ʻO nā papa kaapuni paʻi i hoʻohana ʻia i nā mea uila a me nā mea hana i kēia mau lā he nui nā mea uila i hoʻopaʻa paʻa ʻia. He ʻoiaʻiʻo koʻikoʻi kēia, ʻoiai ka piʻi ʻana o ka nui o nā mea uila ma ka papa kaapuni paʻi, pēlā ka nui o ka papa kaapuni. Eia naʻe, extrusion paʻi kaapuni nui nui, BGA pūʻolo ke hoʻohana 'ia nei.

Eia nā pōmaikaʻi nui o ka pūʻolo BGA e pono ai ʻoe e ʻike e pili ana i kēia mea. No laila, e nānā i ka ʻike i hāʻawi ʻia ma lalo nei:

1. BGA soldered pūʻolo me kiʻekiʻe haʻahaʻa

ʻO nā BGA kekahi o nā hoʻonā maikaʻi loa i ka pilikia o ka hana ʻana i nā pūʻolo liʻiliʻi no nā kaapuni hoʻohui maikaʻi i loaʻa i kahi nui o nā pine. Hoʻopuka ʻia nā pūʻolo o ka mauna i loko o ka laina ʻelua a me nā pūʻolo hoʻonohonoho pine ma o ka hōʻemi ʻana i nā haʻahaʻa.

ʻOiai ua hoʻohana ʻia kēia e lawe mai i nā pae kiʻekiʻe kiʻekiʻe, ʻo ia ka mea e paʻakikī ai ka mālama ʻana i ke kaʻina hana o nā pin. ʻO kēia no ka mea e piʻi aʻe ana ka pilikia o ka hoʻopili ʻana i nā pine header-to-header me ka emi ʻana o ka manawa ma waena o nā pine. Eia naʻe, hiki i ka BGA Soldering i ka pōʻai ke hoʻoponopono maikaʻi i kēia pilikia.

2. Ka lawe ʻana i ka wela

ʻO kekahi o nā pōmaikaʻi maikaʻi loa o ka pūʻolo BGA ʻo ka hoʻemi ʻana i ka pale wela ma waena o ka PCB a me ka pūʻolo. ʻAe kēia i ka wela i hana ʻia i loko o ka pūʻolo e kahe maikaʻi me ke kaapuni hoʻohui. Eia kekahi, e pale aku ia i ka chip mai ka overheating ma ke ala maikaʻi loa.

3. Haʻahaʻa inductance

ʻOi aku ka maikaʻi, ʻo nā conductors uila pōkole ke ʻano o ka inductance haʻahaʻa. ʻO ka inductance kahi hiʻohiʻona e hiki ke hoʻololi i nā hōʻailona makemake ʻole i nā kaʻa uila uila kiʻekiʻe. No ka mea he wahi pōkole ka BGA ma waena o ka PCB a me ka pūʻolo, aia ka inductance alakaʻi haʻahaʻa, e hāʻawi i ka hana ʻoi aku ka maikaʻi no nā mea pin.