A cikin ƙirar pcb, sau da yawa muna mamakin ko ya kamata a rufe saman pcb da jan karfe? Wannan a zahiri ya dogara da halin da ake ciki, da farko muna bukatar mu fahimci abũbuwan amfãni da rashin amfani na surface jan karfe.

Da farko bari mu dubi fa'idodin jan karfe:

1. Tagulla na jan karfe na iya samar da ƙarin kariya ta kariya da kuma hana amo don siginar ciki;
2. Zai iya inganta ƙarfin zubar da zafi na pcb
3. A cikin tsarin samar da PCB, ajiye adadin mai lalata;
4. A guji PCB warping nakasar da PCB ke haifarwa akan sake kwarara damuwa wanda rashin daidaituwar foil na jan karfe ya haifar.

Hakanan madaidaicin rufin saman jan ƙarfe yana da rashin lahani:

1, jirgin saman da aka lullube da tagulla zai rabu da abubuwan da ke sama da kuma layin sigina a wargaje, idan akwai foil ɗin tagulla mara kyau (musamman ma baƙin ƙarfe mai tsayi mai tsayi), zai zama eriya, yana haifar da matsalolin EMI;

Don irin wannan fata ta tagulla za mu iya tono ta hanyar aikin software

2.Idan an rufe fil ɗin da aka haɗa da jan karfe kuma an haɗa shi gaba ɗaya, zai haifar da asarar zafi da sauri, yana haifar da matsaloli a walda da gyaran walda, don haka yawanci muna amfani da hanyar kwanciya ta jan ƙarfe na haɗin giciye don abubuwan facin.

Don haka, nazarin ko an rufe saman da tagulla yana da sakamako masu zuwa:

1, PCB zane na biyu yadudduka na jirgin, jan karfe shafi yana da matukar muhimmanci, kullum a cikin kasa bene, saman Layer na babban na'urar da tafiya da wutar lantarki line da sigina line.
2, don babban da'irar impedance, da'irar analog (analog-to-digital hira da'irar, yanayin sauya yanayin samar da wutar lantarki), murfin jan ƙarfe yana da kyakkyawan aiki.
3.For Multi-Layer board high-speed digital circuits tare da cikakken samar da wutar lantarki da kuma ƙasa jirgin sama, lura cewa wannan yana nufin high-gudun dijital da'irori, da kuma jan karfe rufi a cikin m Layer ba zai kawo babban amfani.
4.For da yin amfani da Multi-Layer jirgin dijital kewaye, ciki Layer yana da cikakken samar da wutar lantarki, ƙasa jirgin sama, jan karfe shafi a cikin surface ba zai iya muhimmanci rage crosstalk, amma kuma kusa da jan karfe zai canza impedance na microstrip watsa line, discontinuous jan karfe zai kuma haifar da wani mummunan tasiri a kan watsa line impedance katsewa.
5.Don allunan multilayer, inda nisa tsakanin layin microstrip da jirgin sama mai tunani shine <10mil, hanyar dawowar siginar an zaɓi kai tsaye zuwa jirgin sama wanda ke ƙasa da layin siginar, maimakon takaddar jan ƙarfe da ke kewaye, saboda ƙarancin ƙarancinsa. Don faranti mai Layer biyu tare da tazarar mil 60 tsakanin layin sigina da jirgin sama mai tunani, cikakken kundi na jan karfe tare da duk hanyar layin sigina na iya rage hayaniya sosai.
6.For Multi-Layer allon, idan akwai karin surface na'urorin da wayoyi, kada ku yi amfani da jan karfe don kauce wa wuce kima karye jan karfe. Idan surface aka gyara da high-gudun sigina ne kasa, da jirgin ne in mun gwada da fanko, domin PCB aiki bukatun, za ka iya zabar a sa jan karfe a kan surface, amma kula da PCB zane tsakanin jan karfe da high-gudun sigina line akalla 4W ko fiye, don kauce wa canza halayyar impedance na siginar line.