (R-FPCB).ʻO ka mākeke FPCB honua i kēia manawa ua manaʻo ʻia e pili ana i 13 biliona kālā ʻAmelika, a ʻoi aku ka nui o ka ulu ʻana o ka makahiki ma mua o nā PCB paʻa.

Me ka hoʻonui ʻana o ka noi, ma kahi o ka hoʻonui ʻana i ka helu, e nui nā koi hana hou.Loaʻa nā kiʻiʻoniʻoni Polyimide i ka waihoʻoluʻu a me ke aniani, keʻokeʻo, ʻeleʻele, a me ka melemele, a loaʻa ke kūpaʻa wela kiʻekiʻe a me nā waiwai CTE haʻahaʻa, i kūpono i nā manawa like ʻole.Loaʻa i nā substrates kiʻi polyester kumu kūʻai i ka mākeke.ʻO nā luʻina hana hou e pili ana i ka elasticity kiʻekiʻe, ke kūpaʻa dimensional, ka maikaʻi o ka ʻili kiʻiʻoniʻoni, a me ka hoʻohui ʻana i ka photoelectric kiʻiʻoniʻoni a me ke kūpaʻa kūlohelohe e hoʻokō i nā koi loli mau o nā mea hoʻohana hope.

Pono nā FPCB a me nā papa HDI koʻikoʻi e hoʻokō i nā koi o ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe a me ka wikiwiki.Pono e nānā pono ʻia ka nalowale o ka dielectric mau a me ka dielectric o nā substrates maʻalahi.Hiki ke hoʻohana ʻia ka polytetrafluoroethylene a me nā substrate polyimide kiʻekiʻe e hana i ka maʻalahi.Kaapuni.ʻO ka hoʻohui ʻana i ka pauka inorganic a me ka hoʻopiha ʻana i ka carbon fiber i ka resin polyimide hiki ke hana i kahi ʻano papa ʻekolu o ka substrate thermally conductive maʻalahi.ʻO nā mea hoʻopihapiha inorganic i hoʻohana ʻia he alumini nitride (AlN), alumini ʻokikene (Al2O3) a me hexagonal boron nitride (HBN).ʻO ka substrate he 1.51W/mK thermal conductivity a hiki ke kū i ka 2.5kV kū i ka volta a me 180 degere bending test.

ʻO nā mākeke noi FPCB, e like me nā kelepona akamai, nā mea hiki ke hoʻohana ʻia, nā mea lapaʻau, nā robots, a me nā mea ʻē aʻe, e hoʻopuka i nā koi hou i ka hoʻolālā hana o FPCB, a hoʻomohala i nā huahana FPCB hou.E like me ka ultra-thin flexible multilayer board, ʻehā-layer FPCB ua hoʻemi ʻia mai ka 0.4mm maʻamau i kahi 0.2mm;kiʻekiʻe-wikiwiki hoʻololi papa maʻalahi, me ka haʻahaʻa-Dk a me ka haʻahaʻa-Df polyimide substrate, e hiki i 5Gbps ka hoʻouna wikiwiki koi;nui Ke hoʻohana nei ka papa hoʻololi mana i kahi conductor ma luna o 100μm e hoʻokō i nā pono o ka mana kiʻekiʻe a me nā kaapuni kiʻekiʻe;ʻO ka papa hoʻoheheʻe wela kiʻekiʻe he R-FPCB e hoʻohana ana i kahi substrate metala ma kahi hapa;ʻO ka papa maʻalahi maʻalahi ke kaomi ʻia ʻO ka membrane a me ka electrode i hoʻopaʻa ʻia ma waena o nā kiʻiʻoniʻoni polyimide ʻelua e hana i kahi ʻike maʻalahi maʻalahi;ʻO ka papa hoʻopololei hiki ke hoʻopololei a i ʻole ka papa ʻoʻoleʻa, he elastomer ka substrate hikiwawe, a ua hoʻomaikaʻi ʻia ke ʻano o ke ʻano uea metala e hiki ke hoʻopololei.ʻOiaʻiʻo, pono kēia mau FPCB kūikawā i nā substrate maʻamau.

4.2 Paʻi ʻia nā pono uila

Ua loaʻa ka ikaika o nā mea uila i paʻi ʻia i nā makahiki i hala iho nei, a ua wānana ʻia ma ka waena o 2020s, e loaʻa ana ka mākeke o nā mea uila i paʻi ʻia ma mua o 300 biliona kālā ʻAmelika.ʻO ka hoʻohana ʻana i ka ʻenehana uila i paʻi ʻia i ka ʻoihana kaapuni paʻi he ʻāpana o ka ʻenehana kaapuni paʻi, i lilo i mea ʻae i ka ʻoihana.ʻO ka ʻenehana uila paʻi ka mea kokoke loa iā FPCB.I kēia manawa ua hoʻopukapuka nā mea hana PCB i nā mea uila paʻi.Ua hoʻomaka lākou me nā papa maʻalahi a hoʻololi i nā papa kaapuni paʻi (PCB) me nā kaapuni uila paʻi (PEC).I kēia manawa, nui nā substrates a me nā mea ʻīnika, a i ka manawa e loaʻa ai nā holomua i ka hana a me ke kumukūʻai, e hoʻohana nui ʻia lākou.ʻAʻole pono nā mea hana PCB e haʻalele i ka manawa.

ʻO ka noi nui o nā mea uila i paʻi ʻia ʻo ia ka hana ʻana i nā hōʻailona radio frequency identification (RFID) haʻahaʻa, hiki ke paʻi ʻia ma nā ʻōwili.Aia ka mea hiki i nā wahi o nā hōʻike paʻi, nā kukui, a me nā photovoltaics organik.ʻO ka mākeke ʻenehana hiki ke hoʻohana ʻia i kēia manawa he mākeke maikaʻi e puka mai ana.ʻO nā huahana like ʻole o ka ʻenehana hiki ke hoʻohana ʻia, e like me nā lole akamai a me nā aniani haʻuki akamai, nā mākaʻikaʻi hana, nā mea ʻike hiamoe, nā wati akamai, hoʻonui ʻia nā headset realistic, nā panana hoʻokele, a me nā mea ʻē aʻe. kaapuni uila paʻi.

ʻO kahi ʻano koʻikoʻi o ka ʻenehana uila i paʻi ʻia he mau mea, me nā substrate a me nā inika hana.ʻAʻole kūpono nā substrate maʻalahi no nā FPCB i loaʻa, akā no nā substrate hana kiʻekiʻe.I kēia manawa, aia nā mea substrate kiʻekiʻe-dielectric i haku ʻia me ka hui ʻana o nā seramika a me nā resins polymer, a me nā substrate wela kiʻekiʻe, nā substrate haʻahaʻa haʻahaʻa a me nā substrate ʻaʻohe kala., Papa melemele, etc.

4 ʻO nā lako uila maʻalahi a paʻi ʻia a me nā koi ʻē aʻe

4.1 Nā koi papa maʻalahi

ʻO ka liʻiliʻi a me ka lahilahi o nā mea uila e hoʻohana i ka nui o nā papa kaapuni paʻi hiki ke maʻalahi (FPCB) a me nā papa kaapuni paʻi paʻa (R-FPCB).ʻO ka mākeke FPCB honua i kēia manawa ua manaʻo ʻia e pili ana i 13 biliona kālā ʻAmelika, a ʻoi aku ka nui o ka ulu ʻana o ka makahiki ma mua o nā PCB paʻa.

Me ka hoʻonui ʻana o ka noi, ma kahi o ka hoʻonui ʻana i ka helu, e nui nā koi hana hou.Loaʻa nā kiʻiʻoniʻoni Polyimide i ka waihoʻoluʻu a me ke aniani, keʻokeʻo, ʻeleʻele, a me ka melemele, a loaʻa ke kūpaʻa wela kiʻekiʻe a me nā waiwai CTE haʻahaʻa, i kūpono i nā manawa like ʻole.Loaʻa i nā substrates kiʻi polyester kumu kūʻai i ka mākeke.ʻO nā luʻina hana hou e pili ana i ka elasticity kiʻekiʻe, ke kūpaʻa dimensional, ka maikaʻi o ka ʻili kiʻiʻoniʻoni, a me ka hoʻohui ʻana i ka photoelectric kiʻiʻoniʻoni a me ke kūpaʻa kūlohelohe e hoʻokō i nā koi loli mau o nā mea hoʻohana hope.

Pono nā FPCB a me nā papa HDI koʻikoʻi e hoʻokō i nā koi o ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe a me ka wikiwiki.Pono e nānā pono ʻia ka nalowale o ka dielectric mau a me ka dielectric o nā substrates maʻalahi.Hiki ke hoʻohana ʻia ka polytetrafluoroethylene a me nā substrate polyimide kiʻekiʻe e hana i ka maʻalahi.Kaapuni.ʻO ka hoʻohui ʻana i ka pauka inorganic a me ka hoʻopiha ʻana i ka carbon fiber i ka resin polyimide hiki ke hana i kahi ʻano papa ʻekolu o ka substrate thermally conductive maʻalahi.ʻO nā mea hoʻopihapiha inorganic i hoʻohana ʻia he alumini nitride (AlN), alumini ʻokikene (Al2O3) a me hexagonal boron nitride (HBN).ʻO ka substrate he 1.51W/mK thermal conductivity a hiki ke kū i ka 2.5kV kū i ka volta a me 180 degere bending test.

ʻO nā mākeke noi FPCB, e like me nā kelepona akamai, nā mea hiki ke hoʻohana ʻia, nā mea lapaʻau, nā robots, a me nā mea ʻē aʻe, e hoʻopuka i nā koi hou i ka hoʻolālā hana o FPCB, a hoʻomohala i nā huahana FPCB hou.E like me ka ultra-thin flexible multilayer board, ʻehā-layer FPCB ua hoʻemi ʻia mai ka 0.4mm maʻamau i kahi 0.2mm;kiʻekiʻe-wikiwiki hoʻololi papa maʻalahi, me ka haʻahaʻa-Dk a me ka haʻahaʻa-Df polyimide substrate, e hiki i 5Gbps ka hoʻouna wikiwiki koi;nui Ke hoʻohana nei ka papa hoʻololi mana i kahi conductor ma luna o 100μm e hoʻokō i nā pono o ka mana kiʻekiʻe a me nā kaapuni kiʻekiʻe;ʻO ka papa hoʻoheheʻe wela kiʻekiʻe he R-FPCB e hoʻohana ana i kahi substrate metala ma kahi hapa;ʻO ka papa maʻalahi maʻalahi ke kaomi ʻia ʻO ka membrane a me ka electrode i hoʻopaʻa ʻia ma waena o nā kiʻiʻoniʻoni polyimide ʻelua e hana i kahi ʻike maʻalahi maʻalahi;ʻO ka papa hoʻopololei hiki ke hoʻopololei a i ʻole ka papa paʻa paʻa, he elastomer ka substrate hikiwawe, a hoʻomaikaʻi ʻia ke ʻano o ke ʻano uea metala i hiki ke hoʻopololei.ʻOiaʻiʻo, pono kēia mau FPCB kūikawā i nā substrate maʻamau.

4.2 Paʻi ʻia nā pono uila

Ua loaʻa ka ikaika o nā mea uila i paʻi ʻia i nā makahiki i hala iho nei, a ua wānana ʻia ma ka waena o 2020s, e loaʻa ana ka mākeke o nā mea uila i paʻi ʻia ma mua o 300 biliona kālā ʻAmelika.ʻO ka hoʻohana ʻana i ka ʻenehana uila i paʻi ʻia i ka ʻoihana kaapuni paʻi he ʻāpana o ka ʻenehana kaapuni paʻi, i lilo i mea ʻae i ka ʻoihana.ʻO ka ʻenehana uila paʻi ka mea kokoke loa iā FPCB.I kēia manawa ua hoʻopukapuka nā mea hana PCB i nā mea uila paʻi.Ua hoʻomaka lākou me nā papa maʻalahi a hoʻololi i nā papa kaapuni paʻi (PCB) me nā kaapuni uila paʻi (PEC).I kēia manawa, nui nā substrates a me nā mea ʻīnika, a i ka manawa e loaʻa ai nā holomua i ka hana a me ke kumukūʻai, e hoʻohana nui ʻia lākou.ʻAʻole pono nā mea hana PCB e haʻalele i ka manawa.

ʻO ka noi nui o nā mea uila i paʻi ʻia ʻo ia ka hana ʻana i nā hōʻailona radio frequency identification (RFID) haʻahaʻa, hiki ke paʻi ʻia ma nā ʻōwili.Aia ka mea hiki i nā wahi o nā hōʻike paʻi, nā kukui, a me nā photovoltaics organik.ʻO ka mākeke ʻenehana hiki ke hoʻohana ʻia i kēia manawa he mākeke maikaʻi e puka mai ana.ʻO nā huahana like ʻole o ka ʻenehana hiki ke hoʻohana ʻia, e like me nā lole akamai a me nā aniani haʻuki akamai, nā mākaʻikaʻi hana, nā mea ʻike hiamoe, nā wati akamai, hoʻonui ʻia nā headset realistic, nā panana hoʻokele, a me nā mea ʻē aʻe. kaapuni uila paʻi.

ʻO kahi ʻano koʻikoʻi o ka ʻenehana uila i paʻi ʻia he mau mea, me nā substrate a me nā inika hana.ʻAʻole kūpono nā substrate maʻalahi no nā FPCB i loaʻa, akā no nā substrate hana kiʻekiʻe.I kēia manawa, aia nā mea substrate kiʻekiʻe-dielectric i haku ʻia me ka hui ʻana o nā seramika a me nā resins polymer, a me nā substrates kiʻekiʻe-mehana, nā substrate haʻahaʻa haʻahaʻa a me nā substrates transparent colorless., substrate Yellow, etc.