Menene ma'anar wannan ga masana'antar PCB mai sauri?
Da farko dai, lokacin da ƙira da kuma gina PCB macks, kayan abu dole ne a fita. 5G PCBS dole ne su hadu da duk bayanan bayanai yayin ɗaukar hoto da karɓar haɗin lantarki, yana samar da iko don takamaiman ayyuka. Bugu da kari, masanin PCB na PCB zai buƙaci a magance shi, kamar kiyaye ingancin sigina, gudanarwa mai ƙarfi (EMI) tsakanin bayanai da allon.
Gauraye sigina na karbar zane
A yau, yawancin tsarin suna ma'amala ne da 4g da 3GC. Wannan yana nuna cewa watsa ta baya da karɓar kewayon mita shine 600 mhz zuwa 5.925 GHZ, da kuma tashar bandwidth 20, ko 200 KHZ don tsarin IOT. A lokacin da ƙira PCBS don tsarin sadarwa na 5G, waɗannan abubuwan haɗin zasu buƙaci mitar millimita na mil 28, ko ma 77 GHZ, ya danganta da aikace-aikacen. Don tashoshin bandwidth, 5G tsarin zai aiwatar da 100mhz a ƙasa 6mhz da 400mhz sama da 6GHZ.
Wadannan manyan hanyoyin saurin zasu buƙaci amfani da kayan da suka dace a cikin PCB don daidaitawa kuma suna watsa ƙananan sigina ba tare da asarar siginar da EMI ba. Wata matsalar ita ce cewa na'urorin za su zama masu wuta, mafi ɗauri, kuma karami. Saboda tsananin nauyi, girman girman mawuyacin aiki, kayan PCB dole ne ya zama sassauƙa da sauƙi don saukar da kayan aikin microelcronic akan jirgin.
Don fasahar PCB na tagulla, na bakin ciki na mashahuri da kuma stercrit na sarrafawa dole ne a bi. Ana amfani da tsarin da etching na gargajiya na gargajiya don 3G da 4g mai gudu-sauri zuwa tsarin da aka gyara. Wadannan ingantattun hanyoyin samar da tsararre zasu samar da ingantattun halaye da bangon bango.
Hakanan ana sake fasalin tushe. Kamfanoni da kamfanoni ke bugawa suna karatun kayan tare da mawuyacin aiki akai-akai har zuwa 3, saboda daidaitattun kayan don kwastomomi na kwararru yawanci 3.5 zuwa 5.5. Fiber Gler Ferber Relid, Rage asarar asarar abu da low Taron jan karfe zai zama zabi na sigina na dijital, ta haka yana hana asarar sigina da inganta amincin sigina.
Matsalar Emi EMI
EMI, crosstalk da parasitic kyamare sune manyan matsalolin allon da'ira. Don magance crosstalk da EMI saboda analog da dijital m a kan allo, an bada shawarar sosai don raba burbushi. Amfani da allon multilayeright zai samar da ingantacciyar muhimmiyar don tantance siginar dawowar Analog da kuma alamun dawowa da DIGHTIONS suna rarrabewa. Dingara kariya da tacewa lokacin sanya abubuwan haɗin ya kamata su kuma rage adadin na halitta emo a kan PCB.
Domin tabbatar da cewa babu lahani da kuma mawuyacin da'irori ko kuma buɗe tsarin dubawa a kan manyan ayyuka, za a yi amfani da tsarin bincike ta atomatik don bincika abubuwan mai ba da izini da auna su. Wadannan nahiyoyin zasu taimaka wajan masana'antun PCB don neman haɗarin alamun lalata.
Ƙalubalen ƙayyadaddun ƙalubalen
Matsakaicin siginar siginar zai haifar da halin yanzu ta hanyar PCB don ƙirƙirar ƙarin zafi. Abubuwan PCB don kayan maye da kuma jigon yadudduka zasu buƙatar dacewa da yadda aka buƙaci babban saurin da aka buƙata daga Fasahar 5G Fasaha. Idan kayan bai isa ba, zai iya haifar da fasahar tagulla, peeling, shrinkage da warping, saboda waɗannan matsalolin zasu haifar da PCB don lalacewa.
Don magance waɗannan manyan yanayin zafi, masu masana'antun zasu buƙaci mai da hankali kan zaɓin kayan da ke magance matsalolin da ake amfani da wutar lantarki da kuma matsalolin da suka dace. Materials with higher thermal conductivity, excellent heat transfer, and consistent dielectric constant must be used to make a good PCB to provide all the 5G features required for this application.