ʻO nā hiʻohiʻona kumu o ka papa kaapuni paʻi e pili ana i ka hana o ka papa substrate.No ka hoʻomaikaʻi ʻana i ka hana ʻenehana o ka papa kaapuni paʻi, pono e hoʻomaikaʻi mua ʻia ka hana o ka papa substrate kaapuni paʻi.I mea e hoʻokō ai i nā pono o ka hoʻomohala ʻana o ka papa kaapuni paʻi, nā mea hou like ʻole Ke hoʻomohala mālie ʻia a hoʻohana ʻia.

I nā makahiki i hala iho nei, ua hoʻololi ka mākeke PCB i kāna manaʻo mai nā kamepiula i nā kamaʻilio, me nā kahua kahua, nā kikowaena, a me nā terminal mobile.ʻO nā polokalamu kelepona kelepona i hōʻike ʻia e nā smartphones ua alakaʻi i nā PCB i ke kiʻekiʻe kiʻekiʻe, ʻoi aku ka lahilahi, a me ka hana kiʻekiʻe.ʻAʻole hiki ke hoʻokaʻawale ʻia ka ʻenehana kaapuni paʻi mai nā mea substrate, e pili pū ana i nā koi ʻenehana o nā substrate PCB.Hoʻonohonoho ʻia nā ʻike pili o nā mea substrate i kahi ʻatikala kūikawā no ka ʻoihana ʻoihana.

1 ʻO ke koi no ke kiʻekiʻe kiʻekiʻe a me ka laina laina

1.1 Koi no ke keleawe foil

Ke ulu nei nā PCB i ka hoʻomohala kiʻekiʻe a me ka laina lahilahi, a ʻoi aku ka nui o nā papa HDI.He ʻumi makahiki i hala aku nei, ua wehewehe ʻo IPC i ka papa HDI e like me ka laulā laina/laina laina (L/S) o 0.1mm/0.1mm a ma lalo.I kēia manawa, hoʻokō ka ʻoihana i kahi L / S maʻamau o 60μm, a me kahi L / S holomua o 40μm.ʻO ka mana o Iapana i ka makahiki 2013 o ka ʻike alanui ʻenehana hoʻonohonoho ʻana i ka makahiki 2014, ʻo ka L / S maʻamau o ka papa HDI he 50μm, ʻo ka L / S kiʻekiʻe he 35μm, a ʻo ka L / S i hoʻāʻo ʻia he 20μm.

ʻO ka hoʻokumu ʻana i nā kumu hoʻohālike PCB, ke kaʻina hana etching kemika maʻamau (subtractive method) ma hope o ke kiʻi ʻana ma ka substrate copper foil, ʻo ka palena haʻahaʻa o ke ʻano subtractive no ka hana ʻana i nā laina maikaʻi ma kahi o 30μm, a koi ʻia ka substrate keleawe lahilahi (9 ~ 12μm).Ma muli o ke kumu kūʻai kiʻekiʻe o ka CCL copper copper foil a me ka nui o nā hemahema i ka lamination copper copper foil lamination, nui nā hale hana i hana i 18μm copper foil a laila hoʻohana i ka etching e hoʻoheheʻe i ka papa keleawe i ka wā hana.He nui nā kaʻina hana o kēia ʻano, ka mana mānoanoa paʻakikī, a me ke kumukūʻai kiʻekiʻe.ʻOi aku ka maikaʻi o ka hoʻohana ʻana i ka foil keleawe lahilahi.Eia hou, ke emi iho ka PCB kaapuni L/S ma mua o 20μm, paʻakikī ka paʻakikī o ka pahu keleawe lahilahi.Pono ia i kahi ʻāpana keleawe ultra-thin (3~5μm) substrate a me kahi pahu keleawe ultra-thin i hoʻopili ʻia i ka mea lawe.

Ma waho aʻe o nā pahu keleawe lahilahi, pono nā laina maikaʻi o kēia manawa i ka haʻahaʻa haʻahaʻa ma ka ʻili o ka ʻili keleawe.ʻO ka maʻamau, i mea e hoʻomaikaʻi ai i ka ikaika hoʻopaʻa ma waena o ka pahu keleawe a me ka substrate a me ka hōʻoia ʻana i ka ikaika o ka ʻili ʻana o ka conductor, ua hoʻopaʻa ʻia ka papa keleawe keleawe.ʻOi aku ka roughness o ka foil keleawe maʻamau ma mua o 5μm.ʻO ka hoʻokomo ʻana i nā piko koʻikoʻi o ka copper foil i loko o ka substrate e hoʻomaikaʻi i ka pale ʻana i ka peeling, akā i mea e hoʻomalu ai i ka pololei o ka uea i ka wā o ka laina etching, maʻalahi ka waiho ʻana i nā peaks substrate embedding, e hana ana i nā pōkole pōkole ma waena o nā laina a i ʻole ka hoʻohaʻahaʻa ʻana. , he mea nui loa ia no nā laina maikaʻi.He koʻikoʻi ka laina.No laila, koi ʻia nā pahu keleawe me ka haʻahaʻa haʻahaʻa (emi ma mua o 3 μm) a me ka haʻahaʻa haʻahaʻa (1.5 μm).

1.2 ʻO ke koi no nā pepa dielectric laminated

ʻO ka hiʻohiʻona ʻenehana o ka papa HDI ʻo ke kaʻina hana kūkulu (BuildingUpProcess), ka mea maʻamau i hoʻohana ʻia i ka resin-coated copper foil (RCC), a i ʻole ka papa laminated o ka lole aniani epoxy semi-cured a me ka pahu keleawe he paʻakikī ke hoʻokō i nā laina maikaʻi.I kēia manawa, hoʻohana ʻia ke ʻano semi-additive (SAP) a i ʻole ka hoʻomaikaʻi ʻana i ke ʻano semi-processed method (MSAP), ʻo ia hoʻi, hoʻohana ʻia kahi kiʻiʻoniʻoni dielectric insulating no ka hoʻopaʻa ʻana, a laila hoʻohana ʻia ka pā keleawe electroless e hana i ke keleawe. papa alakaʻi.No ka mea he lahilahi loa ka papa keleawe, maʻalahi ke hana i nā laina maikaʻi.

ʻO kekahi o nā mea nui o ke ʻano semi-additive ʻo ia ka mea dielectric laminated.I mea e hoʻokō ai i nā koi o nā laina kiʻekiʻe kiʻekiʻe, hoʻopuka ka mea laminated i nā koi o nā waiwai uila dielectric, insulation, heat resistance, bonding force, etc., a me ke kaʻina adaptability o ka papa HDI.I kēia manawa, ʻo ka honua HDI laminated media material ka nui o nā huahana ABF/GX series o Japan Ajinomoto Company, e hoʻohana ana i ka resin epoxy me nā mea hoʻōla ʻē aʻe e hoʻohui i ka pauka inorganic e hoʻomaikaʻi i ka rigidity o ka mea a hoʻemi i ka CTE, a me ka lole aniani. hoʻohana ʻia e hoʻonui i ka rigidity..Aia pū kekahi mau mea laminate kiʻiʻoniʻoni lahilahi o Sekisui Chemical Company o Iapana, a ua kūkulu pū ʻo Taiwan Industrial Technology Research Institute i ia mau mea.Hoʻomaikaʻi mau ʻia a hoʻomohala ʻia nā mea ABF.ʻO ka hanauna hou o nā mea laminated e koi pono i ka haʻahaʻa haʻahaʻa o ka ʻili, ka hoʻonui haʻahaʻa haʻahaʻa, ka poho dielectric haʻahaʻa, a me ka hoʻoikaika ikaika.

I loko o ka pōʻai semiconductor honua, ua hoʻololi nā substrates IC packaging i nā substrate seramika me nā substrates organik.Ke liʻiliʻi a liʻiliʻi ka pitch o nā mea hoʻopili pahu pahu flip (FC).I kēia manawa, ʻo 15μm ka laulā laina maʻamau, a ʻoi aku ka lahilahi i ka wā e hiki mai ana.ʻO ka hana o ka mea halihali multi-layer e koi nui i nā waiwai dielectric haʻahaʻa, haʻahaʻa haʻahaʻa hoʻonui hoʻonui a me ke kūpaʻa wela kiʻekiʻe, a me ka ʻimi ʻana i nā substrates haʻahaʻa ma ke kumu o ka hālāwai ʻana i nā pahuhopu hana.I kēia manawa, hoʻohana maoli ka hana nui o nā kaʻa kaʻa i ke kaʻina MSPA o ka insulation laminated a me ka foil keleawe lahilahi.E hoʻohana i ke ʻano SAP no ka hana ʻana i nā hiʻohiʻona kaapuni me L/S ma lalo o 10μm.

I ka lilo ʻana o nā PCB i ʻoi aku ka denser a me ka lahilahi, ua ulu ka ʻenehana papa HDI mai nā laminates koʻikoʻi i ka coreless Anylayer interconnection laminates (Anylayer).ʻOi aku ka maikaʻi o nā papa HDI laminate pili like me ka hana like ma mua o nā papa HDI laminate i loko.Hiki ke hoʻemi ʻia ka ʻāpana a me ka mānoanoa ma kahi o 25%.Pono kēia mau mea e hoʻohana i ka thinner a mālama i nā waiwai uila maikaʻi o ka papa dielectric.

2 Ke alapine kiʻekiʻe a me ka wikiwiki wikiwiki

ʻO ka ʻenehana kamaʻilio uila mai ka uea a hiki i ka uea, mai ke alapine haʻahaʻa a me ka wikiwiki haʻahaʻa a hiki i ke alapine kiʻekiʻe a me ka wikiwiki kiʻekiʻe.Ua komo ka hana kelepona paʻa i kēia manawa i ka 4G a e neʻe i ka 5G, ʻo ia hoʻi, ʻoi aku ka wikiwiki o ka hoʻouna ʻana a me ka nui o ka hiki ke hoʻouna.ʻO ka hiki ʻana mai o ke au o ke ao ʻeleu ʻana ua pāpālua i ka hele ʻana o ka ʻikepili, a ʻo nā mea kamaʻilio kiʻekiʻe a me ka wikiwiki kiʻekiʻe he ʻano hiki ʻole ke pale ʻia.He kūpono ka PCB no ka hoʻouna ʻana i ka wikiwiki a me ka wikiwiki.Ma waho aʻe o ka ho'ēmiʻana i ka hōʻailona hōʻailona a me ka poho i ka hoʻolālā kaapuni, ka mālamaʻana i ka pono o ka hōʻailona, ​​a me ka mālamaʻana i ka hana PCB e hoʻokō i nā koi hoʻolālā, he mea nui ka loaʻaʻana o kahi substrate kiʻekiʻe.

I mea e hoʻoponopono ai i ka pilikia o ka hoʻonui ʻana o ka PCB i ka wikiwiki a me ka hōʻailona hōʻailona, ​​​​nā mea hoʻolālā hoʻolālā e kālele nui i nā waiwai hōʻailona uila.ʻO nā kumu koʻikoʻi no ke koho ʻana i ka substrate ʻo ia ka dielectric mau (Dk) a me ka dielectric loss (Df).Ke emi iho ka Dk ma mua o 4 a me Df0.010, he laminate Dk/Df ia, a ke emi iho ka Dk ma mua o 3.7 a me ka Df0.005, he laminates papa Dk/Df ha'aha'a, i kēia manawa aia nā ʻano substrate. e komo i ka makeke e koho mai.

I kēia manawa, ʻo ka mea maʻamau i hoʻohana pinepine ʻia i nā substrate papa kaapuni kiʻekiʻe ka nui o nā resins fluorine, polyphenylene ether (PPO a i ʻole PPE) resins a me nā resins epoxy i hoʻololi ʻia.ʻO nā substrate dielectric e pili ana i ka fluorine, e like me polytetrafluoroethylene (PTFE), loaʻa nā waiwai dielectric haʻahaʻa a hoʻohana mau ʻia ma luna o 5 GHz.Aia kekahi i hoʻololi ʻia epoxy FR-4 a i ʻole PPO substrates.

Ma waho aʻe o ka resin i ʻōlelo ʻia ma luna aʻe a me nā mea insulating ʻē aʻe, ʻo ke ʻano o ka ʻili (profile) o ke keleawe conductor kekahi mea koʻikoʻi e pili ana i ka nalowale o ka hoʻouna ʻana i nā hōʻailona, ​​​​i hoʻopilikia ʻia e ka hopena ʻili (SkinEffect).ʻO ka hopena o ka ʻili ka induction electromagnetic i hana ʻia i ka uea i ka wā o ka hoʻouna ʻana i ka hōʻailona kiʻekiʻe, a nui ka inductance ma ke kikowaena o ka ʻāpana uea, no laila ke manaʻo nei ke ʻano a i ʻole ka hōʻailona i ka ʻili o ka uea.ʻO ka roughness ili o ka conductor e pili ana i ka nalowale o ka hōʻailona hoʻouna, a liʻiliʻi ka nalowale o ka ʻili paheʻe.

Ma ke alapine like, ʻoi aku ka nui o ka roughness o ka ʻili keleawe, ʻoi aku ka nui o ka nalowale o ka hōʻailona.No laila, i ka hana maoli, ho'āʻo mākou e hoʻomalu i ka roughness o ka mānoanoa keleawe o ka honua e like me ka hiki.ʻOi aku ka liʻiliʻi me ka ʻole o ka pili ʻana i ka ikaika hoʻopaʻa.No nā hōʻailona ma ka laulā ma luna o 10 GHz.Ma 10GHz, pono e emi iho ka roughness keleawe ma mua o 1μm, a ʻoi aku ka maikaʻi o ka hoʻohana ʻana i ka foil keleawe super-planar (ka ʻili o ka ʻili 0.04μm).Pono e hui pū ʻia ka ʻili o ka ʻili keleawe me kahi lāʻau oxidation kūpono a me ka ʻōnaehana resin paʻa.I ka wā e hiki mai ana, e loaʻa kahi resin-copper foil me ka aneane ʻaʻohe outline, hiki ke loaʻa i ka ikaika peel kiʻekiʻe a ʻaʻole e hoʻopilikia i ka nalowale dielectric.