Kunshin DIP(Dual In-line Package), wanda kuma aka sani da fasahar marufi in-line dual, yana nufin haɗaɗɗen guntuwar da'ira waɗanda aka tattara a cikin nau'i biyu na cikin layi. Adadin gabaɗaya baya wuce 100. Kunnshe DIP guntu na CPU yana da layuka biyu na fil waɗanda ke buƙatar sakawa cikin soket ɗin guntu tare da tsarin DIP. Tabbas, ana iya shigar da ita kai tsaye a cikin allon kewayawa tare da adadin ramukan solder iri ɗaya da tsari na geometric don siyarwa. Ya kamata a toshe kwakwalwan kwamfuta masu kunshe da DIP kuma a cire su daga soket ɗin guntu tare da kulawa ta musamman don guje wa lalacewa ga fil ɗin. Siffofin tsarin fakitin DIP sune: yumbu mai yawa DIP DIP, yumbu DIP DIP mai Layer-Layer, DIP firam ɗin jagora (ciki har da nau'in yumbun hatimin gilashi, nau'in tsarin marufi na filastik, nau'in yumbu ƙarancin narkewar gilashin nau'in)

Kunshin DIP yana da halaye masu zuwa:

1. Sutable for perforation waldi a kan PCB (buga kewaye hukumar), sauki aiki;

2. Matsakaicin tsakanin guntu yanki da yanki na kunshin yana da girma, don haka ƙarar kuma babba;

DIP shine fakitin filogi mafi shahara, kuma aikace-aikacen sa sun haɗa da daidaitattun dabaru na IC, ƙwaƙwalwar ajiya da da'irorin kwamfuta. Na farko 4004, 8008, 8086, 8088 da sauran CPUs duk sun yi amfani da fakitin DIP, kuma layuka biyu na fil akan su ana iya saka su cikin ramukan da ke kan motherboard ko kuma a sayar da su a kan motherboard.