pūʻolo DIP(Dual In-line Package), i ʻike ʻia ʻo ka ʻenehana hoʻopili ʻelua in-line packaging, e pili ana i nā ʻāpana kaapuni i hoʻohui ʻia i pūʻulu ʻia i loko o ke ʻano ʻelua in-line. ʻAʻole ʻoi aku ka nui o ka helu ma mua o 100. ʻElua lālani o nā pine i hoʻokomo ʻia i loko o kahi puʻupuʻu chip DIP me kahi hoʻolālā DIP. ʻOiaʻiʻo, hiki ke hoʻokomo pololei ʻia i loko o kahi papa kaapuni me ka helu like o nā lua solder a me ka hoʻonohonoho geometric no ka soldering. Pono e hoʻopaʻa ʻia a wehe ʻia nā chips DIP-packaged mai ke kumu chip me ka mālama kūikawā e pale aku i ka pōʻino o nā pine. ʻO nā ʻano hana pūʻolo DIP ʻo ia: DIP DIP seramika multi-layer, DIP seramika papa hoʻokahi, DIP pahu alakaʻi (me ke ʻano hoʻopaʻa aniani seramic, ke ʻano o ka hoʻopili ʻana i ka plastik, ke ʻano pahu pahu aniani hoʻoheheʻe haʻahaʻa)

Loaʻa i ka pōʻai DIP nā hiʻohiʻona penei:

1. He kūpono no ka hoʻoheheʻe ʻana i ka perforation ma PCB (paʻi kaapuni papa), maʻalahi e hana;

2. He nui ka ratio ma waena o ka ʻāpana chip a me ka ʻāpana pūʻolo, no laila ua nui ka leo;

ʻO DIP ka pūʻolo plug-in kaulana loa, a ʻo kāna mau noi e komo pū me ka IC logic maʻamau, ka hoʻomanaʻo a me nā kaapuni microcomputer. ʻO ka mua loa 4004, 8008, 8086, 8088 a me nā CPU ʻē aʻe i hoʻohana i nā pūʻolo DIP, a hiki ke hoʻokomo ʻia nā lālani ʻelua o nā pine i loko o nā pahu ma ka motherboard a i kūʻai ʻia ma ka motherboard.