Hāʻule ka uea keleawe PCB (i kapa ʻia ʻo ka hoʻolei keleawe). Wahi a nā hale hana PCB he pilikia laminate a koi i kā lākou hale hana hana e lawe i nā poho maikaʻi ʻole.

1. Hoʻopili ʻia ka pahu keleawe. ʻO ka pahu keleawe electrolytic i hoʻohana ʻia ma ka mākeke ʻo ia ka galvanized ʻaoʻao hoʻokahi (i ʻike ʻia ʻo ka foil lehu) a me ka ʻaoʻao copper-plated (i ʻike ʻia ʻo red foil). ʻO ke keleawe maʻamau i hoʻolei ʻia he keleawe galvanized ma luna o 70um Foil, ʻulaʻula ʻulaʻula a me ka lehu foil ma lalo o 18um ma ke kumu ʻaʻohe hui keleawe ʻole. Ke ʻoi aku ka maikaʻi o ka hoʻolālā kaapuni o ka mea kūʻai aku ma mua o ka laina etching, inā hoʻololi ʻia nā kikoʻī keleawe keleawe akā ʻaʻole i hoʻololi ʻia nā ʻāpana etching, lōʻihi loa ka manawa noho o ka pahu keleawe i loko o ka hopena etching. No ka mea, he metala ikaika ka zinc, i ka wā i hoʻokomo ʻia ai ka uea keleawe ma ka PCB i loko o ka hopena etching no ka manawa lōʻihi, hiki ke alakaʻi i ka corrosion ʻaoʻao nui o ke kaapuni, e hoʻopiʻi ʻia ai kekahi ʻāpana ʻāpana ʻāpana zinc e hoʻihoʻi ʻia. hoʻokaʻawale ʻia mai ka substrate. ʻO ia hoʻi, hāʻule ke kaula keleawe. ʻO kekahi kūlana, ʻaʻohe pilikia me ka PCB etching parameters, akā ma hope o ka holoi ʻia ʻana o ka etching me ka wai a me ka maloʻo maikaʻi ʻole, ua hoʻopuni ʻia ke kaula keleawe e ke koena etching solution ma ka PCB surface. Inā ʻaʻole i hana ʻia no ka manawa lōʻihi, e hoʻonui ʻia ka ʻaoʻao etching o ka uea keleawe. Kiola i ke keleawe. Hōʻike ʻia kēia kūlana ma ke ʻano o ka noʻonoʻo ʻana i nā laina lahilahi, a i ʻole i ka wā o ke anuanu, e ʻike ʻia nā hemahema like ma ka PCB holoʻokoʻa. Wehe i ka uwea keleawe e ʻike ai ua loli ke kala o ka ʻili pili me ka papa kumu (ʻo ka ʻili i kapa ʻia ʻo roughened surface). ʻOkoʻa ke kala o ka pahu keleawe mai ka pahu keleawe maʻamau. ʻIke ʻia ke kala keleawe maoli o ka papa lalo, a ʻo ka ikaika o ka ʻili ʻana o ka pahu keleawe ma ka laina mānoanoa he mea maʻamau.

2. A collision i kūloko i loko o ka PCB kaʻina hana, a me ke keleawe uea ua hoʻokaʻawale 'ia mai ka substrate e waho mechanical ikaika. He kūlana maikaʻi ʻole kēia hana maikaʻi ʻole. ʻO ka uwea keleawe i hoʻokuʻu ʻia e ʻike ʻia ka wili ʻana a i ʻole nā ​​ʻōpala / hopena i ka ʻaoʻao like. Inā ʻoe e ʻili i ka uea keleawe ma ka ʻāpana hemahema a nānā i ka ʻili o ka ʻili keleawe, hiki iā ʻoe ke ʻike i ke kala o ka ʻili o ka ʻili keleawe he mea maʻamau, ʻaʻohe erosion ʻaoʻao, a me ka ikaika peel. o ke keleawe foil mea maʻamau.

3. ʻAʻole kūpono ka hoʻolālā kaapuni PCB. Inā hoʻohana ʻia kahi pepa keleawe mānoanoa no ka hoʻolālā ʻana i kahi kaapuni i lahilahi loa, e hoʻoulu ʻia nō hoʻi ka nui o ka etching o ke kaapuni a me ka hōʻole keleawe.

2. Nā kumu no ka hana laminate:

Ma lalo o nā kūlana maʻamau, inā lōʻihi ka wela o ka laminate ma mua o 30 mau minuke, e hui pū ʻia ka pahu keleawe a me ka prepreg, no laila ʻaʻole e hoʻopili ka paʻi ʻana i ka ikaika hoʻopaʻa ʻana o ka pahu keleawe a me ka substrate i ka laminate. . Eia nō naʻe, i ke kaʻina hana o ka hoʻopaʻa ʻana a me ka hoʻopaʻa ʻana i nā laminates, inā ua haumia ka PP a i ʻole ka poʻo keleawe, ʻaʻole lawa ka ikaika hoʻopaʻa ma waena o ka pahu keleawe a me ka substrate ma hope o ka lamination, e hopena i ke kūlana (no nā papa nui wale nō) Nā huaʻōlelo. ) a i ʻole nā ​​uea keleawe maʻamau e hāʻule, akā ʻaʻole he mea ʻino ka ikaika o ka peel o ka pahu keleawe kokoke i nā uea paʻa.

3. Nā kumu no ka laminate maka mea:

1. E like me ka mea i ʻōlelo ʻia ma luna nei, ʻo nā pahu keleawe electrolytic maʻamau nā huahana a pau i galvanized a i ʻole keleawe-plated. Inā ʻano ʻino ka piko i ka wā o ka hana ʻana i ka hulu hipa, a i ʻole i ka wā galvanizing/copper plating, ʻino nā lālā aniani o ka plating, no laila ʻo ka ʻili keleawe ponoʻī ʻAʻole lawa ka ikaika o ka ʻili. I ka hana ʻia ʻana o nā mea pepa pepa i hoʻopaʻa ʻia i ka pepa ʻino i ka PCB a hoʻopili i loko o ka hale hana uila, e hāʻule ka uea keleawe ma muli o ka hopena o ka ikaika o waho. ʻAʻole hiki i kēia ʻano o ka hōʻole keleawe maikaʻi ʻole ke hōʻeha i ka ʻaoʻao ma hope o ka ʻili ʻana i ka uea keleawe e ʻike ai i ka ʻili o ka ʻili keleawe (ʻo ia hoʻi, ka ʻili pili me ka substrate), akā ʻilihune ka ikaika o ka peel o ka pahu keleawe holoʻokoʻa. .

2. ʻAʻole kūpono ka hoʻololi ʻana o ke keleawe keleawe a me ka resin: hoʻohana ʻia kekahi mau laminates me nā waiwai kūikawā, e like me ka HTg sheets, i kēia manawa no nā ʻōnaehana resin like ʻole. ʻO ka lāʻau lapaʻau i hoʻohana ʻia ʻo ia ka resin PN, a he maʻalahi ke ʻano o ke kaulahao resin molecular. He haʻahaʻa ka degere o ka crosslinking, a pono e hoʻohana i ka foil keleawe me kahi kiʻekiʻe kūikawā e kūlike me ia. I ka hana ʻana i nā laminates, ʻaʻole i kūlike ka hoʻohana ʻana i ka pahu keleawe me ka ʻōnaehana resin, ka hopena i ka lawa ʻole o ka ikaika o ka peeling o ka pepa metala-ʻaʻahu metala, a me ka uwea keleawe maikaʻi ʻole i ka wā e hoʻokomo ai.