1. No ke aha e hoʻohana ai i nā papa kaapuni seramika
ʻO ka PCB maʻamau ka mea maʻamau i hana ʻia me ka foil keleawe a me ka hoʻopaʻa ʻana i ka substrate, a ʻo ka substrate material ka hapa nui o ke aniani fiber (FR-4), phenolic resin (FR-3) a me nā mea ʻē aʻe, adhesive ka mea maʻamau phenolic, epoxy, etc. ʻO ka hana PCB ma muli o ke koʻikoʻi wela, nā mea kemika, nā kaʻina hana kūpono ʻole a me nā kumu ʻē aʻe, a i ʻole ke kaʻina hana ma muli o nā ʻaoʻao ʻelua o ke keleawe asymmetry, maʻalahi ke alakaʻi i nā pae like ʻole o ka warping papa PCB.
PCB Twist
A ʻo kekahi PCB substrate - ceramic substrate, ma muli o ka hana hoʻoheheʻe wela, ka hiki ke halihali i kēia manawa, insulation, thermal expansion coefficient, a me nā mea ʻē aʻe, ʻoi aku ka maikaʻi ma mua o ka papa aniani fiber PCB maʻamau, no laila ua hoʻohana nui ʻia i nā modula uila uila mana kiʻekiʻe. , aerospace, uila uila a me nā huahana ʻē aʻe.
ʻO nā pani seramika
Me ka PCB maʻamau me ka hoʻohana ʻana i ka pahu keleawe adhesive a me ka hoʻopaʻa ʻana i ka substrate, aia ka PCB ceramic i ke kiʻekiʻe wela o ka mahana, ma ke ala o ka hoʻopaʻa ʻana i ke keleawe keleawe a me ka substrate seramika i hui pū ʻia, ikaika paʻa paʻa, ʻaʻole e hāʻule ke keleawe keleawe, hilinaʻi kiʻekiʻe, hana paʻa i ke kiʻekiʻe. ka mahana, ka haʻahaʻa kiʻekiʻe
2. Mea nui o ka substrate seramika
Alumina (Al2O3)
ʻO alumina ka mea hoʻohana maʻamau i hoʻohana ʻia i ka substrate seramika, no ka mea ma ka mechanical, thermal a me nā waiwai uila i hoʻohālikelike ʻia i ka hapa nui o nā seramika oxide, ikaika kiʻekiʻe a me ke kūpaʻa kemika, a me ke kumu waiwai o nā mea maka, kūpono no nā ʻano hana ʻenehana a me nā ʻano like ʻole. . E like me ka pakeneka o ka alumina (Al2O3) hiki ke maheleia i 75 porcelain, 96 porcelain, 99.5 porcelain. ʻAʻole pili ʻia nā waiwai uila o ka alumina e nā ʻokoʻa like ʻole o ka alumina, akā ua loli nui kona mau ʻano mechanical a me ka conductivity thermal. ʻO ka substrate me ka maʻemaʻe haʻahaʻa he ʻoi aku ka aniani a ʻoi aku ka nui o ka ʻili. ʻO ke kiʻekiʻe o ka maʻemaʻe o ka substrate, ʻoi aku ka maʻalahi, compact, medium loss ka haʻahaʻa, akā ʻoi aku ka kiʻekiʻe o ke kumukūʻai.
Beryllium oxide (BeO)
ʻOi aku ka nui o ka conductivity thermal ma mua o ka alumini metala, a hoʻohana ʻia i nā kūlana e pono ai ka conductivity thermal kiʻekiʻe. E emi koke ana ma hope o ka piʻi ʻana o ka mahana ma mua o 300 ℃, akā ua kaupalena ʻia kona hoʻomohala ʻana e kona ʻona.
Aluminum nitride (AlN)
ʻO nā seramika nitride alumini he mau seramika me nā pauka nitride aluminika e like me ke ʻano crystalline nui. Ke hoʻohālikelike ʻia me ka substrate seramika alumina, ka pale ʻana i ka insulation, ka insulation e kū i ka volta kiʻekiʻe, haʻahaʻa dielectric mau. He 7 ~ 10 mau manawa ko Al2O3 kona conductivity thermal, a ua pili like kona thermal expansion coefficient (CTE) me ka chip silicon, he mea nui loa ia no nā chips semiconductor kiʻekiʻe. Ma ke kaʻina hana, hoʻopili nui ʻia ka conductivity thermal o AlN e ka ʻike o nā koena o ka oxygen impurities, a hiki ke hoʻonui nui ʻia ka conductivity thermal ma ka hōʻemi ʻana i ka ʻike oxygen. I kēia manawa, ka thermal conductivity o ke kaʻina hana
Ma muli o nā kumu i luna aʻe nei, hiki ke ʻike ʻia aia nā alumina ceramics i ke kūlana koʻikoʻi i nā kahua o ka microelectronics, ka uila uila, nā microelectronics hui pū ʻia a me nā modula mana ma muli o kā lākou hana piha piha.
Hoʻohālikelike ʻia me ka mākeke o ka nui like (100mm × 100mm × 1mm), nā mea like ʻole o ke kumu kūʻai seramika substrate: 96% alumina 9.5 yuan, 99% alumina 18 yuan, alumini nitride 150 yuan, beryllium oxide 650 yuan, hiki ke ʻike ʻia. ʻano nui nō hoʻi ka ʻokoʻa kumu kūʻai ma waena o nā substrate like ʻole
3. ʻO nā pono a me nā pōʻino o ka PCB ceramic
Pono
- ʻO ka hiki ke halihali i kēia manawa, 100A mau manawa ma o 1mm 0.3mm kino keleawe mānoanoa, piʻi ka mahana ma kahi o 17 ℃
- ʻO ka piʻi ʻana o ka mahana ma kahi o 5 ℃ wale nō ke hele mau nei ka 100A i ke kino keleawe mānoanoa 2mm 0.3mm.
- ʻOi aku ka maikaʻi o ka hoʻoheheʻe ʻana i ka wela, ka mea hoʻonui haʻahaʻa wela, ke ʻano paʻa, ʻaʻole maʻalahi i ka warping.
- ʻO ka insulation maikaʻi, ke kūpaʻa kiʻekiʻe, e hōʻoia i ka palekana pilikino a me nā mea hana.
Nā pōʻino
ʻO ka palupalu kekahi o nā hemahema nui, e alakaʻi ana i ka hana ʻana i nā papa liʻiliʻi wale nō.
He pipiʻi ke kumukūʻai, ʻoi aku ka nui o nā koi o nā huahana uila, ka papa kaapuni seramika a i hoʻohana ʻia paha i kekahi o nā huahana kiʻekiʻe, ʻaʻole e hoʻohana ʻia nā huahana haʻahaʻa.
4. Ka hoʻohana ʻana i ka PCB keramika
a. Kiʻekiʻe mana uila module, solar panel module, etc
- Kiʻekiʻe alapine hoʻololi mana lako, solid state relay
- Mea uila uila, aerospace, uila uila
- Nā huahana kukui LED mana kiʻekiʻe
- Antenna kamaʻilio