ʻO ka papa kaapuni kiʻekiʻe e pili ana i ka hoʻohana ʻana i ka laulā laina maikaʻi / spacing, nā lua micro, ka laulā apo haiki (a i ʻole ka laulā apo) a me nā lua i kanu ʻia a me nā makapō e loaʻa ai ke kiʻekiʻe kiʻekiʻe.

ʻO ke kiko kiʻekiʻe, ʻo ia ka hopena o ka "maikaʻi, liʻiliʻi, haiki, a lahilahi" e alakaʻi i nā koi kikoʻī kiʻekiʻe. E lawe i ka laulā laina ma ke ʻano he laʻana:

0.20mm laula laina, 0.16～0.24mm i hanaia e like me na rula i kupono, a o ka hewa he (0.20±0.04) mm; ʻoiai ka laulā laina o 0.10mm, ʻo ka hewa (0.1 ± 0.02) mm, maopopo ʻO ka pololei o ka hope e hoʻonui ʻia e ka helu o 1, a pēlā aku ʻaʻole paʻakikī ke hoʻomaopopo, no laila ʻaʻole e kūkākūkā ʻia nā koi kiʻekiʻe. kaawale. Akā, he pilikia koʻikoʻi ia i ka ʻenehana hana.

ʻenehana uea liʻiliʻi a paʻa

I ka wā e hiki mai ana, mai ka 0.20mm-0.13mm-0.08mm-0.005mm ka laulā laina kiʻekiʻe kiʻekiʻe no ka hoʻokō ʻana i nā koi o SMT a me multi-chip packaging (Mulitichip Package, MCP). No laila, koi ʻia kēia ʻenehana.
①Papa

Ke hoʻohana nei i ka ipu keleawe lahilahi a i ʻole ultra-thin copper foil (<18um) substrate a me ka ʻenehana lapaʻau maikaʻi.
②Ke kaʻina hana

Me ka hoʻohana ʻana i kahi kiʻiʻoniʻoni maloʻo ʻoi aku ka lahilahi a me ke kaʻina hana hoʻopili pulu, hiki ke hoʻemi ʻia ke kiʻi ʻoniʻoni maloʻo ʻoi aku ka maikaʻi a hoʻohaʻahaʻa i ka laulā laina a me nā hemahema. Hiki i ke kiʻiʻoniʻoni pulu ke hoʻopiha i nā āpau liʻiliʻi o ka ea, hoʻonui i ka pili o ka interface, a hoʻomaikaʻi i ka pono uea a me ka pololei.
③Electrodeposited photoresist kiʻiʻoniʻoni

Hoʻohana ʻia ʻo Photoresist (ED) i hoʻopaʻa ʻia i ka uila. Hiki ke hoʻomalu ʻia kona mānoanoa ma ka laulā o 5-30/um, a hiki iā ia ke hana i nā uea maikaʻi maikaʻi loa. He kūpono loa ia no ka laulā apo haiki, ʻaʻohe laulā apo a me ka pā piha electroplating. I kēia manawa, ʻoi aku ma mua o ʻumi mau laina hana ED ma ka honua.
④ ʻenehana hōʻike māmā like

Ke hoʻohana nei i ka ʻenehana hōʻike māmā parallel. No ka mea hiki i ka ʻike kukui like ke lanakila i ka mana o ka hoʻololi ʻana o ka laulā laina i hoʻokumu ʻia e nā kukuna oblique o ke kumu kukui "point", hiki ke loaʻa ka uea maikaʻi me ka nui o ka laulā laina pololei a me nā kihi maʻemaʻe. Eia nō naʻe, ʻoi aku ke kumukūʻai o nā lako hoʻolaha like, kiʻekiʻe ka hoʻopukapuka kālā, a pono e hana ma kahi ʻano maʻemaʻe loa.
⑤ ʻOkoʻa ʻenehana nānā ʻike

Ke hoʻohana nei i ka ʻenehana nānā ʻokoʻa. Ua lilo kēia ʻenehana i mea pono loa no ka ʻike ʻana i ka hana ʻana i nā uea maikaʻi, a ke hāpai wikiwiki ʻia nei, hoʻohana ʻia a hoʻomohala ʻia.

EDA365 Electronic Forum

ʻenehana microporous

ʻO nā puka hana o nā papa i paʻi ʻia i hoʻohana ʻia no ka hoʻopili ʻana i ka ʻenehana microporous i hoʻohana nui ʻia no ka hoʻopili uila, ʻo ia ka mea e ʻoi aku ka nui o ka noi ʻana o ka ʻenehana microporous. ʻO ka hoʻohana ʻana i nā mea wili maʻamau a me nā mīkini wili CNC e hana i nā lua liʻiliʻi he nui nā hemahema a me nā kumukūʻai kiʻekiʻe.

No laila, ʻo ke kiʻekiʻe kiʻekiʻe o nā papa i paʻi ʻia ka hapa nui i ka hoʻomaʻemaʻe ʻana i nā uea a me nā pads. ʻOiai ua loaʻa nā hopena nui, ua kaupalena ʻia kona hiki. No ka hoʻomaikaʻi hou ʻana i ka density (e like me nā uea ma lalo o 0.08mm), ke piʻi nei ke kumukūʻai. , No laila e huli e hoʻohana i nā micropores e hoʻomaikaʻi i ka densification.

I nā makahiki i hala iho nei, ua hana nā mīkini wili helu helu a me ka ʻenehana micro-drill, a no laila ua ulu wikiwiki ka ʻenehana micro-hole. ʻO kēia ka hiʻohiʻona koʻikoʻi nui i ka hana PCB o kēia manawa.

I ka wā e hiki mai ana, e hilinaʻi nui ka ʻenehana hana micro-hole i nā mīkini wili CNC kiʻekiʻe a me nā poʻo micro-poʻo maikaʻi loa, a ʻo nā lua liʻiliʻi i hana ʻia e ka ʻenehana laser ʻoi aku ka haʻahaʻa ma mua o nā mea i hana ʻia e nā mīkini wili CNC mai ka manaʻo o ke kumukūʻai a me ka maikaʻi o ka lua. .
①CNC wili mīkini

I kēia manawa, ua hana ka ʻenehana o CNC drilling machine i nā holomua hou a me ka holomua. A hoʻokumu i kahi hanauna hou o CNC drilling machine i hōʻike ʻia e ka wili ʻana i nā lua liʻiliʻi.

ʻO ka maikaʻi o ka hoʻoheheʻe ʻana i nā lua liʻiliʻi (ma lalo o 0.50mm) o ka mīkini hoʻoheheʻe micro-hole he 1 mau manawa kiʻekiʻe ma mua o ka mīkini hoʻoheheʻe CNC maʻamau, me ka liʻiliʻi liʻiliʻi, a ʻo ka wikiwiki o ka rotation he 11-15r / min; hiki iā ia ke wili i 0.1-0.2mm micro-hole, me ka hoʻohana ʻana i kahi ʻano kobalt kiʻekiʻe. Hiki i ka bit drill liʻiliʻi kiʻekiʻe ke wili i ʻekolu mau papa (1.6mm/block) i hoʻopaʻa ʻia ma luna o kekahi. Ke haʻihaʻi ka drill bit, hiki iā ia ke hoʻokuʻu a hōʻike i ke kūlana, hoʻololi 'akomi i ka drill bit a nānā i ke anawaena (hiki i ka waihona mea hana ke hoʻopaʻa i nā haneli haneli), a hiki ke hoʻomalu i ka mamao mau ma waena o ka piko drill a me ka uhi. a me ka hohonu wili, no laila hiki ke wili ʻia nā puka makapō , ʻAʻole ia e hōʻino i ka countertop. ʻO ka papa ʻaina o ka mīkini drilling CNC e hoʻohana i ka cushion air a me ke ʻano levitation magnetic, hiki ke neʻe wikiwiki, ʻoi aku ka māmā a me ka pololei me ka ʻole o ka ʻoki ʻana i ka papaʻaina.

Ke koi ʻia nei nā mīkini wili i kēia manawa, e like me ka Mega 4600 mai Prurite i Italia, ka Excellon 2000 series ma United States, a me nā huahana hanauna hou mai Switzerland a me Kelemānia.
②Laser wili

Nui maoli nā pilikia me nā mīkini wili CNC maʻamau a me nā ʻāpana drill e wili i nā lua liʻiliʻi. Ua pale ia i ka holomua o ka ʻenehana micro-hole, no laila ua huki ka laser ablation i ka nānā, noiʻi a me ka noi.

Akā, aia kahi pōʻino make, ʻo ia hoʻi, ka hoʻokumu ʻana o kahi puka pū, a ʻoi aku ka koʻikoʻi i ka piʻi ʻana o ka mānoanoa o ka pā. Hoʻohui ʻia me ka pollution ablation kiʻekiʻe (ʻoi aku ka nui o nā papa multilayer), ke ola a me ka mālama ʻana i ke kumu kukui, ka hoʻihoʻi hou ʻana o nā lua corrosion, a me ke kumukūʻai, ka hoʻolaha ʻana a me ka hoʻohana ʻana i nā micro-hole i ka hana ʻana i nā papa i paʻi ʻia. . Eia nō naʻe, hoʻohana mau ʻia ka laser ablation i nā pā microporous lahilahi a kiʻekiʻe, ʻoi aku ka nui o ka ʻenehana MCM-L high-density interconnect (HDI), e like me ka polyester film etching a me ka hoʻopaʻa metala ma MCMs. (Sputtering 'enehana) ua hoʻohana 'ia i loko o ka hui kiʻekiʻe-density interconnection.

Hiki ke hoʻohana ʻia ka hoʻokumu ʻana o nā vias i kanu ʻia i nā papa multilayer kiʻekiʻe me ka kanu ʻana a me ka makapō ma o nā hale. Eia nō naʻe, ma muli o ka hoʻomohala ʻana a me nā ʻenehana ʻenehana o nā mīkini drilling CNC a me nā micro-drills, ua hoʻolaha koke ʻia lākou a hoʻohana ʻia. No laila, ʻaʻole hiki i ka hoʻohana ʻana i ka hoʻoheheʻe ʻana i ka laser ma nā papa kaapuni mauna i kahi kūlana mana. Akā, he wahi kona ma kekahi kahua.

③Ka ʻenehana i kanu ʻia, makapō, a i loko o ka lua

ʻO ka ʻenehana hui pū ʻia, makapō, a ma loko o ka lua kekahi ala nui e hoʻonui ai i ka nui o nā kaapuni paʻi. ʻO ka maʻamau, ʻo nā lua i kanu ʻia a me nā puka makapō he mau puka liʻiliʻi. Ma waho aʻe o ka hoʻonui ʻana i ka helu o nā uwila ma ka papa, ua hoʻopili ʻia nā lua i kanu ʻia a me nā makapō e ka "kokoke" i loko o ka papa, kahi e hōʻemi nui ai i ka helu o nā puka i hana ʻia, a ʻo ka hoʻonohonoho hoʻokaʻawale disk e hoʻemi nui ʻia, ma laila e hoʻonui ai i ka ka helu o ka uwea pono a me ka inter-layer interconnection i loko o ka papa, a me ka hoʻomaikaʻi i ka interconnection density.

No laila, ʻo ka papa multi-layer me ka hui pū ʻana o nā lua i kanu ʻia, makapō, a me nā puka ma ka liʻiliʻi he 3 mau manawa kiʻekiʻe o ka interconnection density ma mua o ka papa hana maʻamau piha ma lalo o ka nui a me ka helu o nā papa. Inā kanu ʻia, makapō, E hoʻemi nui ʻia ka nui o nā papa i paʻi ʻia me nā puka a i ʻole ka nui o nā papa.

No laila, i nā papa paʻi kiʻekiʻe kiʻekiʻe i hoʻopaʻa ʻia, kanu ʻia a me nā ʻenehana puka makapō i hoʻohana nui ʻia, ʻaʻole wale ma nā papa i paʻi ʻia i luna i nā kamepiula nui, nā lako kamaʻilio, a me nā mea ʻē aʻe, akā i nā noi kīwila a me nā ʻoihana. Ua hoʻohana nui ʻia ma ke kula, ʻo ia hoʻi ma kekahi mau papa lahilahi, e like me PCMCIA, Smard, IC kāleka a me nā papa ʻeono-papa ʻē aʻe.

ʻO nā papa kaapuni i paʻi ʻia me nā hale kanu a me nā puka makapō e hoʻopau ʻia e nā ʻano hana hana "sub-board", ʻo ia hoʻi, pono lākou e hoʻopau ʻia ma o ka kaomi ʻana, wili, a me ka hole plating, no laila he mea nui ka hoʻonohonoho pololei ʻana.