ʻO ke kaʻapuni kiʻiʻoniʻoni mānoanoa e pili ana i ke kaʻina hana o ke kaʻapuni, e pili ana i ka hoʻohana ʻana i ka ʻenehana semiconductor hapa e hoʻohui i nā ʻāpana discrete, nā ʻāpana ʻokoʻa, nā pilina metala, a me nā mea ʻē aʻe ma kahi substrate seramika. ʻO ka maʻamau, paʻi ʻia ke kū'ē ma ka substrate a hoʻoponopono ʻia ke kū'ē e ka laser. ʻO kēia ʻano o ka pōʻai kaʻapuni he 0.5%. Hoʻohana maʻamau ia i ka microwave a me nā kahua aerospace.

Nā hiʻohiʻona huahana

1. Mea paʻa: 96% alumina a i ʻole beryllium oxide ceramic

2. Mea hoʻokele waiwai: nā mea e like me ke kālā, palladium, platinum, a me ke keleawe hou loa

3. Paʻi kūʻē: ma ke ʻano holoʻokoʻa

4. Kaʻina hana maʻamau: CAD–ka hana pā—paʻi—hoʻomaloʻo–sintering–hoʻoponopono kūʻē-hoʻokomo pine–hoʻāʻo.

5. Ke kumu o ka inoa: ʻO ka mānoanoa kiʻiʻoniʻoni kūʻē a me ka conductor film mānoanoa ma mua o 10 microns, ʻoi aku ka mānoanoa ma mua o ka mānoanoa kiʻiʻoniʻoni o ke kaapuni i hana ʻia e ka sputtering a me nā kaʻina hana ʻē aʻe, no laila ua kapa ʻia ʻo ia ke kiʻi mānoanoa. ʻOiaʻiʻo, ʻo ka mānoanoa kiʻiʻoniʻoni o ke kaʻina hana i paʻi ʻia i kēia manawa ʻoi aku ka liʻiliʻi ma mua o 10 microns.

Nā wahi noi:

Hoʻohana nui ʻia i ka volta kiʻekiʻe, ka insulation kiʻekiʻe, ke alapine kiʻekiʻe, ka wela kiʻekiʻe, ka hilinaʻi kiʻekiʻe, nā huahana uila liʻiliʻi. Ua helu ʻia kekahi mau wahi noi penei:

1. Nā papa kaapuni seramika no nā oscillator uaki kiʻekiʻe, nā oscillator i hoʻomalu ʻia i ka uila, a me nā oscillator i uku ʻia i ka mahana.

2. Metallization o ka ceramic substrate o ka pahu hau.

3. Metallization o ka mauna inductor ceramic substrates. Metallization o inductor core electrodes.

4. Power electronic control module high insulation high voltage ceramic circuit board.

5. Nā papa kaapuni seramika no nā kaapuni wela kiʻekiʻe ma nā pūnāwai aila.

6. Papa kaapuni seramika paʻa paʻa.

7. DC-DC module mana seramika papa kaapuni.

8. Kaʻa kaʻa, hoʻoponopono kaʻa kaʻa, module hoʻāla.

9. Module uila uila.