Bugawa allon da'ira ya ƙunshi nau'ikan nau'ikan aikin aiki, kamar siginar siginar, Layer na kariya, Layer na siliki, Layer na ciki, Multi- layers.

An gabatar da hukumar a takaice kamar haka:

(1) Layer na sigina: galibi ana amfani dashi don sanya abubuwan haɗin gwiwa ko wayoyi. Protel DXP yawanci ya ƙunshi yadudduka na matsakaici 30, wato Mid Layer1~Mid Layer30. Ana amfani da Layer na tsakiya don tsara layin siginar, kuma ana amfani da saman saman da Layer na ƙasa don sanya abubuwan da aka gyara ko murfin jan karfe.

Layer na kariya: galibi ana amfani da shi don tabbatar da cewa allon kewayawa ba ya buƙatar a rufe shi da tin, don tabbatar da amincin aikin hukumar. Babban Manna da Manna na ƙasa sune saman saman da Layer na ƙasa bi da bi. Babban Solder da Bottom Solder bi da bi sune kariyar kariya ta Solder da Layer kariya ta ƙasa.

Layer bugu na allo: galibi ana amfani da su don bugawa akan abubuwan da suka shafi allon kewayawa serial number, lambar samarwa, sunan kamfani, da sauransu.

Layer na ciki: galibi ana amfani dashi azaman siginar siginar sigina, Protel DXP ya ƙunshi jimlar yadudduka na ciki 16.

Sauran yadudduka: galibi gami da nau'ikan yadudduka guda 4.

Jagorar Dillali: galibi ana amfani da su don wuraren hakowa a kan bugu na allo.

Tsayawa Layer: galibi ana amfani dashi don zana iyakar lantarki na allon kewayawa.

Drill Drawing: galibi ana amfani dashi don saita siffar Drill.

Multi-Layer: galibi ana amfani dashi don saita Multi-Layer.