PCB aluminum substrate yana da yawa sunayen, aluminum cladding, aluminum PCB, karfe clad buga kewaye hukumar (MPCCB), thermally conductive PCB, da dai sauransu A amfani da PCB aluminum substrate shi ne cewa zafi dissipation ne muhimmanci fiye da misali FR-4 tsarin. da dielectric amfani yawanci Yana da 5 zuwa 10 sau da thermal conductivity na al'ada epoxy gilashin, da zafi canja wurin index na daya bisa goma na kauri ne mafi inganci fiye da gargajiya m PCB. Bari mu fahimci nau'in PCB aluminum substrates a kasa.

1. M aluminum substrate

Ɗayan sabon ci gaba a cikin kayan IMS shine na'urorin lantarki masu sassauƙa. Wadannan kayan zasu iya samar da ingantaccen rufin lantarki, sassauƙa da haɓakar thermal. Lokacin da aka yi amfani da kayan aluminium masu sassauƙa kamar 5754 ko makamancin haka, ana iya ƙirƙirar samfuran don cimma siffofi da kusurwoyi daban-daban, waɗanda zasu iya kawar da na'urorin gyara tsada, igiyoyi da masu haɗawa. Ko da yake waɗannan kayan suna da sauƙi, an tsara su don lanƙwasa a wuri kuma su kasance a wurin.

2. Mixed aluminum substrate aluminum
A cikin tsarin "matasan" IMS, "sub-components" na abubuwan da ba thermal ba ana sarrafa su da kansu, sa'an nan kuma Amitron Hybrid IMS PCBs an haɗa su da aluminum substrate tare da kayan thermal. Tsarin da aka fi sani da shi shine 2-Layer ko 4-Layer subsembly da aka yi da FR-4 na gargajiya, wanda za'a iya haɗa shi da ma'aunin aluminum tare da thermoelectric don taimakawa wajen watsar da zafi, ƙara ƙarfin hali, da aiki azaman garkuwa. Sauran fa'idodin sun haɗa da:
1. Ƙananan farashi fiye da duk kayan aikin thermal.
2. Samar da mafi kyawun aikin thermal fiye da daidaitattun samfuran FR-4.
3. Za a iya kawar da tsangwama mai tsada da kuma matakan haɗuwa masu dangantaka.
4. Ana iya amfani dashi a aikace-aikacen RF waɗanda ke buƙatar halayen asarar RF na PTFE surface Layer.
5. Yi amfani da kayan windows a cikin aluminum don ɗaukar abubuwan da aka haɗa ta cikin rami, wanda ke ba da damar masu haɗin kai da igiyoyi su wuce mai haɗawa ta hanyar substrate yayin walda sasanninta don ƙirƙirar hatimi ba tare da buƙatar gaskets na musamman ko wasu adaftan masu tsada ba.

Uku, multilayer aluminum substrate
A cikin babbar kasuwar samar da wutar lantarki, multilayer IMS PCBs an yi su ne da na'urori masu sarrafa zafin jiki da yawa. Waɗannan sifofin suna da ɗaya ko fiye da yadudduka na da'irori da aka binne a cikin dielectric, kuma makafi ta hanyar amfani da su azaman hanyoyin zafi ko hanyoyin sigina. Kodayake zane-zane guda ɗaya sun fi tsada kuma ba su da tasiri don canja wurin zafi, suna ba da bayani mai sauƙi da inganci don ƙarin ƙira mai rikitarwa.
Hudu, ta-rami aluminum substrate
A cikin mafi rikitarwa tsarin, Layer na aluminum zai iya samar da "core" na multilayer thermal tsarin. Kafin lamination, aluminum yana da wutar lantarki kuma an cika shi da dielectric a gaba. Ana iya lakafta kayan zafi ko ƙananan sassa zuwa ɓangarorin aluminium ta amfani da kayan manne mai zafi. Da zarar an lanƙwasa, taron da aka gama yayi kama da al'adar al'adar al'adar al'ada ta hakowa. Plated ta cikin ramukan wuce ta gibba a cikin aluminum don kula da lantarki rufi. A madadin, tushen jan ƙarfe na iya ba da damar haɗin lantarki kai tsaye da insulating vias.