Fitattun allon da'ira da ake amfani da su a cikin na'urorin lantarki da na'urori na yau suna da abubuwan haɗin lantarki da yawa da aka ɗora. Wannan gaskiya ce mai mahimmanci, yayin da adadin kayan aikin lantarki a kan allon da'irar da aka buga yana ƙaruwa, haka ma girman allon kewayawa ke ƙaruwa. Koyaya, girman allon da'ira buga extrusion, a halin yanzu ana amfani da kunshin BGA.

Anan akwai manyan fa'idodin kunshin BGA waɗanda dole ne ku sani game da wannan batun. Don haka, duba bayanan da aka bayar a ƙasa:

1. BGA soldered kunshin tare da babban yawa

BGAs suna ɗaya daga cikin ingantattun hanyoyin magance matsalar ƙirƙirar ƙananan fakiti don ingantattun da'irori masu haɗaka da ke ɗauke da adadi mai yawa na fil. Dual in-line surface mount da fil grid array kunshe-kunshe ana samar da su ta hanyar rage ɓarna daruruwan fil tare da sarari tsakanin wadannan fil.

Yayin da ake amfani da wannan don kawo matakan yawa, wannan yana sa tsarin siyar da fil ɗin ke da wahalar sarrafawa. Wannan saboda haɗarin haɗa fil ɗin kai-zuwa-kai na bazata yana ƙaruwa yayin da sarari tsakanin fil yana raguwa. Koyaya, BGA Soldering kunshin zai iya magance wannan matsalar mafi kyau.

2. Gudanar da zafi

Ɗayan ƙarin fa'idodin fa'idodin BGA shine rage juriya na zafi tsakanin PCB da fakitin. Wannan yana ba da damar zafin da aka samar a cikin kunshin don gudana mafi kyau tare da haɗin haɗin haɗin gwiwa. Bugu da ƙari, zai kuma hana guntu daga yin zafi a hanya mafi kyau.

3. Ƙananan inductance

Da kyau, gajerun masu jagoranci na lantarki suna nufin ƙananan inductance. Inductance sifa ce da za ta iya haifar da ɓarnar sigina maras so a cikin da'irar lantarki masu sauri. Tun da BGA ya ƙunshi ɗan gajeren tazara tsakanin PCB da fakitin, yana ƙunshe da ƙananan inductance gubar, zai samar da kyakkyawan aiki don na'urorin fil.