(1) Layi
Gabaɗaya, faɗin layin siginar shine 0.3mm (mil 12), faɗin layin wutar lantarki shine 0.77mm (30mil) ko 1.27mm (50mil); nisa tsakanin layi da layi da kushin ya fi ko daidai da 0.33mm (13mil) ). A aikace-aikace masu amfani, ƙara nisa lokacin da yanayi ya yarda;
Lokacin da yawan wayoyi ya yi girma, ana iya la'akari da layi biyu (amma ba a ba da shawarar ba) don amfani da fil na IC. Faɗin layin shine 0.254mm (mil 10), kuma tazarar layin baya ƙasa da 0.254mm (mil 10). A ƙarƙashin yanayi na musamman, lokacin da fitilun na'urar suka yi yawa kuma faɗin ya kasance kunkuntar, za a iya rage faɗin layin da tazarar layi yadda ya kamata.
(2) Tafiya (PAD)
Abubuwan da ake buƙata don pads (PAD) da ramukan canji (VIA) sune: diamita na diski ya fi diamita na rami ta 0.6mm; misali, janar-manufa fil resistors, capacitors, da hadedde da'irori, da dai sauransu, amfani da faifai / girman girman 1.6mm/0.8 mm (63mil/32mil), soket, fil da diodes 1N4007, da dai sauransu, dauki 1.8mm/ 1.0mm (71mil/39mil). A cikin aikace-aikace na ainihi, ya kamata a ƙayyade bisa ga girman ainihin ɓangaren. Idan yanayi ya ba da izini, ana iya ƙara girman kushin da kyau;
Furen da aka ɗora abubuwan hawa da aka ƙera akan PCB yakamata ya zama kusan 0.2 ~ 0.4mm (8-16mil) ya fi girman ainihin girman fil ɗin.
(3) Ta hanyar (VIA)
Gabaɗaya 1.27mm/0.7mm (50mil/28mil);
Lokacin da yawan wayoyi ya yi girma, za a iya rage girman ta ta yadda ya kamata, amma bai kamata ya zama ƙanƙanta ba. Yi la'akari da amfani da 1.0mm/0.6mm (40mil/24mil).

(4) Bukatun Pitch don pads, Lines, da vias
PAD da VIA: ≥ 0.3mm (mil 12)
PAD da PAD: ≥ 0.3mm (mil 12)
PAD da TRACK: ≥ 0.3mm (mil 12)
TRACK da KYAUTA: ≥ 0.3mm (mil 12)
A mafi girma yawa:
PAD da VIA: ≥ 0.254mm (mil 10)
PAD da PAD: ≥ 0.254mm (mil 10)
PAD da TRACK: ≥ 0.254mm (mil 10)
TRACK da TRACK: ≥ 0.254mm (mil 10)