- Menene hakowa ta baya?
Hakowa baya wani nau'i ne na musamman na hako rami mai zurfi. A cikin samar da allunan nau'i-nau'i masu yawa, irin su 12-Layer allon, muna buƙatar haɗa Layer na farko zuwa Layer na tara. Yawancin lokaci, muna yin rami ta hanyar rami (jiki guda) sannan mu nutse tagulla. Ta wannan hanyar, bene na farko yana haɗa kai tsaye zuwa bene na 12. A gaskiya ma, muna buƙatar kawai bene na farko don haɗawa zuwa bene na 9, da 10th zuwa bene na 12 saboda babu haɗin layi, kamar ginshiƙi. Wannan ginshiƙi yana rinjayar hanyar siginar kuma yana iya haifar da matsalolin sigina a cikin sadarwa sakonni.Don haka rawar jiki da m shafi (STUB a cikin masana'antu) daga baya gefe (secondary drill) .Don haka ake kira baya rawar soja, amma kullum ba rawar soja haka mai tsabta, domin m tsari zai electrolysis kashe kadan jan karfe, da rawar soja tip. kanta yana nuna.Saboda haka, mai yin PCB zai bar ƙaramin batu. Tsawon STUB na wannan STUB ana kiransa darajar B, wanda gabaɗaya yana cikin kewayon 50-150um.
2.Amfanin hakowa baya
1) rage tsangwama amo
2) inganta sigina mutunci
3) kaurin farantin gida yana raguwa
4) rage amfani da ramukan makafi da aka binne da kuma rage wahalar samar da PCB.
3. Amfani da hakowa baya
Komawa rawar sojan ba ta da wata alaƙa ko tasirin sashin ramuka, guje wa yin la'akari da watsa sigina mai sauri, watsawa, jinkiri, da sauransu, yana kawo alamar "hargitsi" bincike ya nuna cewa babban abu abubuwan da ke tasiri tsarin siginar siginar siginar siginar siginar ƙira, kayan farantin karfe, ban da abubuwan da suka haɗa da layin watsawa, masu haɗawa, guntuwar guntu, ramin jagora yana da babban tasiri akan siginar siginar.
4. Ka'idar aiki na hakowa na baya
Lokacin da allurar rawar soja tana hakowa, micro current da aka samar lokacin da allurar rawar soja ta tuntuɓar foil ɗin tagulla a saman farantin tushe zai haifar da tsayin tsayin farantin, sannan za a aiwatar da rawar jiki gwargwadon zurfin hakowa. kuma za a dakatar da rawar sojan lokacin da aka kai zurfin hakowa.
5.Back hakowa samar tsari
1) samar da PCB tare da rami na kayan aiki. Yi amfani da ramin kayan aiki don sanya PCB kuma kuyi rami;
2) electroplating da PCB bayan hako rami, da kuma rufe ramin da bushe fim kafin electroplating;
3) yin zane-zane na waje a kan PCB mai lantarki;
4) gudanar juna electroplating a kan PCB bayan forming da m juna, da kuma gudanar da bushe fim sealing na sakawa rami kafin juna electroplating;
5) a yi amfani da ramin da ake sakawa da wani rami daya yi amfani da shi don sanya mashin baya, sannan a yi amfani da na'urar yankan ramuka don mayar da ramin lantarki da ake buqatar a dawo da shi;
6) wanke baya hakowa bayan baya hakowa don cire saura yankan a baya hakowa.
6. Halayen fasaha na farantin hakowa na baya
1) Tsari mai ƙarfi (mafi yawa)
2) Yawancin lokaci yana 8 - 50 yadudduka
3) Board kauri: fiye da 2.5mm
4) Kauri diamita ne in mun gwada da girma
5) Girman allo yana da girman gaske
6) Matsakaicin diamita na rami na farko shine> = 0.3mm
7) Ƙimar waje ƙasa, ƙarin ƙirar murabba'i don ramin matsawa
8) Ramin baya yawanci 0.2mm ya fi girma fiye da ramin da ake buƙata
9) Haƙuri mai zurfi shine +/- 0.05mm
10) Idan rawar baya na buƙatar hakowa zuwa M Layer, kauri daga cikin matsakaici tsakanin M Layer da m-1 (na gaba Layer na M Layer) zai zama mafi ƙarancin 0.17mm
7. Babban aikace-aikacen farantin hakowa na baya
Kayan aikin sadarwa, babban uwar garken, na’urorin lantarki na likitanci, soja, sararin samaniya da sauran fagage. Kamar yadda soja da sararin samaniya masana'antu ne masu mahimmanci, Cibiyar bincike, bincike da ci gaba na soja da tsarin sararin samaniya ko kuma masana'antun PCB da ke da karfin soja da sararin samaniya. A kasar Sin, buƙatun jirgin baya ya samo asali ne daga hanyar sadarwa. masana'antu, kuma a yanzu fannin kera kayan aikin sadarwa na bunkasa sannu a hankali.