Ma kahi o ka impedance o ka laina hōʻailona RF, pono e noʻonoʻo ka ʻōnaehana laminated o ka RF PCB hoʻokahi i nā pilikia e like me ka hoʻoheheʻe ʻana o ka wela, kēia manawa, nā mea hana, EMC, ka hoʻolālā a me ka hopena o ka ʻili. ʻO ka maʻamau, aia mākou i ka hoʻonohonoho ʻana a me ka hoʻopaʻa ʻana o nā papa paʻi multilayer. E hahai i kekahi mau kumu kumu:

A) Ua uhi ʻia kēlā me kēia papa o ka RF PCB me kahi wahi nui me ka ʻole o ka mokulele mana. ʻO nā papa luna a me lalo e pili ana i ka papa uea RF he mau mokulele honua.

ʻOiai inā he papa huila kikohoʻe-analog, hiki i ka ʻāpana kikohoʻe ke loaʻa i ka mokulele mana, akā pono ka ʻāpana RF e hoʻokō i ke koi o ka paving ākea ma kēlā me kēia papahele.

B) No ka papalua RF, ʻo ka papa luna ka papa hōʻailona, ​​a ʻo ka papa lalo ka papa honua.

ʻO ka papa hoʻokahi RF papa ʻehā, ʻo ka papa luna ka papa hōʻailona, ​​​​ʻo ka lua a me ka ʻehā o nā papa honua, a ʻo ke kolu o ka papa no nā laina mana a me nā mana. I nā hihia kūikawā, hiki ke hoʻohana ʻia kekahi mau laina hōʻailona RF ma ke kolu o ka papa. ʻOi aku ka nui o nā papa RF, a pēlā aku.
C) No ka RF backplane, ʻo ka papa luna a me lalo o ka papa honua ʻelua. I mea e hōʻemi ai i ka discontinuity impedance i hoʻokumu ʻia e nā vias a me nā mea hoʻohui, hoʻohana ka lua, ʻekolu, ʻehā, a me ka ʻelima i nā hōʻailona kikohoʻe.

ʻO nā ʻāpana laina ʻē aʻe ma ka ʻili lalo he mau papa hōʻailona lalo. Pēlā nō, ʻo nā ʻāpana ʻelua e pili ana i ka papa hōʻailona RF pono e lepo, a pono e uhi ʻia kēlā me kēia papa me kahi wahi nui.

D) No nā papa RF kiʻekiʻe, kiʻekiʻe o kēia manawa, pono e kau ʻia ka loulou nui RF ma ka papa luna a hoʻopili ʻia me kahi laina microstrip ākea.

He kūpono kēia i ka wela a me ka nalowale o ka ikehu, e hōʻemi ana i nā hewa corrosion uea.

E) Pono ka mokulele mana o ka ʻāpana kikohoʻe e kokoke i ka mokulele honua a hoʻonohonoho ʻia ma lalo o ka mokulele honua.

Ma kēia ala, hiki ke hoʻohana ʻia ka capacitance ma waena o nā papa metala ʻelua e like me ka capacitor smoothing no ka lako mana, a i ka manawa like, hiki i ka mokulele honua ke pale aku i ka radiation i hāʻawi ʻia ma ka mokulele mana.

Hiki ke kuhikuhi ʻia ke ʻano hoʻonohonoho kikoʻī a me nā koi mahele mokulele i ka "20050818 Printed Circuit Board Design Specification-EMC Requirements" i hoʻolaha ʻia e ka EDA Design Department, a e lanakila nā kūlana pūnaewele.

2
Nā koi uwea papa RF
2.1 Kihi

Inā hele ka hōʻailona hōʻailona RF ma nā kihi ʻākau, e hoʻonui ʻia ka laulā laina kūpono ma nā kihi, a lilo ka impedance i ka pau ʻole a kumu no ka noʻonoʻo ʻana. No laila, pono e hana i nā kihi, ma ke ʻano ʻelua: ʻoki kihi a me ka hoʻopuni.

(1) Ua kūpono ke kihi ʻokiʻoki no nā piko liʻiliʻi, a hiki i ke alapine kūpono o ke kihi i ʻoki ʻia ke hiki i 10GHz.

(2) Pono e nui ka radius o ke kihi arc. Ma ka ʻōlelo maʻamau, e hōʻoia: R>3W.

2.2 Uea microstrip

ʻO ka papa luna o ka PCB e lawe i ka hōʻailona RF, a ʻo ka papa mokulele ma lalo o ka hōʻailona RF pono kahi mokulele honua holoʻokoʻa e hana i kahi ʻano laina microstrip. No ka hōʻoia ʻana i ka paʻa o ka laina microstrip, aia nā koi aʻe:

(1) Pono nā ʻaoʻao ma nā ʻaoʻao ʻelua o ka laina microstrip ma ka liʻiliʻi he 3W ākea mai ka lihi o ka mokulele honua ma lalo. A ma ka laulā 3W, ʻaʻole pono nā vias non-grounded.

(2) Pono e mālama ʻia ka mamao ma waena o ka laina microstrip a me ka pā pale ma luna o 2W. (E hoʻomaopopo: ʻo W ka laulā laina).

(3) Pono e mālama ʻia nā laina microstrip uncoupled ma ka papa like me ka ʻili keleawe lepo a pono e hoʻohui ʻia nā vias lepo i ka ʻili keleawe lepo. ʻOi aku ka mamao o ka lua ma lalo o λ/20, a ua hoʻonohonoho like ʻia.

ʻO ka ʻaoʻao o ka lepo keleawe keleawe e maʻemaʻe, pālahalaha, ʻaʻohe ʻoi ʻoi. Manaʻo ʻia e ʻoi aku ka nui o ka lihi o ke keleawe i uhi ʻia i ka honua ma mua a i ʻole like me ka laula o 1.5W a i ʻole 3H mai ka lihi o ka laina microstrip, a ʻo H ka mānoanoa o ka microstrip substrate medium.

(4) ʻAʻole ʻae ʻia ka uea hōʻailona RF e hele i ke āpau o ka mokulele honua o ka papa ʻelua.
2.3 ʻO nā uwila ʻāʻī
I kekahi manawa hele nā ​​hōʻailona alapine i ka papa waena o ka PCB. ʻO ka mea maʻamau mai ka papa ʻekolu. ʻO ka papa ʻelua a me ka ʻehā he papa honua holoʻokoʻa, ʻo ia hoʻi, kahi ʻano laina eccentric. E hōʻoiaʻiʻo ʻia ka paʻa o ka laina laina. ʻO nā koi e:

(1) ʻO nā ʻaoʻao ma nā ʻaoʻao ʻelua o ka laina kaha he 3W ka laula mai ka ʻaoʻao o luna a me lalo o ka honua, a i loko o 3W, ʻaʻohe vias i hoʻopaʻa ʻole ʻia.

(2) ʻAʻole ʻae ʻia ka laina laina RF e hele i ke āpau ma waena o nā mokulele luna a me lalo.

(3) Pono e mālama ʻia nā laina ʻili ma ka papa like me ka ʻili keleawe lepo a pono e hoʻohui ʻia nā vias lepo i ka ʻili keleawe lepo. ʻOi aku ka mamao o ka lua ma lalo o λ/20, a ua hoʻonohonoho like ʻia. ʻO ka lihi o ka lepo keleawe pepa e maʻemaʻe, pālahalaha a ʻaʻohe ʻoi ʻoi.

Manaʻo ʻia ʻoi aku ka ʻoi aku o ka ʻili keleawe i uhi ʻia i ka honua ma mua a i ʻole like me ka laula o 1.5W a i ʻole ka laula o 3H mai ka lihi o ka laina kaha. Hōʻike ka H i ka mānoanoa holoʻokoʻa o nā papa dielectric o luna a me lalo o ka laina kaha.

(4) Inā e hoʻouna ka laina laina i nā hōʻailona mana kiʻekiʻe, i mea e pale aku ai i ka lahilahi o ka laulā laina 50 ohm, ʻo ka maʻamau o nā ʻili keleawe o nā papa kuhikuhi luna a me lalo o ka laina laina e hoʻokaʻawale ʻia, a ʻO ka laulā o ka hollowing out ka laina laina ʻOi aku ma mua o 5 mau manawa o ka nui o ka mānoanoa dielectric, inā ʻaʻole i kūpono ka laulā laina i nā koi, a laila ua hollow ʻia nā papa kuhikuhi papa luna a me lalo e pili ana.