PCB farantin percolation faruwa a lokacin bushe fim plating

Dalilin plating, yana nuna cewa busassun fim ɗin da haɗin ginin ƙarfe na jan ƙarfe ba su da ƙarfi, don haka bayani mai zurfi mai zurfi, wanda ya haifar da ɓangaren "mara kyau" na suturar sutura, yawancin masana'antun PCB suna haifar da waɗannan dalilai. :

1. Ƙarfin watsawa mai girma ko ƙasa

A karkashin hasken ultraviolet, photoinitiator, wanda ke shayar da makamashin haske, ya rushe cikin free radicals don fara photopolymerization na monomers, samar da kwayoyin jikin da ba su iya narkewa a cikin maganin alkaline.
Ƙarƙashin bayyanar, saboda rashin cikaccen polymerization, a lokacin tsarin ci gaba, kumburi da laushi na fim, wanda ya haifar da layin da ba a sani ba har ma da fim din fim, wanda ya haifar da mummunar haɗuwa da fim da jan karfe;
Idan bayyanar ta yi yawa, zai haifar da matsalolin ci gaba, amma kuma a cikin tsarin lantarki zai haifar da bawo, samuwar plating.
Don haka yana da mahimmanci a sarrafa makamashin fallasa.

2. Babban ko ƙananan matsa lamba na fim

Lokacin da matsa lamba na fim ya yi ƙasa sosai, fuskar fim ɗin na iya zama marar daidaituwa ko rata tsakanin fim ɗin busasshen da farantin tagulla bazai dace da buƙatun ƙarfin ɗauri ba;
Idan fim din matsa lamba ya yi yawa, sauran ƙarfi da maras tabbas aka gyara na lalata juriya Layer da yawa maras tabbas, sakamakon da bushe fim zama gaggautsa, electroplating girgiza zai zama peeling.

3. Babban ko ƙananan zafin jiki na fim

Idan fim ɗin zafin jiki ya yi ƙasa sosai, saboda fim ɗin juriya na lalata ba zai iya zama cikakke mai laushi da kwararar da ya dace ba, wanda ke haifar da fim ɗin bushewa da mannewa na laminate na jan ƙarfe ba shi da kyau;
Idan yawan zafin jiki ya yi yawa saboda m evaporation na sauran ƙarfi da sauran maras tabbas abubuwa a cikin lalata juriya kumfa, da bushe fim ya zama gaggautsa, a cikin electroplating buga samuwar warping kwasfa, sakamakon percolation.