Tsarin etching board na PCB, wanda ke amfani da tsarin etching na gargajiya na gargajiya don lalata wuraren da ba su da kariya. Irin kamar tono rami, hanya mai sauƙi amma mara inganci.
A cikin tsarin etching, kuma an raba shi zuwa tsarin fim mai kyau da kuma tsarin fim mara kyau. Tsarin fina-finai mai kyau yana amfani da tin kafaffen don kare kewaye, kuma tsarin fim mara kyau yana amfani da fim mai bushe ko rigar fim don kare kewaye. Gefuna na layi ko pads suna kuskure tare da na gargajiyaetchinghanyoyin. Duk lokacin da aka ƙara layin da 0.0254mm, gefen zai kasance karkata zuwa wani matsayi. Don tabbatar da isasshen tazara, ana auna tazarar waya koyaushe a wuri mafi kusa na kowace waya da aka riga aka saita.
Yana ɗaukar lokaci mai yawa don ƙaddamar da oza na jan ƙarfe don ƙirƙirar gibi mai girma a cikin marancin waya. Wannan shi ake kira da etch factor, kuma ba tare da masana'anta sun ba da cikakken jerin mafi ƙarancin gibi a kowace oza na jan karfe ba, koyi ma'aunin etch factor. Yana da matukar mahimmanci a ƙididdige mafi ƙarancin ƙarfin kowane oza na jan karfe. Fatar etch kuma tana shafar ramin zobe na masana'anta. Girman ramin zobe na gargajiya shine 0.0762mm hoto + 0.0762mm hakowa + 0.0762 stacking, don jimlar 0.2286. Etch, ko etch factor, ɗaya ne daga cikin manyan sharuɗɗa huɗu waɗanda ke ƙayyadad da matakin tsari.
Don hana shingen kariya daga fadowa da biyan buƙatun tazarar tsari na etching sinadarai, etching na gargajiya ya nuna cewa mafi ƙarancin tazara tsakanin wayoyi bai kamata ya zama ƙasa da 0.127mm ba. Idan akai la'akari da abin da ke faruwa na lalata na ciki da kuma raguwa a yayin aiwatar da etching, ya kamata a ƙara nisa na waya. An ƙayyade wannan ƙimar ta kauri na wannan Layer. Mafi kauri Layer Layer na jan karfe, da tsawon da ake dauka don ƙulla jan ƙarfe tsakanin wayoyi da kuma ƙarƙashin murfin kariya. A sama, akwai bayanai guda biyu waɗanda dole ne a yi la'akari da su don etching sinadarai: ma'anar etch - adadin jan ƙarfe a kowace oza; da mafi ƙarancin rata ko faɗin farar kowane oza na jan karfe.