Menene lahani a cikin ƙirar abin rufe fuska na PCBA?

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1. Haɗa pads zuwa ramukan.A ka'ida, ya kamata a siyar da wayoyi tsakanin matattarar hawa da ramuka.Rashin abin rufe fuska zai haifar da lahani na walda kamar ƙarancin tin a cikin mahaɗin solder, walda mai sanyi, gajeriyar da'ira, haɗin gwiwar da ba a siyar da su ba, da duwatsun kaburbura.

2. The solder mask zane tsakanin gammaye da solder mask samfurin ƙayyadaddun ya kamata su dace da zane na solder m rarraba na takamaiman aka gyara: idan taga-type solder resist da ake amfani da tsakanin gammaye, da solder juriya zai sa solder. tsakanin pads a lokacin soldering.Idan akwai gajeriyar da'ira, an ƙera pads ɗin don samun tsayayyar solder mai zaman kanta tsakanin fil ɗin, don haka ba za a sami ɗan gajeren da'ira tsakanin pads yayin waldawa ba.

3. Girman samfurin abin rufe fuska na solder na abubuwan da aka gyara bai dace ba.Tsarin ƙirar abin rufe fuska na solder wanda ya yi girma sosai zai "garkewa" juna, wanda ba zai haifar da abin rufe fuska ba, kuma tazara tsakanin abubuwan da aka gyara ya yi ƙanƙanta.

4. Akwai via ramukan karkashin aka gyara ba tare da solder mask, kuma babu solder mask via ramukan karkashin aka gyara.A solder a kan via ramukan bayan taguwar ruwa soldering na iya shafar amincin IC waldi, kuma yana iya haifar da gajeriyar da'irar aka gyara, da dai sauransu. lahani.