ʻO ka papa kaapuni paʻi maʻalahi (Flexible Printed Circuit circuit i kapa ʻia ʻo FPC), ʻike ʻia hoʻi ʻo ka papa kaapuni maʻalahi, ka papa kaapuni maʻalahi, he mea hilinaʻi nui, ʻoi aku ka maikaʻi o ka papa kaapuni i hana ʻia me ka polyimide a i ʻole ka polyester film ma ke ʻano he substrate. Loaʻa iā ia nā hiʻohiʻona o ke kiʻekiʻe wiring density, ke kaumaha māmā, ka mānoanoa lahilahi a me ka piko maikaʻi.
Nā wahi koho mea FPC:
1.Material koho o ka aoao ki / ki
Koho ʻaoʻao kī 18/12.5 pālua ʻaoʻao electrolytic keleawe (koe wale nō), koho kī nui 18/12.5 pālua ʻaoʻao electrolytic keleawe (koe wale nō). ʻO ke kīʻaoʻao a me ke kī nuiʻaʻohe koi kūikawā i ke kuʻiʻana, a ua kūʻaiʻia a hoʻopaʻaʻia ma ka papa nui, akā e hōʻoiaʻiʻoʻaʻole he anomaly i ke kuʻiʻana i hope aʻoi aku ma mua o 8 manawa. ʻOi aku ka paʻakikī o ka mānoanoa o ke kī, inā ʻaʻole ia e hoʻopilikia i ka manaʻo o ke kī, no laila pono ia e hoʻokō i ka nui o nā koi mānoanoa o ka mea kūʻai.
2.Material koho o ka hoʻohui uea
ʻO ka uea pili he 18/12.5 pālua electrolytic copper (koe nā mea kūikawā). ʻO ka hana nui ke pāʻani i kahi pilina pili, a ʻaʻohe koi kūikawā no nā koi kulou. Hiki ke hoʻopaʻa ʻia a hoʻopaʻa ʻia nā ʻaoʻao ʻelua, akā pono e hōʻoia ʻia ʻaʻohe anomaly ma mua o ke kūlou ʻana i hope a ʻoi aku ma mua o 8 mau manawa.
3.Selection o nā mea kōkua
I ke koho ʻana i ka pepa adhesive, ʻaʻole pono ka papa maʻamau i ka SMT hiki ke hoʻohana i ka pepa adhesive kūpaʻa kiʻekiʻe (e like me ka papa kī ʻaoʻao), a pono ka SMT e hoʻohana i ka pepa adhesive kiʻekiʻe wela (e like me SMT e ka papa kī).
4.Selection o nā mea conductive
Ke koho ʻana i ka pepa conductive, kūpono ka mea hoʻopili conductive maʻamau no ka poʻe me nā koi conductivity uila haʻahaʻa (e like me ka keyplate maʻamau), a kūpono ka waiwai conductive maikaʻi no ka poʻe me nā koi conductivity uila kiʻekiʻe a pono e hoʻohana i ka pepa adhesive (e like me ka keyplate kūikawā, etc. ), akā ʻaʻole ʻōlelo ʻia kēia pepa paʻa no ka mea kiʻekiʻe loa ke kumukūʻai.
Hiki ke lilo ka waiwai conductive o ka lole conductive, akā ʻaʻole kūpono ka viscosity, a he kūpono ia no ka papa keyplate.
ʻO Conductive Pure Adhesive kahi mea conductive ikaika kiʻekiʻe, hoʻohana maʻamau no ka hoʻopili ʻana i nā ʻāpana kila, akā ʻaʻole ia e ʻōlelo ʻia e hoʻohana i kēia conductive pure adhesive, no ka mea, kiʻekiʻe loa ke kumukūʻai.
5.Material koho o sliding uhi pā
ʻO ka pā uhi uhi pālua ʻelua he 1/30Z ʻaoʻao hoʻokahi non-gel electrolytic copper, he palupalu a ductile. ʻO ka ʻaoʻao ʻelua ʻaoʻao sliding cover plate he 1/30Z pālua ʻaoʻao non-adhesive electrolytic copper, he palupalu a ductile. ʻOi aku ka maikaʻi o ke ola o ka pā uhi hoʻoheheʻe i hana ʻia me 1/30Z pālua ʻaoʻao keleawe ʻole electrolytic copper ma mua o ka 1/30Z ʻaoʻao hoʻokahi copper-free electrolytic copper. Inā ʻaʻohe pilikia me ka hoʻolālā, ʻōlelo ʻia e hoʻolālā i ka FPC ma ke ʻano he ʻaoʻao ʻelua ʻaoʻao uhi uhi i ka hiki. Ma keʻano o ke kumukūʻai,ʻo ka hoʻohanaʻana i ka 1 / 30Z lua-ʻaoʻao copper-free electrolytic copper e hoʻonui i ke kumukūʻai ma kahi o 30% i hoʻohālikelikeʻia me ka hoʻohanaʻana i ka 1 / 30Z hoʻokahi-ʻaoʻao copper-free electrolytic copper mea nui, akāʻo ka hoʻohanaʻana i kēia. mea e hoʻomaikaʻi i ka hua hana, a hiki ke hoʻomaikaʻi ʻia ke ola hoʻāʻo, hiki ke hōʻoia i ka paʻa o kēia ʻano pā.
6.Material koho o multi-layer papa
ʻO ka pā multilayer he 1 / 30Z non-colloidal electrolytic copper, he palupalu a ductile. Inā ʻaʻohe pilikia o ke kūkulu ʻana, hiki ke hoʻāʻo ʻia ka hana ʻana o ka flap.
