Me yasa PCB ke da ramuka a cikin ramin bangon ramin?

Magani kafin nutsewar tagulla

1. Deburring: The substrate yana ta hanyar hakowa kafin jan karfe nutse. Ko da yake wannan tsari yana da saurin fashewa, shine mafi mahimmancin ɓoyayyiyar haɗari wanda ke haifar da ƙaddamar da ƙananan ramuka. Dole ne a yi amfani da hanyar fasaha don warwarewa. Yawancin lokaci ana amfani da hanyoyin injiniya don yin gefen rami da bangon rami na ciki ba tare da barbs ko toshe ba.
2. Rage jiki
3. Roughening magani: yafi don tabbatar da kyau bonding ƙarfi tsakanin karfe shafi da substrate.
4. Jiyya na kunnawa: galibi suna samar da “cibiyar qaddamarwa” don yin jigilar tagulla iri ɗaya.

 

Abubuwan da ke haifar da ɓarna a cikin bangon rami:
Ramin bango plating rami lalacewa ta hanyar 1PTH
(1) Abubuwan da ke cikin tagulla, sodium hydroxide da haɓakar formaldehyde a cikin nutsewar jan karfe
(2) zazzabin wanka
(3) Sarrafa maganin kunnawa
(4) Tsaftace zafin jiki
(5) Yanayin zafin amfani, maida hankali da lokacin mai gyara pore
(6) Yi amfani da zafin jiki, maida hankali da lokacin rage wakili
(7) Oscillator da lilo

 

2 Ramin bangon bango wanda ya haifar da canjin tsari
(1) Farantin goga kafin magani
(2) Sauran manne a orifice
(3) Pretreatment micro-etching

3 Ramin platin bangon bango wanda ya haifar da platin ƙirar ƙira
(1) Micro-etching na zane plating
(2) Tinning (ruwan gubar) yana da mummunan tarwatsewa

Akwai dalilai da yawa waɗanda ke haifar da ɓarna mai lalacewa, mafi yawan gama gari shine ɓoyayyun suturar PTH, wanda zai iya rage haɓakar ɓarna na PTH yadda ya kamata ta hanyar sarrafa sigogin tsari masu dacewa na potion. Duk da haka, wasu dalilai ba za a iya watsi da su ba. Sai kawai ta hanyar lura da hankali da fahimtar abubuwan da ke haifar da ɓarna na sutura da halayen lahani za a iya magance matsalolin cikin lokaci da inganci kuma ana iya kiyaye ingancin samfuran.