ʻO ka Papa Kaapuni Paʻi (PCB) kahi mea uila maʻamau i hoʻohana nui ʻia i nā huahana uila a me nā huahana pili. Kapa ʻia ʻo PCB i kekahi manawa he PWB (Paʻi Uea Papa). Ua ʻoi aku ka nui ma Hong Kong a me Iapana ma mua, akā i kēia manawa ua emi (ʻoiaʻiʻo, ʻokoʻa ka PCB a me ka PWB). I nā ʻāina Komohana a me nā ʻāina, ua kapa ʻia ʻo PCB. Ma ka Hikina, loaʻa nā inoa like ʻole ma muli o nā ʻāina a me nā ʻāina like ʻole. No ka laʻana, ua kapa ʻia ʻo ia ka papa kaapuni paʻi ma ka ʻāina nui o Kina (i kapa ʻia ma mua o ka papa kaapuni paʻi), a ua kapa ʻia ʻo PCB ma Taiwan. Ua kapa ʻia nā papa kaapuni i nā substrate uila (circuit) ma Iapana a me nā substrates ma South Korea.

ʻO ka PCB ke kākoʻo o nā ʻāpana uila a me ka lawe ʻana i ka pilina uila o nā ʻāpana uila, ke kākoʻo nui a me ka hoʻopili ʻana. Mai waho mai, ʻekolu kala o ka papa waho o ka papa kaapuni: ke gula, ke kālā, a me ka ʻulaʻula māmā. Hoʻokaʻawale ʻia e ke kumu kūʻai: ʻo ke gula ke kumu kūʻai nui loa, ʻo ke kālā ka lua, a ʻo ka ʻulaʻula māmā ka mea liʻiliʻi loa. Eia naʻe, ʻo ka uwila i loko o ka papa kaapuni he keleawe maʻemaʻe, ʻo ia ke keleawe ʻole.

Ua ʻōlelo ʻia he nui nā metala makamae ma ka PCB. Ua hōʻike ʻia, ma ka awelika, loaʻa i kēlā me kēia kelepona akamai he 0.05g gula, 0.26g kālā, a me 12.6g keleawe. ʻO ka maʻiʻo gula o ka pona he 10 mau manawa ma mua o ke kelepona paʻa!

Ma ke ʻano he kākoʻo no nā ʻāpana uila, pono nā PCB i nā mea kūʻai aku ma luna o ka ʻili, a pono e ʻike ʻia kahi ʻāpana o ka papa keleawe no ke kūʻai ʻana. Kapa ʻia kēia mau ʻāpana keleawe i hōʻike ʻia he pads. He ʻehā a poepoe paha nā pads me kahi wahi liʻiliʻi. No laila, ma hope o ka pena ʻia ʻana o ka mask solder, ʻike ʻia ke keleawe wale nō ma nā pads i ka lewa.

ʻO ke keleawe i hoʻohana ʻia i ka PCB ua maʻalahi ka oxidized. Inā hoʻoneʻe ʻia ke keleawe ma ka pad, ʻaʻole ia e paʻakikī wale ke kūʻai aku, akā e hoʻonui nui ʻia ka resistivity, e hoʻopilikia nui i ka hana o ka huahana hope. No laila, ua uhi ʻia ka pā me ke gula inert metala, a i ʻole ua uhi ʻia ka ʻili me kahi ʻāpana kālā ma o ke kaʻina hana kemika, a i ʻole ke hoʻohana ʻia kahi kiʻi ʻoniʻoni kūikawā no ka uhi ʻana i ka papa keleawe e pale ai i ka paʻi ʻana i ka lewa. Kāohi i ka oxidation a pale i ka pad, i hiki iā ia ke hōʻoia i ka hua ma ke kaʻina hana kūʻai hope.

1. PCB keleawe aahu laminate
ʻO ka copper clad laminate he mea ʻano pā i hana ʻia e ka impregnating i ka lole fiber glass a i ʻole nā ​​​​mea hoʻoikaika ʻē aʻe me ka resin ma kekahi ʻaoʻao a i ʻole nā ​​ʻaoʻao ʻelua me ka foil keleawe a me ke kaomi wela.
E lawe i ka laminate keleawe i hoʻopaʻa ʻia i ka fiber glass ma ke ʻano he laʻana. ʻO kāna mau mea maka nui he keleawe foil, ke aniani fiber cloth, a me ka epoxy resin, nona ka 32%, 29% a me 26% o ke kumukūʻai huahana.

Hale hana papa kaapuni

ʻO ka copper clad laminate ka mea maʻamau o nā papa kaapuni paʻi, a ʻo nā papa kaapuni i paʻi ʻia nā mea nui e pono ai no ka hapa nui o nā huahana uila e hoʻokō i ka pilina kaapuni. Me ka hoʻomaikaʻi mau ʻana o ka ʻenehana, hiki ke hoʻohana ʻia kekahi mau laminates keleawe uila kūikawā i nā makahiki i hala. Hana pololei i nā ʻāpana uila i paʻi ʻia. ʻO nā mea hoʻokele i hoʻohana ʻia i nā papa kaapuni i paʻi ʻia i hana maʻamau ʻia me ke keleawe hoʻomaʻemaʻe like me ka foil, ʻo ia hoʻi, ʻo ke keleawe keleawe ma ke ʻano haiki.

2. Papa Kaapuni Gula Kaapuni PCB

Inā pili pololei ke gula a me ke keleawe, aia ka hopena kino o ka neʻe ʻana o ka electron a me ka diffusion (ka pilina ma waena o ka ʻokoʻa kūpono), no laila pono e hoʻopili ʻia kahi papa o "nickel" ma ke ʻano he papa pale, a laila hoʻopili ʻia ke gula ma luna. luna o ka nickel, no laila mākou i kapa pinepine ʻia he gula Electroplated, ʻo kona inoa maoli e kapa ʻia ʻo "electroplated nickel gold".
ʻO ka ʻokoʻa ma waena o ke gula paʻakikī a me ke gula palupalu ke ʻano o ka papa gula hope loa i uhi ʻia ma luna. I ka hoʻopaʻa ʻana i ke gula, hiki iā ʻoe ke koho i ka electroplate i ke gula maʻemaʻe a i ʻole ka alloy. No ka mea, he palupalu ka paʻakikī o ke gula maʻemaʻe, ua kapa ʻia ʻo ia he "gula palupalu" . No ka mea hiki i ka "gula" ke hana i kahi huila maikaʻi me ka "aluminika", pono e koi pono ʻo COB i ka mānoanoa o kēia papa gula maʻemaʻe i ka wā e hana ai i nā uea alumini. Eia hou, inā kohoʻoe i ka electroplated gold-nickel alloy a iʻole ke gula-cobalt alloy, no ka mea, eʻoi aku ka paʻakikī o ka paʻakai ma mua o ke gula maʻemaʻe, ua kapaʻiaʻo ia he "gula paʻakikī".

Hale hana papa kaapuni

Hoʻohana nui ʻia ka papa gula-plated i nā pads component, nā manamana gula, a me nā shrapnel connector o ka papa kaapuni. ʻO nā papa makuahine o nā papa kaapuni kelepona paʻa i hoʻohana nui ʻia, ʻo ia ka hapa nui o nā papa gula, nā papa gula i hoʻopaʻa ʻia, nā motherboards kamepiula, nā leo a me nā papa kaapuni kikohoʻe liʻiliʻi ʻaʻole nā ​​​​papa gula.

He gula maoli ke gula. ʻOiai ʻo kahi ʻāpana lahilahi wale nō i hoʻopaʻa ʻia, ʻo ia ka mea ma kahi o 10% o ke kumukūʻai o ka papa kaapuni. ʻO ka hoʻohana ʻana i ke gula ma ke ʻano he papa plating kekahi no ka hoʻomaʻamaʻa ʻana i ka wiliwili a ʻo kekahi no ka pale ʻana i ka ʻino. ʻOiai ʻo ka manamana gula o ka lāʻau hoʻomanaʻo i hoʻohana ʻia no kekahi mau makahiki e paʻa mau ana e like me ka wā ma mua. Inā hoʻohana ʻoe i ke keleawe, aluminika, a i ʻole ka hao, e popo koke ia i loko o kahi puʻu ʻōpala. Eia kekahi, ʻoi aku ka kiʻekiʻe o ke kumukūʻai o ka pā gula-plated, a ʻilihune ka ikaika welding. Ma muli o ka hoʻohana ʻana i ke kaʻina hana nickel plating electroless, hiki mai ka pilikia o nā diski ʻeleʻele. E oxidize ka papa nickel i ka manawa, a he pilikia hoʻi ka hilinaʻi lōʻihi.

3. Papa Kaapuni Kaapuni Kaiapuni PCB
ʻOi aku ka maikaʻi o ka Immersion Silver ma mua o ka Immersion Gold. Inā pili ka PCB i nā koi hana a pono e hōʻemi i nā kumukūʻai, ʻo ka Immersion Silver kahi koho maikaʻi; hui pū ʻia me ka palahalaha maikaʻi a me ka pili ʻana o Immersion Silver, a laila pono ke koho ʻia ke kaʻina hana Immersion Silver.

Nui nā noi immersion Silver i nā huahana kamaʻilio, nā kaʻa, a me nā peripheral kamepiula, a loaʻa pū kekahi i nā noi i ka hoʻolālā hōʻailona kiʻekiʻe. No ka mea, loaʻa i ka Immersion Silver nā waiwai uila maikaʻi ʻaʻole hiki ke hoʻohālikelike ʻia nā ʻano lapaʻau ʻē aʻe, hiki ke hoʻohana ʻia i nā hōʻailona kiʻekiʻe. Paipai ʻo EMS i ka hoʻohana ʻana i ke kaʻina kālā immersion no ka mea maʻalahi ka hui ʻana a ʻoi aku ka maikaʻi o ka nānā ʻana. Eia nō naʻe, ma muli o nā hemahema e like me ka ʻulaʻula a me ka hoʻoheheʻe ʻia ʻana o ka hui, ua lohi ka ulu ʻana o ke kālā kaiapuni (akā ʻaʻole i emi iho).

hoʻonui
Hoʻohana ʻia ka papa kaapuni i paʻi ʻia ma ke ʻano he mea lawe pili o nā ʻāpana uila i hoʻohui ʻia, a ʻo ka maikaʻi o ka papa kaapuni e pili pono i ka hana o nā lako uila naʻauao. Ma waena o lākou, he mea nui ka maikaʻi o ka plating o nā papa kaapuni paʻi. Hiki i ka electroplating ke hoʻomaikaʻi i ka pale, solderability, conductivity a me ka pale ʻana o ka papa kaapuni. I ke kaʻina hana o nā papa kaapuni paʻi, ʻo ka electroplating kahi hana koʻikoʻi. ʻO ka maikaʻi o ka electroplating e pili ana i ka holomua a i ʻole ka hemahema o ke kaʻina holoʻokoʻa a me ka hana o ka papa kaapuni.

ʻO nā kaʻina hana electroplating nui o ka pcb he copper plating, tin plating, nickel plating, gula plating a pēlā aku. ʻO ka copper electroplating ka pāpaʻi kumu no ka hoʻopili uila o nā papa kaapuni; ʻO ka tin electroplating kahi kūlana kūpono no ka hana ʻana i nā kaʻa kaʻa kiʻekiʻe e like me ka papa anti-corrosion i ka hoʻoponopono kumu; ʻO ka nickel electroplating ka mea e hoʻopili ai i kahi papa nickel barrier ma ka papa kaapuni e pale i ke keleawe a me ke gula Mutual dialysis; ʻO ke gula electroplating e pale i ka passivation o ka nickel surface e hālāwai me ka hana o ka soldering a me ka corrosion kū'ē o ka papa kaapuni.