Halayen asali na allon da'irar da aka buga sun dogara ne akan aikin katako na substrate.Don inganta aikin fasaha na allon da'irar da aka buga, dole ne a fara inganta aikin da'irar da'ira da aka buga.Domin biyan buƙatun ci gaban da'irar da aka buga, sabbin abubuwa daban-daban ana haɓakawa da amfani da su a hankali.

A cikin 'yan shekarun nan, kasuwar PCB ta mayar da hankalinta daga kwamfutoci zuwa sadarwa, gami da tashoshin tushe, sabar, da tashoshi na wayar hannu.Na'urorin sadarwar tafi-da-gidanka da wayoyi ke wakilta sun kori PCBs zuwa mafi girman yawa, bakin ciki, da babban aiki.Fasahar da'irar da aka buga ba ta rabu da kayan da ake buƙata, wanda kuma ya haɗa da buƙatun fasaha na abubuwan PCB.Abubuwan da suka dace na kayan aikin ƙasa an tsara su a cikin wani labari na musamman don ma'anar masana'antu.

1 Buƙatar babban yawa da layin layi

1.1 Buƙatar foil na jan karfe

PCBs duk suna haɓaka zuwa ga haɓaka mai girma da ci gaban layi, kuma allon HDI sun shahara musamman.Shekaru goma da suka gabata, IPC ta ayyana allon HDI azaman faɗin layi / tazarar layi (L/S) na 0.1mm/0.1mm da ƙasa.Yanzu masana'antar m cimma wani al'ada L / S na 60μm, da kuma wani ci-gaba L / S na 40μm.Sigar 2013 ta Japan na bayanan taswirar fasahar shigarwa shine cewa a cikin 2014, L/S na al'ada na hukumar HDI ya kasance 50μm, L/S na ci gaba ya kasance 35μm, L/S da aka samar da gwaji ya kasance 20μm.

PCB kewaye juna samuwar, da gargajiya sinadaran etching tsari (Subtractive hanya) bayan photoimaging a kan tagulla tsare substrate, m iyaka subtractive hanya don yin m Lines ne game da 30μm, da bakin ciki jan karfe tsare (9 ~ 12μm) substrate ake bukata.Saboda tsadar siraren CCL ɗin tagulla da kuma lahani da yawa a cikin lamination na bakin ciki na tagulla, masana'antu da yawa suna samar da foil na tagulla 18μm sannan su yi amfani da etching don bakin ciki Layer na tagulla yayin samarwa.Wannan hanyar tana da matakai da yawa, sarrafa kauri mai wahala, da tsada mai yawa.Zai fi kyau a yi amfani da foil na jan karfe na bakin ciki.Bugu da kari, lokacin da PCB kewaye L/S ya kasa da 20μm, bakin ciki na jan karfe yana da wuyar iyawa gabaɗaya.Yana buƙatar foil na jan ƙarfe mai bakin ciki (3 ~ 5μm) da kuma ɗan ƙaramin bakin ƙarfe mai bakin ciki wanda aka haɗe zuwa mai ɗaukar kaya.

Baya ga ɓangarorin tagulla masu sirara, layukan masu kyau na yanzu suna buƙatar ƙarancin ƙazanta a saman bangon tagulla.Gabaɗaya, don haɓaka ƙarfin haɗin gwiwa tsakanin foil ɗin tagulla da ƙasa kuma don tabbatar da ƙarfin kwasfa na madubi, Layer ɗin bangon jan ƙarfe yana da ƙarfi.Ƙaunar foil ɗin jan ƙarfe na al'ada ya fi 5μm.Shigar kololuwar tagulla a cikin mashin ɗin yana inganta juriya na peeling, amma don sarrafa daidaiton waya a lokacin etching na layi, yana da sauƙi a sami kololuwar ƙwanƙolin abin da ya rage, yana haifar da gajeriyar kewayawa tsakanin layin ko rage rufin. , wanda yake da mahimmanci ga layi mai kyau.Layin yana da mahimmanci musamman.Don haka, ana buƙatar foils na jan karfe tare da ƙarancin ƙarancin (kasa da μm 3 μm) har ma da ƙananan ƙarancin (1.5 μm).

1.2 Bukatar laminated dielectric zanen gado

Siffar fasaha ta hukumar HDI ita ce tsarin ginawa (BuildingUpProcess), foil ɗin jan ƙarfe mai rufi da aka saba amfani da shi (RCC), ko lamintaccen Layer na zanen gilashin epoxy mai warkewa da foil na jan karfe yana da wahala a cimma layi mai kyau.A halin yanzu, ana son yin amfani da hanyar Semi-additive (SAP) ko ingantacciyar hanyar da aka tsara ta (MSAP), wato, ana amfani da fim ɗin insulating dielectric don tarawa, sannan a yi amfani da platin jan ƙarfe mara igiyar ruwa don samar da tagulla. shugaba Layer.Domin Layer na jan karfe yana da sirara sosai, yana da sauƙi don samar da layi mai kyau.

Ɗaya daga cikin mahimman abubuwan da ake amfani da su na Semi-kariri shine kayan laminated dielectric.Don saduwa da buƙatun manyan layukan lafiya masu yawa, kayan da aka lanƙwara suna gabatar da buƙatun kayan lantarki na dielectric, rufi, juriya mai zafi, ƙarfin haɗin gwiwa, da dai sauransu, da kuma daidaita tsarin daidaitawa na hukumar HDI.A halin yanzu, na kasa da kasa HDI laminated kafofin watsa labarai kayan ne yafi ABF / GX jerin kayayyakin na Japan Ajinomoto Company, wanda amfani da epoxy guduro tare da daban-daban curing jamiái don ƙara inorganic foda don inganta rigidity na abu da kuma rage CTE, da gilashin fiber zane. Hakanan ana amfani dashi don ƙara tsauri..Har ila yau, akwai irin wannan kayan laminate na bakin ciki na Sekisui Chemical Company na Japan, da Cibiyar Nazarin Fasahar Masana'antu ta Taiwan ita ma ta haɓaka irin waɗannan kayan.Abubuwan ABF kuma ana ci gaba da haɓakawa da haɓakawa.Sabuwar ƙarni na kayan da aka lanƙwara musamman yana buƙatar ƙarancin ƙarancin ƙasa, ƙarancin haɓakar zafi, ƙarancin ƙarancin wutar lantarki, da ƙarfi mai ƙarfi.

A cikin marufi na semiconductor na duniya, IC packaging substrates sun maye gurbin yumbura mai yumbu tare da kayan aikin halitta.Filin juzu'i na juzu'i (FC) marufi yana ƙara ƙarami.Yanzu nisa na yau da kullun / tazarar layin shine 15μm, kuma zai zama bakin ciki a nan gaba.Ayyukan dillalai da yawa suna buƙatar ƙananan kaddarorin dielectric, ƙarancin haɓakar haɓakar thermal da babban juriya mai zafi, da kuma bin ƙa'idodin ƙarancin farashi bisa ga cimma burin aiki.A halin yanzu, yawan samar da ingantattun da'irori yana ɗaukar tsarin MSPA na lanƙwasa rufi da siraren jan karfe.Yi amfani da hanyar SAP don kera ƙirar kewaye tare da L/S ƙasa da 10μm.

Lokacin da PCBs suka zama mai yawa kuma sun yi ƙaranci, fasahar hukumar HDI ta samo asali daga laminates masu ƙunshe da asali zuwa laminates interconnection Anylayer maras tushe (Anylayer).Duk wani haɗin haɗin haɗin gwiwa tare da allunan HDI tare da aiki iri ɗaya sun fi allunan HDI masu ɗauke da asali.Za a iya rage yanki da kauri da kusan 25%.Waɗannan dole ne su yi amfani da sirara kuma su kula da kyawawan kaddarorin lantarki na Layer dielectric.

2 Babban mita da buƙatun saurin gudu

Fasahar sadarwa ta lantarki tana kama daga waya zuwa mara waya, daga ƙananan mitoci da ƙananan gudu zuwa mitar mitoci da babban gudu.Ayyukan wayar hannu na yanzu sun shiga 4G kuma za su matsa zuwa 5G, wato, saurin watsawa da ƙarfin watsawa.Zuwan zamanin sarrafa girgije na duniya ya ninka yawan zirga-zirgar bayanai, kuma babban mitoci da na'urorin sadarwa masu saurin gaske lamari ne da babu makawa.PCB ya dace da watsawa mai girma da sauri.Baya ga rage tsangwama da asarar sigina a ƙirar kewayawa, kiyaye amincin sigina, da kiyaye masana'antar PCB don saduwa da buƙatun ƙira, yana da mahimmanci a sami ƙaramin aiki mai girma.

Domin magance matsalar karuwar saurin PCB da amincin sigina, injiniyoyin ƙira sun fi mayar da hankali kan kaddarorin asarar siginar lantarki.Mahimman abubuwan da za a zabi na substrate sune dielectric akai-akai (Dk) da asarar dielectric (Df).Lokacin da Dk ya kasa 4 da Df0.010, shi ne matsakaicin Dk/Df laminate, idan Dk ya kasa 3.7 kuma Df0.005 ya kasa, yana da ƙananan Dk/Df grade, yanzu akwai nau'o'in substrates. don shiga kasuwa don zaɓar daga.

A halin yanzu, abubuwan da aka fi amfani da su a babban mitar da'ira sune manyan resins na tushen fluorine, resin polyphenylene ether (PPO ko PPE) da kuma resin epoxy da aka gyara.Abubuwan dielectric tushen fluorine, irin su polytetrafluoroethylene (PTFE), suna da mafi ƙarancin kaddarorin dielectric kuma yawanci ana amfani da su sama da 5 GHz.Hakanan akwai gyare-gyaren epoxy FR-4 ko PPO substrates.

Bugu da ƙari ga resin da aka ambata a sama da sauran kayan rufewa, ƙarancin saman (profile) na mai sarrafa jan ƙarfe shima muhimmin abu ne da ke shafar asarar watsa siginar, wanda tasirin fata ya shafa (SkinEffect).Tasirin fata shine shigar da lantarki na lantarki da aka samar a cikin waya yayin watsa siginar mita mai girma, kuma inductance yana da girma a tsakiyar sashin waya, ta yadda na yanzu ko siginar ya kasance yana mai da hankali kan saman wayar.Ƙaƙƙarfan yanayin mai gudanarwa yana rinjayar asarar siginar watsawa, kuma asarar santsi yana da ƙananan.

A daidai wannan mita, mafi girma da rashin ƙarfi na jan karfe, mafi girma asarar sigina.Sabili da haka, a cikin samarwa na ainihi, muna ƙoƙarin sarrafa ƙaƙƙarfan kauri na jan ƙarfe kamar yadda zai yiwu.Rashin ƙarfi yana da ƙanƙanta kamar yadda zai yiwu ba tare da rinjayar ƙarfin haɗin gwiwa ba.Musamman ga sigina a cikin kewayon sama da 10 GHz.A 10GHz, rashin ƙarfi na tagulla yana buƙatar zama ƙasa da μm, kuma yana da kyau a yi amfani da babban tsari na jan ƙarfe (ƙananan saman 0.04μm).Har ila yau, ana buƙatar haɗewar fuskar tagulla tare da ingantaccen magani na iskar shaka da tsarin guduro na haɗin gwiwa.A nan gaba, za a yi wani resin-rubutun tagulla ba tare da kusan babu shaci, wanda zai iya samun mafi girma kwasfa ƙarfi da kuma ba zai shafar dielectric asarar.