He nui nā inoa o ka PCB alumini substrate, ka pale alumini, ka PCB alumini, ka papa kaapuni paʻi metala (MCPCB), ka PCB thermally conductive, a me nā mea ʻē aʻe. a ʻo ka dielectric i hoʻohana maʻamau ʻo ia ʻo 5 a 10 mau manawa i ka conductivity thermal o ke aniani epoxy maʻamau, a ʻoi aku ka maikaʻi o ka hoʻoili wela o ka hapaʻumi o ka mānoanoa ma mua o ka PCB paʻa kahiko. E hoʻomaopopo kākou i nā ʻano o ka PCB alumini substrates ma lalo nei.
1. Pa'i alumini ma'alahi
ʻO kekahi o nā mea hou loa i nā mea IMS he dielectrics maʻalahi. Hiki i kēia mau mea ke hāʻawi i ka insulation uila maikaʻi loa, ka maʻalahi a me ka conductivity thermal. Ke hoʻohana ʻia i nā mea alumini maʻalahi e like me 5754 a i ʻole nā mea like, hiki ke hoʻokumu ʻia nā huahana e hoʻokō i nā ʻano like ʻole a me nā kihi, hiki ke hoʻopau i nā mea paʻa paʻa, nā kaula a me nā mea hoʻohui. ʻOiai ua maʻalahi kēia mau mea, ua hoʻolālā ʻia lākou e kūlou i kahi a noho ma kahi.
2. Huina alumini alumini substrate
I loko o ka "hybrid" IMS structure, ua hana kūʻokoʻa nā "sub-components" o nā mea wela ʻole, a laila hoʻopaʻa ʻia nā Amitron Hybrid IMS PCB i ka substrate alumini me nā mea wela. ʻO ka hana maʻamau he 2-layer a i ʻole 4-layer subassembly i hana ʻia me ka FR-4 kuʻuna, hiki ke hoʻopaʻa ʻia i kahi substrate alumini me kahi thermoelectric e kōkua i ka hoʻopau ʻana i ka wela, hoʻonui i ka rigidity, a hana ma ke ʻano he pale. Loaʻa nā pōmaikaʻi ʻē aʻe:
1. ʻO ke kumukūʻai haʻahaʻa ma mua o nā mea conductive thermal a pau.
2. Hāʻawi i ka hana wela maikaʻi ma mua o nā huahana FR-4 maʻamau.
3. Hiki ke hoʻopau ʻia nā puʻu wela nui a me nā ʻanuʻu hui e pili ana.
4. Hiki ke hoʻohana ʻia i nā noi RF e koi ana i nā hiʻohiʻona pohō RF o ka papa honua PTFE.
5. E hoʻohana i nā puka makani ʻāpana i ka alumini no ka hoʻokomo ʻana i nā ʻāpana o loko o ka puka, kahi e hiki ai i nā mea hoʻohui a me nā kaula ke hele i ka mea hoʻohui ma o ka substrate i ka wā e wiliwili ai i nā kihi poʻe e hana i kahi sila me ka ʻole o ka pono o nā gaskets kūikawā a i ʻole nā mea hoʻololi pipiʻi ʻē aʻe.
ʻEkolu, multilayer alumini substrate
Ma ka mākeke lako mana kiʻekiʻe, hana ʻia nā multilayer IMS PCB me nā dielectrics thermally conductive multilayer. Aia kēia mau hale i hoʻokahi a ʻoi aku paha o nā ʻāpana kaapuni i kanu ʻia i loko o ka dielectric, a ua hoʻohana ʻia nā vias makapō e like me nā ala wela a i ʻole nā ala hōʻailona. ʻOiai ʻoi aku ka pipiʻi o nā hoʻolālā papa hoʻokahi a ʻoi aku ka maikaʻi o ka hoʻololi ʻana i ka wela, hāʻawi lākou i kahi hopena hoʻomaha maʻalahi a maikaʻi no nā hoʻolālā paʻakikī.
ʻEhā, ma loko o ka puka alumini substrate
I loko o ka hale paʻakikī, hiki i kahi papa o ka alumini ke hana i ka "core" o kahi hoʻolālā thermal multilayer. Ma mua o ka lamination, ua electroplated ka alumini a hoʻopiha ʻia me ka dielectric ma mua. Hiki ke laminated i nā ʻaoʻao ʻelua o ka alumini me ka hoʻohana ʻana i nā mea hoʻopili wela. Ke laminated ʻia, ua like ka hui i hoʻopau ʻia me kahi substrate alumini multilayer kuʻuna ma ka wili ʻana. Hoʻopili ʻia i loko o nā lua e hele i nā āpau i loko o ka alumini e mālama i ka hoʻokaʻawale uila. ʻO kahi ʻē aʻe, hiki i ke kumu keleawe ke ʻae i ka hoʻopili uila pololei a me ka insulating vias.