Gabatarwa zuwa Mashin Solder
Kushin juriya shine soldermask, wanda ke nufin ɓangaren allon da'irar da za a fentin da kore mai. A gaskiya ma, wannan abin rufe fuska na solder yana amfani da mummunan fitarwa, don haka bayan an tsara siffar abin rufe fuska a kan allo, ba a zana mashin solder da koren mai ba, amma fata na jan karfe yana nunawa. Yawancin lokaci don ƙara kaurin fatar tagulla, ana amfani da abin rufe fuska don rubuta layi don cire koren mai, sannan a saka kwano don ƙara kauri na wayar tagulla.
Abubuwan buƙatu don abin rufe fuska na solder
Abin rufe fuska na solder yana da matuƙar mahimmanci wajen sarrafa lahani na saida a cikin reflow soldering. Masu zanen PCB yakamata su rage tazara ko gibin iska a kusa da pads.
Kodayake injiniyoyi da yawa sun gwammace su raba duk fasalin kushin akan allo tare da abin rufe fuska mai siyarwa, tazarar fil da girman kushin na abubuwan da aka gyara masu kyau zasu buƙaci kulawa ta musamman. Kodayake buɗewar abin rufe fuska ko tagogin da ba a sanya shi a ɓangarorin huɗu na qfp na iya zama karɓaɓɓu, yana iya zama da wahala a sarrafa gadoji mai siyarwa tsakanin fil ɗin abubuwan. Don abin rufe fuska na bga, kamfanoni da yawa suna ba da abin rufe fuska wanda baya taɓa pads, amma yana rufe kowane fasali tsakanin pads don hana gadoji mai siyarwa. Yawancin PCBs masu hawa sama an rufe su da abin rufe fuska, amma idan kaurin abin rufe fuska ya fi 0.04mm, yana iya shafar aikace-aikacen manna solder. PCBs masu hawa saman saman, musamman waɗanda ke amfani da abubuwan da suka dace, suna buƙatar ƙaramin abin rufe fuska mai ɗaukar hoto.
Samar da aiki
Dole ne a yi amfani da kayan abin rufe fuska ta hanyar rigar tsari ko bushewar fim. Dry film solder mask kayan ana kawota a cikin wani kauri na 0.07-0.1mm, wanda zai iya zama dace da wasu surface Dutsen kayayyakin, amma wannan abu ba da shawarar ga kusa-fit aikace-aikace. Kaxan kamfanoni ne ke ba da busassun fina-finai waɗanda ba su da sirara da za su dace da ƙayyadaddun ƙa'idodi masu kyau, amma akwai ƴan kamfanoni da za su iya samar da kayan rufe fuska mai ɗaukar hoto. Gabaɗaya, buɗe abin rufe fuska ya kamata ya zama 0.15mm ya fi girma fiye da kushin. Wannan yana ba da damar tazarar 0.07mm a gefen kushin. Low-profile ruwa photosensitive abin rufe fuska solder kayan ne na tattali kuma yawanci ana kayyade don saman Dutsen aikace-aikace don samar da daidai girman fasali masu girma dabam da gibba.
Gabatarwa ga soldering Layer
Ana amfani da Layer ɗin siyar don marufi na SMD kuma yayi daidai da pads na abubuwan SMD. A cikin sarrafa SMT, yawanci ana amfani da farantin karfe, kuma ana buga PCB daidai da pads ɗin abubuwan, sa'an nan kuma ana sanya man siyar akan farantin karfe. Lokacin da PCB yana ƙarƙashin farantin karfe, manna mai siyar yana yoyo, kuma yana kan kowane pad Ana iya lalata shi da solder, don haka yawanci abin rufe fuska bai kamata ya fi girman girman kushin ba, zai fi dacewa ƙasa da ko daidai da ainihin kushin girman.
Matsayin da ake buƙata kusan iri ɗaya ne da na abubuwan haɗin saman dutsen, kuma manyan abubuwan sune kamar haka:
1. BeginLayer: ThermalRelief da AnTIPad sun fi 0.5mm girma fiye da ainihin girman kushin yau da kullun
2. EndLayer: ThermalRelief da AnTIPad sun fi 0.5mm girma fiye da ainihin girman kushin yau da kullun.
3. DEFAULTINTERNAL: tsakiyar Layer
Matsayin solder mask da juyi Layer
Layer abin rufe fuska yana hana faifan tagulla na allon kewayawa kai tsaye zuwa iska kuma yana taka rawar kariya.
Ana amfani da Layer ɗin ɗin don yin ragar ƙarfe don masana'antar ragar ƙarfe, kuma ragar ƙarfe na iya sanya man siyar daidai a kan facin facin da ake buƙatar siyarwa a lokacin tinning.
Bambanci tsakanin PCB soldering Layer da solder mask
Ana amfani da yadudduka biyu don siyarwa. Ba wai ana sayar da daya ne, dayan kuma koren mai ba ne; amma:
1. The solder mask Layer yana nufin bude taga a kan kore mai na dukan solder mask, da manufar shi ne ba da damar waldi;
2. Ta hanyar tsoho, yankin ba tare da abin rufe fuska ba dole ne a fentin shi da koren mai;
3. Ana amfani da Layer solder don marufi na SMD.