- Mai ka honua pcb,
ʻO ka hoʻopau ʻana o nā mea, ʻike ʻia hoʻi he lapalapa ahi, hoʻopau ponoʻī, pale ʻana i ka lapalapa, pale ʻana i ke ahi, pale ahi, flammability a me nā mea hoʻopau ʻē aʻe, ʻo ia ka loiloi i ka hiki o ka mea ke pale aku i ka puhi ʻana.
Hoʻopau ʻia ka laʻana mea flammable me kahi lapalapa e kū ana i nā koi, a wehe ʻia ka lapalapa ma hope o ka manawa i ʻōlelo ʻia.ʻIke ʻia ka pae flammability e like me ke ʻano o ka puhi ʻana o ka hāpana.ʻEkolu pae.Hoʻokaʻawale ʻia ke ʻano hoʻāʻo pae o ka hāpana i FH1, FH2, FH3 pae ʻekolu, ua māhele ʻia ke ʻano hoʻāʻo kū i FV0, FV1, VF2.
Hoʻokaʻawale ʻia ka papa PCB paʻa i ka papa HB a me ka papa V0.
ʻO ka pepa HB he haʻahaʻa haʻahaʻa ahi a hoʻohana nui ʻia no nā papa ʻaoʻao hoʻokahi.
He kiʻekiʻe ka lapalapa ahi o ka papa VO a hoʻohana nui ʻia i nā papa ʻaoʻao ʻelua a me nā papa he nui.
ʻO kēia ʻano papa PCB e kū ana i nā koi helu ahi V-1 e lilo i papa FR-4.
ʻO V-0, V-1, a me V-2 nā māka pale ahi.
Pono ka papa kaapuni e pale i ka lapalapa ahi, ʻaʻole hiki ke wela i kekahi mahana, akā hiki ke hoʻopalupalu wale ʻia.ʻO ka helu wela i kēia manawa ua kapa ʻia ʻo ke aniani hoʻololi wela (Tg point), a pili kēia waiwai i ke kūpaʻa dimensional o ka papa PCB.
He aha ka papa kaapuni Tg PCB kiʻekiʻe a me nā pono o ka hoʻohana ʻana i kahi Tg PCB kiʻekiʻe?
Ke piʻi ka mahana o kahi papa paʻi Tg kiʻekiʻe i kekahi wahi, e hoʻololi ka substrate mai ke "kūlana aniani" a i ka "moku'āina Ruber".Kapa ʻia ka mahana i kēia manawa ʻo ke aniani hoʻololi wela (Tg) o ka papa.ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa e mālama ai ka substrate i ka rigidity.
He aha nā ʻano kikoʻī o nā papa PCB?
Māhele ʻia e ka pae papa mai lalo a kiʻekiʻe penei:
94HB － 94VO － 22F － CEM-1 － CEM-3 － FR-4
ʻO nā kikoʻī penei:
94HB: pepa pahu maʻamau, ʻaʻole pale ahi (ʻo ka mea haʻahaʻa haʻahaʻa, make punching, ʻaʻole hiki ke hoʻohana ʻia ma ke ʻano he papa mana)
94V0: Pāpaʻa Paʻa Paʻa (Die Punching)
22F: ʻO ka ʻaoʻao hoʻokahi ʻaoʻao hapa aniani papa fiber (ke kuʻi make)
CEM-1: ʻO ka papa fiberglass ʻaoʻao hoʻokahi (pono ka wili ʻana i ka lolouila, ʻaʻole make punching)
CEM-3: ʻO ka ʻaoʻao ʻelua ʻaoʻao hapa aniani papa fiber (koe wale ka pepa pahu ʻaoʻao ʻelua, ʻo ia ka mea haʻahaʻa haʻahaʻa o ka papa ʻaoʻao ʻelua, maʻalahi.
Hiki ke hoʻohana ʻia kēia mea no nā panela pālua, ʻo ia ka 5 ~ 10 yuan / square mika ma mua o FR-4)
FR-4: Papa fiberglass ʻaoʻao ʻelua
Pono ka papa kaapuni e pale i ka lapalapa ahi, ʻaʻole hiki ke wela i kekahi mahana, akā hiki ke hoʻopalupalu wale ʻia.ʻO ka helu wela i kēia manawa ua kapa ʻia ʻo ke aniani hoʻololi wela (Tg point), a pili kēia waiwai i ke kūpaʻa dimensional o ka papa PCB.
He aha ka papa kaapuni Tg PCB kiʻekiʻe a me nā pono o ka hoʻohana ʻana i kahi PCB Tg kiʻekiʻe.Ke piʻi ka mahana i kekahi wahi, e hoʻololi ka substrate mai ke "kūlana aniani" a i ka "ʻāina rubber".
Ua kapa ʻia ka mahana i ia manawa ʻo ke aniani hoʻololi wela (Tg) o ka pā.ʻO ia hoʻi, ʻo Tg ka wela kiʻekiʻe loa (°C) kahi e mālama ai ka substrate i ka paʻakikī.ʻO ia hoʻi, ʻaʻole wale nā mea hoʻoheheʻe PCB maʻamau e hana i ka palupalu, deformation, hoʻoheheʻe a me nā mea ʻē aʻe i nā mahana kiʻekiʻe, akā hōʻike pū kekahi i ka emi ʻana o nā ʻano mechanical a me nā uila (manaʻo wau ʻaʻole makemake ʻoe e ʻike i ka hoʻokaʻawale ʻana o nā papa PCB. a ʻike i kēia kūlana i kāu huahana ponoʻī).
ʻOi aku ka nui o ka pā Tg ma mua o 130 degere, ʻoi aku ka nui o ka Tg kiʻekiʻe ma mua o 170 degere, a ʻoi aku ka nui o ka Tg ma mua o 150 degere.
ʻO ka maʻamau, ua kapa ʻia nā papa paʻi PCB me Tg ≥ 170 ° C he mau papa paʻi Tg kiʻekiʻe.
Ke piʻi aʻe nei ka Tg o ka substrate, e hoʻomaikaʻi a hoʻomaikaʻi ʻia ka pale ʻana o ka wela, ka pale ʻana i ka wai, ke kūpaʻa kemika, ke kūpaʻa a me nā ʻano ʻē aʻe o ka papa i paʻi ʻia.ʻOi aku ka kiʻekiʻe o ka waiwai TG, ʻoi aku ka maikaʻi o ka pale wela o ka papa, ʻoi aku ka maikaʻi ma ke kaʻina alakaʻi ʻole, kahi e maʻa mau ai nā noi Tg kiʻekiʻe.
ʻO ka Tg kiʻekiʻe e pili ana i ka pale wela kiʻekiʻe.Me ka hoʻomohala wikiwiki ʻana o ka ʻoihana uila, ʻoi aku ka nui o nā huahana uila i hōʻike ʻia e nā kamepiula, ʻo ka hoʻomohala ʻana i nā hana kiʻekiʻe a me nā multilayers kiʻekiʻe e koi ai i ka pale wela kiʻekiʻe o nā mea PCB substrate i mea hōʻoia nui.ʻO ka puka ʻana a me ka hoʻomohala ʻana o nā ʻenehana hoʻokiʻekiʻe kiʻekiʻe i hōʻike ʻia e SMT a me CMT ua hana i nā PCB i ʻoi aʻe a ʻoi aku ka hiki ʻole ke hoʻokaʻawale ʻia mai ke kākoʻo ʻana o ke kūpaʻa wela kiʻekiʻe o nā substrates e pili ana i ka puka liʻiliʻi, nā wili maikaʻi, a me ka thinning.
No laila, ʻo ka ʻokoʻa ma waena o ka FR-4 maʻamau a me ka Tg FR-4 kiʻekiʻe: aia ia i ka mokuʻāina wela, ʻoi aku ka nui ma hope o ka lawe ʻana i ka wai.
Ma lalo o ka wela, aia nā ʻokoʻa i ka ikaika mechanical, dimensional stability, adhesion, absorption wai, thermal decomposition, a me ka hoʻonui wela o nā mea.ʻOi aku ka maikaʻi o nā huahana Tg kiʻekiʻe ma mua o nā mea substrate PCB maʻamau.
I nā makahiki i hala iho nei, ua hoʻonui ʻia ka nui o nā mea kūʻai aku e koi ana i ka hana ʻana i nā papa paʻi kiʻekiʻe Tg i kēlā me kēia makahiki.
Me ka hoʻomohala ʻana a me ka hoʻomau mau ʻana o ka ʻenehana uila, hoʻopuka mau ʻia nā koi hou no nā mea substrate papa kaapuni paʻi paʻi, a laila e hoʻoikaika nei i ka hoʻomohala mau ʻana o nā kūlana laminate copper clad.I kēia manawa, ʻo nā kūlana nui no nā mea substrate e like me kēia.
① Nā kūlana aupuni I kēia manawa, ʻo nā kūlana aupuni o koʻu ʻāina no ka hoʻokaʻawale ʻana i nā mea PCB no nā substrates e komo pū me GB/
ʻO T4721-47221992 a me GB4723-4725-1992, nā kūlana laminate keleawe i hoʻopaʻa ʻia ma Taiwan, Kina nā kūlana CNS, i hoʻokumu ʻia ma ka maʻamau JIs Iapana a ua hoʻopuka ʻia ma 1983.
② ʻO nā kūlana aupuni ʻē aʻe he: Japanese JIS standard, American ASTM, NEMA, MIL, IPc, ANSI, UL standards, British Bs standards, German DIN and VDE standards, French NFC and UTE standards, and Canadian CSA Standards, Australia's AS standard, the former ʻO ke kūlana FOCT o ka Soviet Union, ke kūlana IEC honua, a pēlā aku.
He mea maʻamau a hoʻohana mau ʻia nā mea hoʻolako o nā mea hoʻolālā PCB mua: Shengyi \ Jiantao \ International, etc.
● E ʻae i nā palapala: protel autocad powerpcb orcad gerber a i ʻole papa kope papa maoli, etc.
● Nāʻano pepa: CEM-1, CEM-3 FR4, nā mea TG kiʻekiʻe;
● Nui papa nui: 600mm*700mm (24000mil*27500mil)
● Mānoanoa papa hana: 0.4mm-4.0mm (15.75mil-157.5mil)
● ʻO ka helu kiʻekiʻe loa o nā papa hana: 16Layers
● ʻO ka mānoanoa o ka ʻāpana keleawe: 0.5-4.0(oz)
● Ka hoʻomanawanui mānoanoa o ka papa: +/-0.1mm(4mil)
● Hoʻokumu ʻana i ka nui hoʻomanawanui: wili kamepiula: 0.15mm (6mil) make punching pā: 0.10mm (4mil)
● Ka laulā laina liʻiliʻi loa: 0.1mm (4mil) Hiki ke hoʻomalu i ka laulā laina: <+-20%
● ʻO ke anawaena puka liʻiliʻi o ka huahana i hoʻopau ʻia: 0.25mm (10mil)
ʻO ke anawaena puka punching liʻiliʻi loa o ka huahana i hoʻopau ʻia: 0.9mm (35mil)
Ka hoʻomanawanui ʻana o ka lua: PTH: +-0.075mm(3mil)
NPTH: +-0.05mm(2mil)
● Paʻa puka paʻa keleawe mānoanoa: 18-25um (0.71-0.99mil)
● Ka palena iki o ka pā SMT: 0.15mm (6mil)
● ʻO ka uhi ʻana o ka ʻili: ke gula hoʻoheheʻe ʻia kemika, ke kīpī, ke gula nickel-plated (wai / gula palupalu), pale kilika polū glue, etc.
● Ka mānoanoa o ka solder mask ma ka papa: 10-30μm (0.4-1.2mil)
● Ka ikaika ʻili: 1.5N/mm (59N/mil)
● Paʻakiki o ka huna huna: >5H
● Hiki i ka puka hoʻoheheʻe pale huna: 0.3-0.8mm (12mil-30mil)
● Dielectric mau: ε= 2.1-10.0
● Kū'ē kū'ē: 10KΩ-20MΩ
● Impedance hiʻona: 60 ohm±10%
● Haʻalulu wela: 288 ℃, 10 sec
● Warpage o ka papa i pau: <0.7%
● Hoʻohana huahana: nā lako kamaʻilio, nā uila uila, nā mea kani, ka ʻōnaehana hoʻonohonoho honua, kamepiula, MP4, lako mana, nā mea hana home, etc.