Multilayer PCBan fi haɗa da foil na jan karfe, prepreg, da core allo. Akwai nau'ikan tsarin lamation guda biyu, wato, tsarin lamation na tagulla da Core kwamitin kuma tsarin lamation na cibiyar da Core. An fi son tsarin lamination na tagulla da core board, kuma ana iya amfani da tsarin lamination na ainihin allon don faranti na musamman (kamar Rogess44350, da sauransu) allunan Layer Layer da allunan tsarin matasan.

1.Design bukatun don latsa tsarin Domin ya rage warpage na PCB, da PCB lamination tsarin kamata hadu da simmetry bukatun, wato, kauri daga cikin tagulla tsare, da irin da kauri na dielectric Layer, da juna rarraba irin. (Layin da'irar, jirgin sama), lamination, da dai sauransu dangane da PCB a tsaye Centrosymmetric,

2.Conductor tagulla kauri

(1) Kaurin tagulla da aka nuna akan zanen shine kaurin tagulla da aka gama, wato kaurin kaurin tagulla na waje shine kauri na foil ɗin tagulla na ƙasa tare da kauri na Layering electroplating, da kauri. na ciki Layer na jan karfe ne kauri daga ciki Layer na kasa tagulla foil. A kan zanen, kauri na jan karfe na waje ana yiwa alama alama a matsayin "kauri mai kauri + plating, kuma kauri na jan karfe na ciki ana yiwa alama "kauri mai kauri".

(2) Tsare-tsare don aikace-aikacen 2OZ da sama mai kauri na ƙasa jan ƙarfe Dole ne a yi amfani da su daidai gwargwado a cikin tarin.

A guji sanya su a kan yadudduka na L2 da Ln-2 gwargwadon yuwuwa, wato, manyan yadudduka na sama da na ƙasa, don guje wa saman PCB marasa daidaituwa da murƙushe.

3. Bukatun don latsa tsarin

Tsarin lamination shine babban tsari a masana'antar PCB. Yawan adadin laminations, mafi muni da daidaito na daidaita ramuka da faifai, kuma mafi girman nakasar PCB, musamman lokacin da aka lanƙwasa ta asymmetrically. Lamination yana da buƙatun don tarawa, kamar kaurin jan ƙarfe da kaurin dielectric dole ne ya dace.