Lokuttan da suka dace: An kiyasta cewa kusan kashi 25% -30% na PCBs a halin yanzu suna amfani da tsarin OSP, kuma adadin yana ƙaruwa (wataƙila tsarin OSP ya zarce tin ɗin feshi kuma ya fara girma). Ana iya amfani da tsarin OSP akan ƙananan PCBs ko manyan PCBs masu fasaha, kamar su PCBs TV mai gefe guda da allunan marufi mai yawa. Ga BGA, akwai kuma da yawaOSPaikace-aikace. Idan PCB ba shi da buƙatun aikin haɗin saman ƙasa ko ƙuntatawa lokacin ajiya, tsarin OSP zai zama mafi kyawun tsarin jiyya na saman.

Babban fa'ida: Yana da duk fa'idodin walda na katako na jan ƙarfe, kuma allon da ya ƙare (watanni uku) shima yana iya sake dawowa, amma yawanci sau ɗaya kawai.

Rashin hasara: mai sauƙi ga acid da zafi. Lokacin da aka yi amfani da shi don siyarwar sake kwarara na biyu, yana buƙatar kammala shi cikin wani ɗan lokaci. Yawancin lokaci, tasirin sake kwarara na biyu zai zama mara kyau. Idan lokacin ajiyar ya wuce watanni uku, dole ne a sake farfado da shi. Yi amfani a cikin sa'o'i 24 bayan buɗe kunshin. OSP Layer ne mai rufewa, don haka dole ne a buga wurin gwajin tare da manna mai siyarwa don cire ainihin Layer OSP don tuntuɓar maɓallin fil don gwajin lantarki.

Hanyar: A kan tsabtataccen dandali na jan karfe, Layer na fim din kwayoyin halitta yana girma ta hanyar sinadarai. Wannan fim yana da anti-oxidation, thermal shock, danshi juriya, kuma ana amfani dashi don kare saman jan karfe daga tsatsa (oxidation ko vulcanization, da dai sauransu) a cikin yanayin al'ada; a lokaci guda, dole ne a taimaka masa cikin sauƙi a yanayin zafi mai zafi na walda. Ana cire ruwa da sauri don siyarwa;