1. Tsarin ƙari

Ana amfani da Layer na jan ƙarfe na sinadarai don haɓaka kai tsaye na layin madugu na gida akan farfajiyar da ba ta da jagora tare da taimakon ƙarin mai hanawa.

Hanyoyin haɓakawa a cikin allon kewayawa za a iya raba su zuwa cikakkiyar ƙari, ƙara rabin rabi da ƙari da sauran hanyoyi daban-daban.

2. Takalma na baya, Jirgin baya

Yana da kauri (kamar 0.093″,0.125″) allon kewayawa, musamman ana amfani dashi don toshewa da haɗa sauran allunan. Ana yin hakan ne ta hanyar shigar da Connector Multi-Pin a cikin matsattsen rami, amma ba ta hanyar sayar da shi ba, sannan sai a yi amfani da waya daya bayan daya a cikin wayar da na’urar ta ratsa ta cikin allo. Ana iya shigar da mai haɗawa daban a cikin allon kewayawa na gabaɗaya. Saboda wannan shi ne na musamman jirgin, ta' ta rami ba zai iya solder, amma bari rami bango da kuma shiryar da waya kai tsaye katin m amfani, don haka da ingancin da buƙatun buƙatun ne musamman m, da oda yawa ba mai yawa, general kewaye hukumar factory. ba ya son kuma ba sauƙin karɓar irin wannan tsari ba, amma ya kusan zama babban matsayi na masana'antu na musamman a Amurka.

3. BuildUp tsari

Wannan wani sabon fanni ne na yin don bakin ciki multilayer, wayewar farko ta samo asali ne daga tsarin IBM SLC, a cikin aikin gwajin shukar Yasu na Jafananci ya fara ne a cikin 1989, hanyar ta dogara ne akan rukunin al'ada biyu na gargajiya, tunda bangarorin biyu na waje sun fara ingantaccen inganci. kamar Probmer52 kafin shafi ruwa photosensitive, bayan rabin hardening da m bayani kamar yin ma'adinai tare da na gaba Layer na m nau'i na "hankali na gani rami" (Photo - Via), sa'an nan zuwa sinadaran m karuwa madugu na jan karfe da kuma jan plating. Layer, da kuma bayan layi na hoto da etching, na iya samun sabuwar waya kuma tare da haɗin haɗin gwiwar da aka binne rami ko rami makaho. Maimaita yadudduka zai samar da adadin da ake buƙata na yadudduka. Wannan hanya ba za ta iya guje wa tsadar tsadar injin hakowa ba, har ma ta rage diamita na ramin zuwa ƙasa da mil 10. A cikin shekaru 5 ~ 6 da suka gabata, kowane nau'in ɓarke ​​​​na al'ada ya ɗauki fasahar multilayer mai zuwa, a cikin masana'antar Turai a ƙarƙashin turawa, yin irin wannan Tsarin BuildUp, samfuran da ake da su ana jera su fiye da nau'ikan 10. Sai dai “pores masu ɗaukar hoto”; Bayan cire murfin tagulla tare da ramuka, hanyoyi daban-daban na "rami samu" irin su alkaline chemical Etching, Laser Ablation, da Plasma Etching ana ɗaukar su don faranti. Bugu da kari, sabon Resin Coated Copper Foil (Resin Coated Copper Foil) wanda aka lullube shi da resin mai kauri kuma ana iya amfani da shi don yin faranti mai yawa, ƙarami da sirara tare da Lamination Sequential. A nan gaba, bambance-bambancen samfuran lantarki na sirri za su zama irin wannan nau'in ainihin sirara da gajeriyar allon allo mai nau'i-nau'i da yawa.

4. Karfi

An haɗu da yumbu foda da foda na ƙarfe, kuma an ƙara m a matsayin nau'i mai nau'i, wanda za'a iya buga shi a saman allon kewayawa (ko Layer na ciki) ta fim mai kauri ko fim mai laushi, a matsayin wuri na "resistor", maimakon. na waje resistor a lokacin taro.

5. Yin harbi tare

Yana da wani tsari na ain Hybrid kewaye allon. Layukan da'ira na Maƙallin Fim mai kauri na ƙarfe masu daraja iri-iri da aka buga a saman ƙaramin allo ana harba su da zafi mai zafi. An ƙone nau'ikan jigilar kwayoyin halitta daban-daban a cikin manna fim mai kauri, suna barin layin madugu na ƙarfe mai daraja don amfani da su azaman wayoyi don haɗin gwiwa.

6. Crossover

Ana kiran haye-haye mai girma uku na wayoyi biyu akan saman allo da kuma cika matsakaicin insulating tsakanin wuraren digowa. Gabaɗaya, koren fenti guda ɗaya tare da jumper na fim ɗin carbon, ko hanyar Layer sama da ƙasa da wayoyi sune irin wannan “Crossover”.

7. Wuraren Waya Mai Rarraba

Wata kalma don allon wayoyi da yawa, an yi shi da waya mai zagaye da aka haɗe zuwa allon kuma an ratsa shi da ramuka. Ayyukan wannan nau'in allon multix a cikin babban layin watsawa ya fi kyau fiye da layin murabba'i mai faɗi da PCB na yau da kullun.

8. DYCO dabarun

Kamfanin Dyconex na Switzerland ne ya haɓaka Gina Tsarin a Zurich. Hanya ce ta haƙƙin mallaka don cire foil ɗin tagulla a wuraren ramukan da ke kan farantin farantin, sannan a sanya shi a cikin rufaffiyar muhalli, sannan a cika shi da CF4, N2, O2 don ionize a babban ƙarfin lantarki don samar da Plasma mai aiki sosai. , wanda za'a iya amfani dashi don lalata kayan tushe na wuraren da aka lalata da kuma samar da ƙananan ramukan jagora (kasa da mil 10). Ana kiran tsarin kasuwanci DYCOstrate.

9. Electro-Deposited Photoresist

Lantarki photoresistance, electrophoretic photoresistance wani sabon "photosensitive juriya" gini hanya, asali amfani da su bayyanar da hadaddun karfe abubuwa "lantarki fenti", kwanan nan gabatar da "photoresistance" aikace-aikace. Ta hanyar yin amfani da lantarki, ɓangarorin colloidal da aka caje na resin da aka caje su ana lulluɓe su iri ɗaya a saman saman tagulla na allon kewayawa azaman mai hanawa daga etching. A halin yanzu, an yi amfani da shi wajen samar da taro a cikin aikin jan ƙarfe kai tsaye etching na ciki laminate. Irin wannan ED photoresist za a iya sanya shi a cikin anode ko cathode bi da bi bisa ga hanyoyi daban-daban na aiki, wanda ake kira "anode photoresist" da "cathode photoresist". Dangane da ka'idar daukar hoto daban-daban, akwai "Polymerization photosensitive" (Negative Working) da" bazuwar hotuna" (Aiki mai kyau) da sauran nau'ikan biyu. A halin yanzu, mummunan nau'in ED photoresistance an sayar da shi, amma ana iya amfani dashi kawai azaman wakili na juriya. Saboda wahalar ɗaukar hoto a cikin rami, ba za a iya amfani da shi don canja wurin hoto na farantin waje ba. Amma ga "tabbatacce ED", wanda za'a iya amfani dashi azaman wakili na photoresist don farantin waje (saboda membrane mai ɗaukar hoto, rashin tasirin tasirin hoto akan bangon rami ba ya shafa), masana'antar Japan har yanzu tana haɓaka ƙoƙarin don yin kasuwanci da yin amfani da yawan jama'a, ta yadda za a iya samun nasarar samar da layin sirara cikin sauƙi. Ana kuma kiran kalmar Electrothoretic Photoresist.

10. Mai Gudanarwa

Allon kewayawa ce ta musamman wacce ba ta da kyau gaba daya a siffa kuma tana danna duk layin madugu cikin farantin. Ayyukan kwamitinsa guda ɗaya shine yin amfani da hanyar canja wurin hoto don ƙulla wani ɓangare na foil ɗin tagulla na saman allo akan allon kayan tushe wanda ke da tsauri. High zafin jiki da kuma high matsa lamba hanya zai zama jirgin line a cikin Semi-taurare farantin, a lokaci guda don kammala farantin guduro hardening aiki, a cikin layi a cikin surface da duk lebur kewaye hukumar. A al'ada, wani bakin ciki na jan karfe yana cirewa daga saman da'irar mai juyawa ta yadda za a iya sanya Layer nickel 0.3mil, Layer rhodium 20-inch, ko 10-inch zinariya Layer don samar da ƙananan juriya da sauƙin zamewa yayin hulɗar zamewa. . Koyaya, bai kamata a yi amfani da wannan hanyar don PTH ba, don hana ramin fashe lokacin dannawa. Ba abu mai sauƙi ba ne don cimma cikakkiyar farfajiyar allon, kuma kada a yi amfani da shi a yanayin zafi mai yawa, idan resin ya faɗaɗa sannan ya fitar da layin daga saman. Wanda kuma aka sani da Etchand-Push, hukumar da aka gama ana kiranta Flush-Bonded Board kuma ana iya amfani da ita don dalilai na musamman kamar Rotary Switch da Share Contacts.

11. Hutu

A cikin bugu na Poly Thick Film (PTF), baya ga sinadarai masu daraja na ƙarfe, ana buƙatar ƙara foda na gilashin don kunna tasirin daɗaɗɗa da mannewa a cikin narke mai zafi, ta yadda za a liƙa bugu a kan. da blank yumbu substrate iya samar da wani m karfe kewaye tsarin.

12. Cikakken-Tsarin Ƙarfafawa

Yana a kan takardar cikakken rufi, ba tare da wani electrodeposition na karfe Hanyar (mafi rinjaye shi ne sinadaran jan karfe), da girma da zažužžukan da'irar yi, wani magana da cewa ba daidai ba ne "Fully Electroless".

13. Hybrid Integrated Circuit

Yana da wani karamin ain bakin ciki substrate, a cikin bugu Hanyar amfani da daraja karfe conductive tawada line, sa'an nan ta high zafin jiki tawada kwayoyin halitta kone tafi, barin wani shugaba line a kan surface, kuma zai iya gudanar da wani surface bonding sassa na waldi. Wani nau'in nau'in jigilar kaya ne na fasahar fim mai kauri tsakanin bugu da aka buga da na'urar haɗaɗɗiyar semiconductor. A baya amfani da soja ko high-mita aikace-aikace, da Hybrid ya girma da yawa ƙasa da sauri a cikin 'yan shekarun nan saboda ta high kudin, rage soja capabilities, da wahala a sarrafa kansa samar, kazalika da kara miniaturization da sophistication na kewaye allon.

14. Mai shiga tsakani

Interposer yana nufin duk wani nau'i biyu na madugu da ke ɗauke da jikin mai rufewa wanda ke gudana ta hanyar ƙara wasu filler a wurin da za'a iya gudanarwa. Misali, a cikin ramin dandali na faranti da yawa, kayan kamar cika manna azurfa ko manna tagulla don maye gurbin bangon ramin jan ƙarfe na al'ada, ko kayan kamar a tsaye unidirectional conductive roba Layer, duk masu shiga irin wannan nau'in ne.

15. Hoto kai tsaye na Laser (LDI)

Shi ne don danna farantin da aka haɗe zuwa busasshen fim, daina amfani da mummunan bayyanarwa don canja wurin hoto, amma maimakon umarnin laser katako na kwamfuta, kai tsaye a kan busassun fim don saurin yin hoto mai ɗaukar hoto. Bangon gefen busasshen fim ɗin bayan hoto ya fi tsayi a tsaye saboda hasken da ke fitowa yana layi ɗaya da katako mai ƙarfi guda ɗaya. Duk da haka, hanyar za ta iya aiki ne kawai a kan kowane jirgi daban-daban, don haka saurin samar da taro ya fi sauri fiye da yin amfani da fim da al'ada na al'ada. LDI na iya samar da alluna 30 na matsakaicin girman sa'a guda, don haka lokaci-lokaci yana iya bayyana a cikin nau'in tabbatar da takarda ko babban farashin naúra. Saboda tsadar haifuwa, yana da wahala a inganta a cikin masana'antar

16.Laser Maching

A cikin masana'antun lantarki, ana iya amfani da su da yawa daidaitattun sarrafawa, kamar yanke, hakowa, walda, da sauransu, ana iya amfani da su don aiwatar da makamashin hasken Laser, wanda ake kira hanyar sarrafa Laser. Laser yana nufin gajarta "Ƙarar Ƙarfafa Ƙarfafa Hasken Radiation", wanda masana'antar ƙasa ta fassara da "LASER" don fassarar kyauta, fiye da ma'ana. Masanin kimiyyar lissafi na Amurka th moser ne ya ƙirƙira Laser a cikin 1959, wanda ya yi amfani da hasken haske guda ɗaya don samar da hasken Laser akan yumbu. Shekaru na bincike sun haifar da sabuwar hanyar sarrafawa. Baya ga masana'antar lantarki, ana iya amfani da ita a fannin likitanci da na soja

17. Micro Waya Board

Allon kewayawa na musamman tare da haɗin haɗin PTH an fi sani da MultiwireBoard. Lokacin da yawan wayoyi ya yi yawa (160 ~ 250in/in2), amma diamita na waya ya yi ƙanƙanta (kasa da mil 25), kuma ana kiranta da allon rufewa na micro-sealed.

18. Molded Cirxuit

Yana amfani da mold mai girma uku, yin allura gyare-gyare ko hanyar canzawa don kammala aikin sitiriyo da'ira, mai suna Molded circuit ko Molded system connection circuit.

19 . Hukumar Muliwiring (Hukumar Waya Mai Waya)
Yana amfani da waya mai sirara sirara, kai tsaye a saman ba tare da farantin tagulla ba don na'urar giciye mai girma uku, sannan ta hanyar shafa kafaffen wayoyi da hakowa da ramin plating, allon da'ira mai haɗaɗɗiyar Layer Layer, wanda aka sani da “multi-wire board. ". PCK, wani kamfani na Amurka ne ya haɓaka wannan, kuma har yanzu Hitachi ne ke samar da shi tare da wani kamfani na Japan. Wannan MWB na iya adana lokaci a cikin ƙira kuma ya dace da ƙananan injuna masu haɗaɗɗun da'irori.

20. Noble Metal Manna

Yana da wani conductive manna ga lokacin farin ciki film kewaye bugu. Lokacin da aka buga shi a kan yumbura ta hanyar bugu na allo, sa'an nan kuma mai ɗaukar kwayoyin halitta ya ƙone a babban zafin jiki, ƙayyadaddun ƙirar ƙarfe mai daraja ya bayyana. The conductive karfe foda kara zuwa manna dole ne a daraja karfe don kauce wa samuwar oxides a high yanayin zafi. Masu amfani da kayayyaki suna da zinariya, platinum, rhodium, palladium ko wasu karafa masu daraja.

21. Pads Kawai Board

A cikin farkon kwanakin kayan aiki ta hanyar rami, wasu allunan multilayer masu dogaro da yawa kawai sun bar ramin ramin da zoben weld a wajen farantin kuma sun ɓoye layin haɗin kan ƙasan Layer na ciki don tabbatar da iyawar siyar da amincin layin. Irin wannan ƙarin yadudduka biyu na allon ba za a buga waldi koren fenti ba, a cikin bayyanar da hankali na musamman, ingantaccen dubawa yana da tsauri.

A halin yanzu saboda yawan wayoyi yana ƙaruwa, yawancin samfuran lantarki masu ɗaukar hoto (kamar wayar hannu), allon kewayawa yana fuskantar kushin SMT soldering pad kawai ko wasu layukan, da haɗin haɗin layin mai yawa zuwa cikin Layer na ciki, interlayer shima yana da wahala. zuwa tsayin ma'adinai an karye rami makafi ko rami makãho "rufin" (Pads-On-Hole), azaman haɗin haɗin don rage duka rami tare da lalata babban lalacewar tagulla, farantin SMT kuma sune Pads Kawai Board.

22. Polymer Thick Film (PTF)

Ƙarfe ɗin bugu mai daraja ne da ake amfani da shi wajen kera da'irori, ko bugu da ke samar da fim ɗin juriya da aka buga, akan yumbu, tare da bugu na allo da ƙona zafin jiki na gaba. Lokacin da mai ɗaukar kwayoyin halitta ya ƙone, ana samar da tsarin da'irar da'irar da aka haɗe. Irin waɗannan faranti gabaɗaya ana kiransu da da'irori masu haɗaka.

23. Tsari na Ƙarfafa Ƙarfafawa

Shi ne ya nuna a kan tushe abu na rufi, girma da'irar da ke bukatar farko kai tsaye da sinadaran jan karfe, sake canza electroplate jan karfe nufin ci gaba da kauri na gaba, kira "Semi-Additive" tsari.

Idan ana amfani da hanyar jan ƙarfe na sinadari don duk kauri na layi, ana kiran tsarin "ƙara duka". Lura cewa ma'anar da ke sama ta fito ne daga * ƙayyadaddun ipc-t-50e da aka buga a watan Yuli 1992, wanda ya bambanta da ainihin ipc-t-50d (Nuwamba 1988). Farkon “D version”, kamar yadda akafi sani a masana’antar, yana nufin wani abu ne wanda ko dai ba komai bane, mara amfani, ko siraren jan karfe (kamar 1/4oz ko 1/8oz). An shirya canja wurin hoto na wakilin juriya mara kyau kuma abin da ake buƙata yana kauri ta hanyar sinadari na jan karfe ko platin jan karfe. Sabuwar 50E ba ta ambaci kalmar "tagulla na bakin ciki ba". Rata tsakanin maganganun biyu yana da girma, kuma ra'ayoyin masu karatu sun samo asali ne da The Times.

24.Substractive Process

Ita ce saman kau da foil ɗin tagulla mara amfani na gida, tsarin da'irar da aka sani da “hanyar ragewa”, ita ce al'adar hukumar da'irar shekaru da yawa. Wannan ya bambanta da hanyar “ƙari” na ƙara layukan madugu na jan karfe kai tsaye zuwa madaidaicin jan ƙarfe.

25. Kaurin Fim

PTF (Polymer Thick Film Paste), wanda ya ƙunshi karafa masu daraja, ana buga shi a kan yumbura (irin su aluminum trioxide) sannan kuma a harba shi a babban zafin jiki don yin tsarin kewayawa tare da jagoran karfe, wanda ake kira "ƙarashin fim mai kauri". Wani nau'i ne na ƙananan Haɗaɗɗen kewaye. Jumper Manna Azurfa akan PCBS mai gefe guda shima bugu na fim ne mai kauri amma baya buƙatar kora a yanayin zafi. Layukan da aka buga a saman nau'ikan nau'ikan nau'ikan ana kiran su "fim mai kauri" kawai lokacin da kauri ya wuce 0.1mm [4mil], kuma fasahar kere kere irin wannan "tsarin kewayawa" ana kiranta "fasaharar fim mai kauri".

26. Fasahar Fina Finai
Ita ce da'ira da haɗin haɗin haɗin gwiwa da ke haɗe zuwa ƙasa, inda kauri bai wuce 0.1mm [4mil] ba, wanda Vacuum Evaporation ya yi, Pyrolytic Coating, Cathodic Sputtering, Chemical Vapor Deposition, electroplating, anodizing, da sauransu, wanda ake kira "bakin ciki. fasahar fim”. Abubuwan da ake amfani da su suna da Sirin Fim Hybrid Circuit da Thin Film Integrated Circuit, da dai sauransu

27. Transfer Laminatied Circuit

Yana da wani sabon kewaye hukumar samar da hanya, ta yin amfani da 93mil kauri da aka sarrafa santsi bakin karfe farantin, da farko yi korau bushe fim graphics canja wurin, sa'an nan da high-gudun jan karfe plating line. Bayan cire fim ɗin busassun, za a iya danna saman saman farantin karfe na waya a babban zafin jiki zuwa fim mai tauri. Sa'an nan cire bakin karfe farantin, za ka iya samun surface na lebur kewaye saka kewaye allon. Ana iya biye da shi ta hanyar hakowa da sanya ramuka don samun haɗin haɗin kai.

CC - 4 jan karfecomplexer4; Edelectro-deposited photoresist ne a total ƙari hanya ɓullo da American PCK kamfanin a kan musamman tagulla-free substrate (duba musamman labarin a kan 47th batu na da'irar bayanai mujallar don cikakken bayani).Electric haske juriya IVH (Intertitial Via Hole); MLC (Multilayer Ceramic) (na gida inter laminar ta rami); Ƙananan farantin PID (Photo imagible Dielectric) yumbu multilayer allon allon; PTF (kafofin watsa labaru masu daukar hoto) Polymer lokacin kauri fim kewaye (tare da kauri fim manna takardar da aka buga kewaye) SLC (Surface Laminar Circuits); Layin rufin saman wani sabon fasaha ne da dakin gwaje-gwaje na IBM Yasu, Japan ya buga a watan Yuni 1993. Layin haɗin kai ne da yawa tare da labule mai launin kore da kuma jan ƙarfe a waje na farantin mai gefe biyu, wanda ke kawar da buƙatar buƙata. hakowa da saka ramuka akan farantin.